Package with thermal interface material retaining structures on die and heat spreader

Abstract

A device package and a method of forming a device package are described. The device package includes a lid with one or more legs on an outer periphery of the lid, a top surface, and a bottom surface, where the lid is disposed on the substrate. The legs of the lid are attached to the substrate with a sealant. The device package also has one or more dies disposed on the substrate. The die(s) are below the bottom surface of the lid, where each of the dies has a top surface and a bottom surface. The device package further includes a retaining structure disposed between the bottom surface of the lid and the top surface of the die, where the retaining structure has one or more inner walls. The device package includes a thermal interface material disposed within the inner walls of the retaining structure and above the top surface of the die.

What is claimed is: 
     
       1. A device package, comprising:
 a lid coupled to a substrate; 
 a die disposed on the substrate, the die between the substrate and the lid; 
 a retaining structure between the lid and a top surface of the die, the retaining structure having an uppermost surface; and 
 a thermal interface material within the retaining structure and above the top surface of the die, wherein the thermal interface material has an uppermost surface above the uppermost surface of the retaining structure, and wherein the thermal interface material is not vertically overlapping with the retaining structure. 
 
     
     
       2. The device package of  claim 1 , further comprising a sealant attaching a top surface of the retaining structure and the lid. 
     
     
       3. The device package of  claim 1 , further comprising a pedestal between the thermal interface material and the lid. 
     
     
       4. The device package of  claim 1 , wherein the retaining structure is disposed on an outer periphery of the top surface of the die. 
     
     
       5. The device package of  claim 1 , wherein the thermal interface material is a liquid thermal interface material. 
     
     
       6. The device package of  claim 1 , wherein the retaining structure is directly on the top surface of the die without an adhesive layer. 
     
     
       7. The device package of  claim 1 , wherein the retaining structure is a picture frame retaining structure, a ring retaining structure, or an angled retaining structure. 
     
     
       8. The device package of  claim 1 , wherein the retaining structure includes a metal, a metal alloy, a metal-ceramic composite, a polymer, a polymer-metal composite, a polymer-ceramic composite, an epoxy, or a ceramic. 
     
     
       9. The device package of  claim 1 , wherein the lid has one or more legs on an outer periphery of the lid. 
     
     
       10. The device package of  claim 9 , wherein the one or more legs are attached to the substrate with a sealant. 
     
     
       11. A device package, comprising:
 a lid coupled to a substrate; 
 a die disposed on the substrate, the die between the substrate and the lid; 
 a retaining structure between the lid and a top surface of the die, the retaining structure having an uppermost surface; 
 a thermal interface material within the retaining structure and above the top surface of the die, wherein the thermal interface material has an uppermost surface at a same level as the uppermost surface of the retaining structure, and wherein the thermal interface material is not vertically overlapping with the retaining structure; and 
 a pedestal between the thermal interface material and the die. 
 
     
     
       12. The device package of  claim 11 , further comprising a sealant attaching a bottom surface of the retaining structure and the die. 
     
     
       13. The device package of  claim 11 , wherein the retaining structure is disposed on an outer periphery of the top surface of the die. 
     
     
       14. The device package of  claim 11 , wherein the thermal interface material is a liquid thermal interface material. 
     
     
       15. The device package of  claim 11 , wherein the retaining structure is directly on the lid without an adhesive layer. 
     
     
       16. The device package of  claim 11 , wherein the retaining structure is a picture frame retaining structure, a ring retaining structure, or an angled retaining structure. 
     
     
       17. The device package of  claim 11 , wherein the retaining structure includes a metal, a metal alloy, a metal-ceramic composite, a polymer, a polymer-metal composite, a polymer-ceramic composite, an epoxy, or a ceramic. 
     
     
       18. The device package of  claim 11 , wherein the lid has one or more legs on an outer periphery of the lid. 
     
     
       19. The device package of  claim 18 , wherein the one or more legs are attached to the substrate with a sealant.