Wafer cleaning apparatus

Abstract

A wafer cleaning apparatus for cleaning a circumferential edge of a wafer includes a cleaning unit that jets water toward the circumferential edge of the wafer from an outer side of the circumferential edge of the wafer held by a holding surface of a holding table, to clean the circumferential edge of the wafer. The cleaning unit includes a first nozzle that jets the water to the circumferential edge of the wafer from an outer side of the circumferential edge of the wafer in a direction parallel to the holding surface, a second nozzle that jets the water to the circumferential edge of the wafer in a direction of 45 degrees downward relative to the holding surface, and a third nozzle that jets the water to the circumferential edge of the wafer in a direction of 45 degrees upward relative to the holding surface.

What is claimed is: 
     
       1. A wafer cleaning apparatus for cleaning a circumferential edge of a wafer, the wafer cleaning apparatus comprising:
 a holding table that holds the wafer by a holding surface such that the circumferential edge of the wafer protrudes; 
 a motor that rotates the holding table with a center of the holding surface as an axis, 
 a rotation control section that controls a rotational speed of the motor; and 
 a cleaning unit that jets water toward the circumferential edge of the wafer from an outer side of the circumferential edge of the wafer held by the holding surface, to clean the circumferential edge of the wafer, 
 wherein the cleaning unit includes:
 a first nozzle that jets the water to the circumferential edge of the wafer from the outer side of the circumferential edge of the wafer in a 0-degree direction parallel to the holding surface, 
 a second nozzle that jets the water to the circumferential edge of the wafer from an outer upper side of the circumferential edge of the wafer in a direction of 45 degrees downward relative to the holding surface, and 
 a third nozzle that jets the water to the circumferential edge of the wafer from an outer lower side of the circumferential edge of the wafer in a direction of 45 degrees upward relative to the holding surface, and 
 
 the first nozzle, the second nozzle, and the third nozzle are disposed to be spaced from one another in a circumferential direction of the wafer. 
 
     
     
       2. The wafer cleaning apparatus according to  claim 1 , wherein the cleaning unit is configured to jet the water utilizing pressure of air by mixing water and the air. 
     
     
       3. The wafer cleaning apparatus according to  claim 1 , wherein the rotation control section is configured to rotate the holding table at a rotational speed of equal to or less than 10 rpm to clean a circumference of the wafer, and thereafter to rotate the holding table at a rotational speed of equal to or more than 1,000 rpm to dry the wafer.