Deposit removing device and deposit removing method

Abstract

A deposit removing device disclosed herein removes a deposit that adheres to an exhaust pipe through which gas is exhausted from a chamber that manufactures a semiconductor crystal. The deposit removing device includes: a valve that opens and closes an exhaust outlet that communicates with the exhaust pipe; a sealing cover and a fixed table configured to store the valve, into which an inert gas is introduceable, and configured to isolate the exhaust outlet from the outside; and an exhaust outlet opening/closing portion that includes a cylinder for driving the valve and a cylinder for driving the sealing cover or the fixed table. The cylinder drives the valve to open and close the exhaust outlet, and the cylinder drives the sealing cover or the fixed table to introduce the atmosphere into the sealing cover.

The invention claimed is: 
     
       1. A deposit removing device configured to remove a deposit adhering to an exhaust pipe through which gas is exhausted from a chamber that manufactures a semiconductor crystal, the device comprising:
 an exhaust outlet opening/closing portion, wherein 
 the exhaust outlet opening/closing portion comprises: 
 a valve configured to open and close an exhaust outlet that communicates with the exhaust pipe; 
 an isolated space forming portion configured to store the valve, into which an inert gas is introduceable, and configured to isolate the exhaust outlet from an outside; 
 a first driving portion configured to drive the valve to open and close the exhaust outlet; and 
 a second driving portion configured to drive at least part of the isolated space forming portion to introduce atmosphere into the isolated space forming portion. 
 
     
     
       2. The deposit removing device according to  claim 1 , wherein the deposit removing device is configured to remove the deposit adhering to the exhaust pipe in a state where the chamber is opened to the atmosphere. 
     
     
       3. The deposit removing device according to  claim 1 , wherein the deposit removing device is configured such that the exhaust outlet is closed by bringing the valve into contact with a base plate surface formed having the exhaust outlet, and
 the exhaust outlet is opened by causing the valve to separate from the base plate surface. 
 
     
     
       4. A deposit removing method for removing a deposit that adheres to an exhaust pipe through which gas is exhausted from a chamber that manufactures a semiconductor crystal, the method comprising:
 providing the deposit removing device of  claim 1 , 
 isolating the exhaust outlet that communicates with the exhaust pipe from the outside to form an isolated space; 
 introducing the inert gas into the isolated space; and 
 opening the exhaust outlet in a state where the deposit is sucked from an outside of the chamber via the exhaust pipe. 
 
     
     
       5. The deposit removing method according to  claim 4 , wherein the deposit adhering to the exhaust pipe is removed in a state where the chamber is opened to the atmosphere. 
     
     
       6. The deposit removing method according to  claim 4 , wherein the exhaust outlet is closed by bringing a valve into contact with a base plate surface formed having the exhaust outlet, and
 the exhaust outlet is opened by causing the valve to separate from the base plate surface.