Substrate processing system and substrate processing method

Abstract

A substrate processing system includes a stage on which a substrate is placed, a heater configured to heat the substrate by being supplied with power, a power supply part configured to supply power to the heater, a sensor configured to measure a resistance value of the heater, and a controller. The controller is configured to: store a conversion table in which a plurality of resistance values are associated with a plurality of temperatures; and acquire a reference resistance value measured by the sensor when a heater temperature is equal to a reference temperature. The controller is further configured to: acquire a temperature adjustment resistance value measured by the sensor after the substrate is heated by the heater; and control the power supply part based on the conversion table, the reference temperature, the reference resistance value, and the temperature adjustment resistance value.

What is claimed is: 
     
       1. A substrate processing system comprising:
 a stage on which a substrate is placed; 
 a plurality of heaters configured to heat the substrate by being supplied with power; 
 a plurality of power supply parts configured to supply power to the plurality of heaters, respectively; 
 a plurality of sensors corresponding to the plurality of heaters; and 
 a controller, 
 wherein the controller is configured to: 
 store a plurality of conversion tables corresponding to the plurality of heaters, a plurality of resistance values in the plurality of conversion tables being associated with a plurality of temperatures; 
 acquire a plurality of reference resistance values corresponding to the plurality of heaters, the plurality of reference resistance values being measured by the plurality of sensors when a temperature of one heater among the plurality of heaters is a reference temperature; 
 acquire a plurality of temperature adjustment resistance values corresponding to the plurality of heaters, the plurality of temperature adjustment resistance values being measured by the plurality of sensors after the substrate is heated by the plurality of heaters; and 
 control the plurality of power supply parts based on the plurality of conversion tables, the reference temperature, the plurality of reference resistance values, and the plurality of temperature adjustment resistance values, 
 wherein the plurality of sensors respectively measure the plurality of reference resistance values in any of a plurality of measurement periods, 
 a first reference resistance value corresponding to a first heater among the plurality of reference resistance values is measured in a first measurement period among the plurality of measurement periods, 
 a second reference resistance value corresponding to a second heater among the plurality of reference resistance values is measured in a second measurement period among the plurality of measurement periods, subsequent to the first measurement period, 
 a second region corresponding to the second heater among a plurality of regions is arranged not to be adjacent to a first region corresponding to the first heater among the plurality of regions, and 
 the controller is further configured to set a length of an interval between the plurality of measurement periods based on a time when a temperature of the first heater decreases and becomes equal to a chiller temperature after the first measurement period among the plurality of measurement periods in which power is supplied to the first heater corresponding to the first measurement period. 
 
     
     
       2. The substrate processing system of  claim 1 , wherein the controller is configured to:
 acquire the first reference resistance value measured by a first sensor corresponding to the first heater among the plurality of sensors after a reference resistance value is measured; 
 acquire a first temperature adjustment resistance value measured by the first sensor after the substrate is heated by the first heater; and 
 control a first power supply part configured to supply power to the first heater among the plurality of power supply parts based on a first conversion table corresponding to the first heater among the plurality of conversion tables, the reference temperature, the first reference resistance value, and the first temperature adjustment resistance value. 
 
     
     
       3. The substrate processing system of  claim 2 , wherein a placement surface of the stage facing the substrate is divided into the plurality of regions corresponding to the plurality of heaters including the one heater,
 the one heater heats the substrate by heating one region corresponding thereto among the plurality of regions, 
 the first heater heats the substrate by heating the first region corresponding thereto among the plurality of regions, and 
 the first region is arranged not to be adjacent to the one region. 
 
     
     
       4. The substrate processing system of  claim 3 , wherein during the first measurement period, the reference resistance value and the first reference resistance value are measured. 
     
     
       5. The substrate processing system of  claim 1 , wherein the interval between the plurality of measurement periods is equal to a predetermined length. 
     
     
       6. The substrate processing system of  claim 1 , wherein the plurality of sensors respectively measure a plurality of reference resistance values corresponding to the plurality of heaters in any of the plurality of measurement periods,
 a third reference resistance value corresponding to a third heater among the plurality of reference resistance values is measured in a third measurement period among the plurality of measurement periods, subsequent to the first measurement period or the second measurement period, and 
 a third region corresponding to the third heater among the plurality of regions is arranged not to be adjacent to the first region and the second region. 
 
     
     
       7. A substrate processing method executed using a substrate processing apparatus comprising a stage on which a substrate is placed, a plurality of heaters configured to heat the substrate by being supplied with power, a plurality of power supply parts configured to supply power to the plurality of heaters, respectively, and a plurality of sensors corresponding to the plurality of heaters,
 wherein the substrate processing method comprises: 
 storing a plurality of conversion tables corresponding to the plurality of heaters, a plurality of resistance values in the plurality of conversion tables being associated with a plurality of temperatures; 
 acquiring a plurality of reference resistance values corresponding to the plurality of heaters, the plurality of reference resistance values being measured by the plurality of sensors when a temperature of one heater among the plurality of heaters is a reference temperature; 
 acquiring a plurality of temperature adjustment resistance values corresponding to the plurality of heaters, the plurality of temperature adjustment resistance values being measured by the plurality of sensors after the substrate is heated by the plurality of heaters; and 
 controlling the plurality of power supply parts based on the plurality of conversion tables, the reference temperature, the plurality of reference resistance values, and the plurality of temperature adjustment resistance values, 
 wherein the plurality of sensors respectively measure the plurality of reference resistance values in any of a plurality of measurement periods, 
 a first reference resistance value corresponding to a first heater among the plurality of reference resistance values is measured in a first measurement period among the plurality of measurement periods, 
 a second reference resistance value corresponding to a second heater among the plurality of reference resistance values is measured in a second measurement period among the plurality of measurement periods, subsequent to the first measurement period, 
 a second region corresponding to the second heater among a plurality of regions is arranged not to be adjacent to a first region corresponding to the first heater among the plurality of regions, and 
 the substrate processing method further comprises: setting a length of an interval between the plurality of measurement periods based on a time when a temperature of the first heater decreases and becomes equal to a chiller temperature after the first measurement period among the plurality of measurement periods in which power is supplied to the first heater corresponding to the first measurement period.