RF tuning systems including tuning circuits having impedances for setting and adjusting parameters of electrodes in electrostatic chucks

Abstract

A substrate processing system for processing a substrate within a processing chamber is provided and includes a source terminal, a substrate support, and a tuning circuit. The substrate support holds the substrate and includes first and second electrodes, which receive power from a power source via the source terminal. The tuning circuit is connected to the first electrode or the second electrode. The tuning circuit is allocated for tuning signals provided to the first electrode. The tuning circuit includes at least one of a first impedance set or a second impedance set. The first impedance set is serially connected between the first electrode and the power source and receives a first signal from the power source via the source terminal. The second impedance set is connected between an output of the power source and a reference terminal and receives the first signal from the power source via the source terminal.

What is claimed is: 
     
       1. A substrate processing system, the substrate processing system comprising:
 a substrate support configured to support the substrate, wherein the substrate support comprises a first one or more electrodes; and 
 a first tuning circuit connected to the first one or more electrodes and a ground reference terminal and comprising:
 a series impedance set comprising a first impedance and a second impedance connected in series with the first impedance, and 
 a parallel impedance set connected to the series impedance set and comprising a third impedance and a fourth impedance connected in parallel with the third impedance. 
 
 
     
     
       2. The substrate processing system of  claim 1 , wherein the series impedance set is connected between the first one or more electrodes and the parallel impedance set. 
     
     
       3. The substrate processing system of  claim 1 , wherein the first tuning circuit is connected in series with the first one or more electrodes and the ground reference terminal. 
     
     
       4. The substrate processing system of  claim 1 , wherein the parallel impedance set is connected in series with the series impedance set. 
     
     
       5. The substrate processing system of  claim 1 , wherein:
 the first one or more electrodes comprise a first electrode and a second electrode; and 
 the first tuning circuit is connected to the first electrode and the second electrode. 
 
     
     
       6. The substrate processing system of  claim 1 , further comprising a second tuning circuit, wherein:
 the substrate support comprises a second one or more electrodes; and 
 the second tuning circuit is connected to the second one or more electrodes and the ground reference terminal and comprises
 a series impedance set comprising a first impedance and a second impedance connected in series with the first impedance of the second tuning circuit, and 
 a parallel impedance set connected to the series impedance set of the second tuning circuit and comprising a third impedance and a fourth impedance connected in parallel with the third impedance of the second tuning circuit. 
 
 
     
     
       7. The substrate processing system of  claim 6 , wherein:
 the substrate support comprises a top plate and a baseplate; 
 the first one or more electrodes are disposed in the top plate; and 
 the second one or more electrodes are disposed in the baseplate. 
 
     
     
       8. The substrate processing system of  claim 6 , wherein the first one or more electrodes and the second one or more electrodes are concentrically disposed. 
     
     
       9. The substrate processing system of  claim 6 , wherein:
 the first one or more electrodes are circular-shaped; and 
 the second one or more electrodes are annular-shaped. 
 
     
     
       10. The substrate processing system of  claim 1 , wherein:
 the substrate support comprises a top plate and a baseplate; and 
 the first one or more electrodes are disposed in the top plate. 
 
     
     
       11. The substrate processing system of  claim 1 , wherein:
 the substrate support comprises a top plate and a baseplate; and 
 the first one or more electrodes are disposed in the baseplate. 
 
     
     
       12. The substrate processing system of  claim 1 , wherein:
 the substrate support comprises a top plate and a baseplate; 
 one or more of the first one or more electrodes are disposed in the top plate; and 
 a remainder of the first one or more electrodes are disposed in the baseplate. 
 
     
     
       13. The substrate processing system of  claim 1 , wherein the first one or more electrodes are concentrically disposed. 
     
     
       14. The substrate processing system of  claim 1 , wherein:
 the first one or more electrodes comprise a first electrode and a second electrode; 
 the first electrode and the second electrode are concentrically disposed; 
 the first electrode is circular-shaped; and 
 the second electrode is annular-shaped. 
 
     
     
       15. The substrate processing system of  claim 1 , wherein:
 the first one or more electrodes comprise a clamping electrode and a first bias electrode; 
 the clamping electrode is circular-shaped; and 
 the first bias electrode is at least one of circular-shaped or annular-shaped. 
 
     
     
       16. The substrate processing system of  claim 1 , wherein the first one or more electrodes comprise a second bias electrode that is annular-shaped.