Light-emitting package structure

Abstract

A light-emitting package structure includes a light transmissive adhesive layer, a substrate, and at least one light-emitting diode chip. The light transmissive adhesive layer includes a first surface and a second surface facing away from the first surface. The substrate is on the first surface of the light transmissive adhesive layer. The light-emitting diode chip is on the second surface of the light transmissive adhesive layer. The light transmissive adhesive layer has a first portion and a second portion on the second surface, the first portion surrounds the second portion, a vertical projection area of the second portion on the substrate at least entirely covers a vertical projection area of the light-emitting diode chip on the substrate, and a thickness of the second portion is smaller than or equal to a thickness of the first portion.

What is claimed is: 
     
       1. A light-emitting package structure, comprising:
 a light transmissive adhesive layer having a first surface and a second surface facing away from the first surface; 
 a substrate on the first surface of the light transmissive adhesive layer; and 
 at least one light-emitting diode chip on the second surface of the light transmissive adhesive layer, wherein the light-emitting diode chip emits blue light, the light transmissive adhesive layer has a first portion and a second portion on the second surface, the first portion surrounds the second portion, a vertical projection area of the second portion on the substrate at least entirely covers a vertical projection area of the light-emitting diode chip on the substrate, a thickness of the second portion is smaller than or equal to a thickness of the first portion, an oblique surface is between the second surface of the first portion and the second surface of the second portion, and the oblique surface gradually extends away the substrate from the second surface of the second portion to the second surface of the first portion; and 
 a wavelength converting substance in the light transmissive adhesive layer, wherein the wavelength converting substance absorbs portions of the blue light and converts to corresponding color light. 
 
     
     
       2. The light-emitting package structure of  claim 1 , wherein the oblique surface gradually extends away the light emitting-diode chip from the second surface of the second portion to the second surface of the first portion. 
     
     
       3. The light-emitting package structure of  claim 1 , wherein a height of a climbing of the first portion of the light transmissive adhesive layer is smaller than 20% of a height of the light-emitting diode chip. 
     
     
       4. The light-emitting package structure of  claim 1 , wherein a number of the light-emitting diode chip is plural. 
     
     
       5. The light-emitting package structure of  claim 4 , wherein the light-emitting diode chip comprises a red light-emitting diode chip, a green light-emitting diode chip or a blue light-emitting diode chip. 
     
     
       6. The light-emitting package structure of  claim 1 , further comprising a plurality of filler particles in the light transmissive adhesive layer, wherein the filler particles are configured to adjust a path of light emitted by the light-emitting diode chip. 
     
     
       7. The light-emitting package structure of  claim 1 , wherein the substrate is a light transmissive substrate. 
     
     
       8. The light-emitting package structure of  claim 1 , further comprising an encapsulation layer on the second surface of the light transmissive adhesive layer and covering the light-emitting diode chip.