Substrate support with real time force and film stress control

Abstract

Embodiments disclosed herein include a substrate support having a sensor assembly, and processing chamber having the same. In one embodiment, a substrate support has a puck. The puck has a workpiece support surface and a gas hole exiting the workpiece support surface. A sensor assembly is disposed in the gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on the workpiece support surface, wherein the sensor assembly is configured to allow gas to flow past the sensor assembly when positioned in the gas hole.

What is claimed is: 
     
       1. A substrate support, comprising:
 a puck, the puck comprising:
 a workpiece support surface; and 
 a gas hole formed through the workpiece support surface; and 
 
 a sensor assembly mounted in the gas hole below the workpiece support surface and configured to detect a metric of distance to a workpiece disposed on the workpiece support surface, wherein the sensor assembly has passages that permit fluid to pass through the sensor assembly when positioned in the gas hole, and wherein the sensor assembly has a sensor housing and a sensor, the sensor housing has a split plate configured to be disposed around at least a portion of the sensor, and wherein the passages include gas passages formed in the split plate. 
 
     
     
       2. The substrate support of  claim 1 , wherein the sensor comprises:
 a sensor head aligned within +/−3 degrees from perpendicular to the workpiece support surface. 
 
     
     
       3. The substrate support of  claim 2 , wherein the sensor housing further comprises:
 a mounting head disposed below the split plate and configured to position the sensor head below the workpiece support surface, wherein the passages include gas passages formed in the mounting head. 
 
     
     
       4. The substrate support of  claim 3 , wherein the split plate comprises:
 pins interfacing with and locating the split plate in the mounting head in an orientation that aligns the gas passages formed in the mounting head with the gas passages formed in the split plate. 
 
     
     
       5. The substrate support of  claim 1 , wherein the sensor assembly is about less than about 30 mm from the top of the workpiece support surface. 
     
     
       6. The substrate support of  claim 5 , wherein the sensor assembly is about less than about 5 mm from the top of the workpiece support surface. 
     
     
       7. The substrate support of  claim 1 , wherein the workpiece support surface further comprises:
 one or more of mesas, grooves, channels or other geometries. 
 
     
     
       8. The substrate support of  claim 7 , wherein the sensor assembly is less than about 100 mm from the top of the mesas. 
     
     
       9. The substrate support of  claim 8 , wherein the sensor assembly is about less than about 5 mm from the top of the mesas. 
     
     
       10. The substrate support of  claim 1 , wherein the sensor is a fiber optic based sensor. 
     
     
       11. The substrate support of  claim 10 , wherein the fiber optic based sensor is a Fabry-Pérot sensor. 
     
     
       12. The substrate support of  claim 1 , wherein the split plate has a body that is ring shaped, the body having a side opening. 
     
     
       13. A processing chamber, comprising:
 a chamber body enclosing a chamber interior volume; and 
 a substrate support disposed in the chamber interior volume, the substrate support comprising:
 a puck, the puck comprising:
 a workpiece support surface; and 
 a gas hole formed through the workpiece support surface; and 
 
 
 a sensor assembly mounted in the gas hole below the workpiece support surface and configured to detect a metric of distance to a workpiece disposed on the workpiece support surface, wherein the sensor assembly has passages that permit fluid to pass through the sensor assembly when positioned in the gas hole, and wherein the sensor assembly has a sensor housing and a sensor, the sensor housing has a split plate configured to be disposed around at least a portion of the sensor, and wherein the passages include gas passages formed in the split plate. 
 
     
     
       14. The processing chamber of  claim 13 , wherein the sensor comprises:
 a sensor head aligned within +/−3 degrees from perpendicular to the workpiece support surface. 
 
     
     
       15. The processing chamber of  claim 14 , wherein the sensor housing comprises:
 a mounting head disposed below the split plate and configured to position the sensor head below the workpiece support surface, wherein the passages include gas passages formed in the mounting head. 
 
     
     
       16. The processing chamber of  claim 15 , wherein the split plate comprises: pins interfacing with and locating the split plate in the mounting head in an orientation that aligns the gas passages formed in the mounting head with the gas passages formed in the split plate.