Inventor · disambiguated record
Feras Eid
Also filed as: EID FERAS
190 granted patents·102 pending applications·473 citations·filing 2011–2025
99Inventor score
Top patents by PatentIndex Score
292 records- 0198US11990448B2Direct bonding in microelectronic assembliesINTEL CORP·Filed 2020·Granted May 21, 2024·5 cites·18 claims
- 0298US9275955B2Integrated circuit package with embedded bridgeINTEL CORP·Filed 2013·Granted Mar 1, 2016·49 cites·17 claims
- 0397US12107060B2Microelectronic assemblies with inductors in direct bonding regionsINTEL CORP·Filed 2020·Granted Oct 1, 2024·5 cites·20 claims
- 0497US12062631B2Microelectronic assemblies with inductors in direct bonding regionsINTEL CORP·Filed 2020·Granted Aug 13, 2024·4 cites·20 claims
- 0596US12057402B2Direct bonding in microelectronic assembliesINTEL CORP·Filed 2020·Granted Aug 6, 2024·3 cites·20 claims
- 0696US9735893B1Patch system for in-situ therapeutic treatmentINTEL CORP·Filed 2016·Granted Aug 15, 2017·53 cites·20 claims
- 0796US8633551B1Semiconductor package with mechanical fuseTEH WENG HONG·Filed 2012·Granted Jan 21, 2014·30 cites·30 claims
- 0895US12165962B2Hermetic sealing structures in microelectronic assemblies having direct bondingINTEL CORP·Filed 2020·Granted Dec 10, 2024·3 cites·19 claims
- 0994US11469206B2Microelectronic assembliesINTEL CORP·Filed 2018·Granted Oct 11, 2022·10 cites·25 claims
- 1094US11050155B2Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systemsINTEL CORP·Filed 2016·Granted Jun 29, 2021·7 cites·20 claims
- 1194US10314171B1Package assembly with hermetic cavityINTEL CORP·Filed 2017·Granted Jun 4, 2019·10 cites·20 claims
- 1294US9902152B2Piezoelectric package-integrated synthetic jet devicesINTEL CORP·Filed 2016·Granted Feb 27, 2018·5 cites·20 claims
- 1394US9147633B2Heat removal in an integrated circuit assembly using a jumping-drops vapor chamberINTEL CORP·Filed 2013·Granted Sep 29, 2015·21 cites·14 claims
- 1493US11616047B2Microelectronic assembliesINTEL CORP·Filed 2020·Granted Mar 28, 2023·2 cites·23 claims
- 1593US10951248B1Radio frequency (RF) module with shared inductorINTEL CORP·Filed 2019·Granted Mar 16, 2021·9 cites·10 claims
- 1693US10068852B2Integrated circuit package with embedded bridgeINTEL CORP·Filed 2017·Granted Sep 4, 2018·8 cites·19 claims
- 1793US9505607B2Methods of forming sensor integrated packages and structures formed therebyINTEL CORP·Filed 2015·Granted Nov 29, 2016·8 cites·22 claims
- 1893US9501068B2Integration of pressure sensors into integrated circuit fabrication and packagingINTEL CORP·Filed 2016·Granted Nov 22, 2016·6 cites·20 claims
- 1992US11387161B2Package with thermal interface material retaining structures on die and heat spreaderINTEL CORP·Filed 2017·Granted Jul 12, 2022·7 cites·26 claims
- 2092US11206008B2Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator diesINTEL CORP·Filed 2017·Granted Dec 21, 2021·7 cites·25 claims
- 2192US10291283B2Tunable radio frequency systems using piezoelectric package-integrated switching devicesINTEL CORP·Filed 2016·Granted May 14, 2019·6 cites·22 claims
- 2292US9967040B2Patch system for in-situ therapeutic treatmentINTEL CORP·Filed 2017·Granted May 8, 2018·14 cites·20 claims
- 2391US11688665B2Thermal management solutions for stacked integrated circuit devicesINTEL CORP·Filed 2018·Granted Jun 27, 2023·7 cites·17 claims
- 2491US11147197B2Microelectronic package electrostatic discharge (ESD) protectionINTEL CORP·Filed 2019·Granted Oct 12, 2021·5 cites·20 claims
- 2591US10651525B2Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubsINTEL CORP·Filed 2018·Granted May 12, 2020·5 cites·11 claims
- 2691US9260294B2Integration of pressure or inertial sensors into integrated circuit fabrication and packagingLEE KYU OH·Filed 2013·Granted Feb 16, 2016·9 cites·18 claims
- 2790US12033914B2Package with thermal interface material retaining structures on die and heat spreaderINTEL CORP·Filed 2022·Granted Jul 9, 2024·1 cites·19 claims
- 2890US11328978B2Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispenseINTEL CORP·Filed 2017·Granted May 10, 2022·6 cites·25 claims
- 2990US11227859B2Stacked package with electrical connections created using high throughput additive manufacturingINTEL CORP·Filed 2017·Granted Jan 18, 2022·6 cites·25 claims
- 3090US9893438B1Electrical connectors for high density attach to stretchable boardsINTEL CORP·Filed 2016·Granted Feb 13, 2018·7 cites·6 claims
- 3190US9716067B2Integrated circuit package with embedded bridgeINTEL CORP·Filed 2016·Granted Jul 25, 2017·6 cites·6 claims
- 3290US9559037B2Package integrated synthetic jet deviceEID FERAS·Filed 2015·Granted Jan 31, 2017·9 cites·20 claims
- 3389US12199018B2Direct bonding in microelectronic assembliesINTEL CORP·Filed 2020·Granted Jan 14, 2025·2 cites·20 claims
- 3489US11482472B2Thermal management solutions for stacked integrated circuit devicesINTEL CORP·Filed 2018·Granted Oct 25, 2022·6 cites·17 claims
- 3589US11316497B2Multi-filter dieINTEL CORP·Filed 2019·Granted Apr 26, 2022·4 cites·20 claims
- 3689US9992859B2Low loss and low cross talk transmission lines using shaped viasINTEL CORP·Filed 2015·Granted Jun 5, 2018·5 cites·4 claims
- 3789US2025336887A1Microelectronic assembliesINTEL CORP·Filed 2025·Application pending·0 cites
- 3888US10039186B2Stretchable and flexible electrical substrate interconnectionsINTEL CORP·Filed 2016·Granted Jul 31, 2018·5 cites·19 claims
- 3987US11933555B2Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sectionsINTEL CORP·Filed 2021·Granted Mar 19, 2024·1 cites·20 claims
- 4087US2025022845A1Microelectronic assembliesINTEL CORP·Filed 2024·Application pending·0 cites
- 4186US9647636B1Piezoelectric package-integrated delay lines for radio frequency identification tagsINTEL CORP·Filed 2016·Granted May 9, 2017·4 cites·26 claims
- 4285US11456721B2RF front end module including hybrid filter and active circuits in a single packageINTEL CORP·Filed 2017·Granted Sep 27, 2022·4 cites·28 claims
- 4385US11310907B2Microelectronic package with substrate-integrated componentsINTEL CORP·Filed 2019·Granted Apr 19, 2022·3 cites·13 claims
- 4485US10215164B2Fabric-based piezoelectric energy harvestingINTEL CORP·Filed 2015·Granted Feb 26, 2019·3 cites·19 claims
- 4585US2024266745A1Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systemsINTEL CORP·Filed 2024·Application pending·0 cites
- 4684US11948906B2Hybrid backside thermal structures for enhanced IC packagesINTEL CORP·Filed 2020·Granted Apr 2, 2024·2 cites·25 claims
- 4784US10424559B2Thermal management of molded packagesINTEL CORP·Filed 2016·Granted Sep 24, 2019·5 cites·27 claims
- 4883US12155133B2Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systemsINTEL CORP·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 4983US11348882B2Package spark gap structureINTEL CORP·Filed 2019·Granted May 31, 2022·3 cites·20 claims
- 5083US9345184B2Magnetic field shielding for packaging build-up architecturesINTEL CORP·Filed 2013·Granted May 17, 2016·6 cites·22 claims
Showing the top 50 of 292 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →