Apparatus for processing substrate including cooling member closer to central axis than heating member

Abstract

An apparatus for processing a substrate includes a chamber having a processing space inside, a substrate support unit that supports the substrate in the processing space, and a temperature adjustment unit that is installed in the chamber and that adjusts temperature in the processing space. The temperature adjustment unit includes a heating member that heats the processing space and a cooling member that cools the processing space. The cooling member is located closer to a central axis of the chamber than the heating member.

What is claimed is: 
     
       1. An apparatus for processing a substrate, the apparatus comprising:
 a chamber having a processing space inside; 
 a substrate support unit configured to support the substrate in the processing space; 
 a temperature adjustment unit installed in the chamber and configured to adjust temperature in the processing space; and 
 a gas supply unit configured to supply gas into the processing space; 
 wherein the temperature adjustment unit includes: 
 a heating member configured to heat the processing space; and 
 a cooling member configured to cool the processing space, and 
 wherein the cooling member is located closer to a central axis of the chamber than the heating member, and 
 wherein the gas supply unit supplies the gas into the processing space such that pressure in the processing space is raised to more than critical pressure of the gas by the gas supplied into the processing space. 
 
     
     
       2. The apparatus of  claim 1 , wherein the heating member and the cooling member have longitudinal directions parallel to each other. 
     
     
       3. The apparatus of  claim 2 , wherein the chamber includes:
 an upper body; and 
 a lower body combined with the upper body to form the processing space inside, 
 wherein the apparatus further comprises an actuator configured to move at least one of the upper body and the lower body in a moving direction for a position change between a closed position in which the processing space is closed and an open position where the processing position is open, and 
 wherein the longitudinal directions of the heating member and the cooling member are parallel to the moving direction. 
 
     
     
       4. The apparatus of  claim 3 , wherein the heating member includes a plurality of heaters with a bar shape;
 wherein the cooling member includes a plurality of coolers with a bar shape, 
 wherein the heaters are combined together to have a ring shape when viewed from above, and 
 wherein the coolers are combined together to have a ring shape when viewed from above. 
 
     
     
       5. The apparatus of  claim 4 , wherein the chamber has cooling recesses formed therein, into which the coolers are inserted, and
 wherein each of the coolers includes: 
 a first part having a first thermal conductivity for the chamber; and 
 a second part extending from the first part and having a second thermal conductivity for the chamber, wherein the second thermal conductivity is lower than the first thermal conductivity. 
 
     
     
       6. The apparatus of  claim 5 , wherein the first part is located closer to the processing space than the second part. 
     
     
       7. The apparatus of  claim 6 , wherein the first part has a larger width than the second part,
 wherein the first part is brought into contact with one surface forming a corresponding one of the cooling recesses, and 
 wherein the second part is spaced apart from the one surface. 
 
     
     
       8. The apparatus of  claim 7 , wherein the cooling member further includes an outer body configured to surround a space between the second part and the chamber, and
 wherein the outer body is formed of a heat insulating material configured to block heat exchange between the second part and the chamber.