US10748776B2ActiveUtilityA1
Semiconductor device including contact structure
Est. expirySep 1, 2036(~10.1 yrs left)· nominal 20-yr term from priority
H10D 64/011H10D 64/0121H10D 64/0112H10D 64/0113H10D 62/832H10D 64/62H10D 30/60H10D 64/23H10D 64/251H10D 62/83H10D 8/60H01L 29/78H01L 29/872H01L 21/28H01L 29/45H01L 29/41725H01L 29/16H01L 21/28537H01L 29/456
47
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Cited by
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References
6
Claims
Abstract
In the present invention, a contact layer formed of a material having an electron concentration of less than 1×1022 cm−3 is directly provided on a surface of a semiconductor crystal having an n-type conductivity with a band gap of 1.2 eV or less at room temperature. Consequently, the wave function penetration from the contact layer side to the semiconductor surface side is reduced. As a result, the formation of the energy barrier height·ϕB due to the Fermi level pinning phenomenon is much suppressed. It is possible to achieve the contact with a lower resistivity and with high ohmic properties.
Claims
exact text as granted — not AI-modifiedThe invention claimed is:
1. A semiconductor device comprising a contact structure in which a contact layer formed of a material having an electron concentration of less than 1×10 22 cm −3 is directly provided on a surface of a semiconductor crystal having an n-type conductivity with a band gap of 1.2 eV or less at room temperature,
wherein a donor concentration of a surface region of the semiconductor crystal is 1×10 18 cm −3 or less.
2. The semiconductor device according to claim 1 , wherein the semiconductor crystal is any one of Si, Ge, and a compound of Si and Ge (Si x Ge y ).
3. The semiconductor device according to claim 1 , wherein the semiconductor crystal is Ge, and the contact layer is formed of a material containing, as a main component, a germanide of any one of Gd, Y, Ho, Er, and Yb, or Bi.
4. The semiconductor device according to claim 1 , wherein the semiconductor crystal is Si, and the contact layer is formed of a material containing Bi as a main component.
5. The semiconductor device according to claim 1 , wherein the semiconductor device includes a metal layer on the contact layer.
6. The semiconductor device according to claim 1 , wherein the semiconductor device is an n-channel MOSFET in which the semiconductor crystal is Si or Ge.Cited by (0)
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