US12233368B2ActiveUtilityA1
Particle remover and method
Assignee: TAIWAN SEMICONDUCTOR MFG CO LTDPriority: Mar 19, 2021Filed: Aug 13, 2023Granted: Feb 25, 2025
Est. expiryMar 19, 2041(~14.7 yrs left)· nominal 20-yr term from priority
C23C 16/4407C23C 16/45544B01D 45/14C23C 16/45561C23C 16/45525C23C 16/4402C23C 16/455
85
PatentIndex Score
0
Cited by
49
References
20
Claims
Abstract
A device for removing particles in a gas stream includes a first cylindrical portion configured to receive the gas stream containing a target gas and the particles, a rotatable device disposed within the first cylindrical portion and configured to generate a centrifugal force when in a rotational action to divert the particles away from the rotatable device, a second cylindrical portion coupled to the first cylindrical portion and configured to receive the target gas, and a third cylindrical portion coupled to the first cylindrical portion and surrounding the second cylindrical portion, the third cylindrical portion being configured to receive the diverted particles.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A method of delivering a gas stream to a reaction chamber of a wafer process system, the method comprising:
providing a particle remover configured to receive the gas stream containing a target gas and unwanted particles, the gas stream being generated from a precursor source of a wafer process system, wherein the particle remover comprises a rotatable shaft and a plurality of staggered blades disposed on a surface of the rotatable shaft;
rotating the rotatable shaft to generate a centrifugal force to drive the unwanted particles away from the rotatable shaft; and
diverting the unwanted particles to a side pathway while moving the target gas toward a main pathway coupled to the reaction chamber of the wafer process system.
2. The method of claim 1 , further comprising collecting the unwanted particles in a collection reservoir.
3. The method of claim 1 , wherein the particle remover comprises:
a first cylindrical portion for receiving the gas stream;
a second cylindrical portion coupled to the first cylindrical portion; and
a third cylindrical portion coupled to the first cylindrical portion and surrounding the second cylindrical portion; and
wherein the rotatable shaft is disposed within the first cylindrical portion.
4. The method of claim 3 , wherein the side pathway is disposed in the third cylindrical portion, and the main pathway is disposed in the second cylindrical portion.
5. The method of claim 3 , wherein the first, second, and third cylindrical portions are disposed along a longitudinal center axis, and the rotation shaft is configured to rotate around the longitudinal center axis.
6. A method of delivering a gas stream to a reaction chamber of a wafer process system, the method comprising:
providing a gas stream generated from a precursor source of a wafer process system; and
providing a particle remover disposed between the precursor source and the reaction chamber, the particle remover comprising a first cylindrical portion, a rotatable device disposed within the first cylindrical portion, a second cylindrical portion coupled to the first cylindrical portion, and a third cylindrical portion coupled to the first cylindrical portion and surrounding the second cylindrical portion; and, wherein the method further comprises:
receiving the gas stream containing a target gas and particles through the first cylindrical portion;
generating, through the rotatable device, a centrifugal force when in a rotational action to divert the particles away from the rotatable device;
receiving the target gas, through the second cylindrical portion, to be delivered to the reaction chamber of the wafer process system; and
receiving the particles through the third cylindrical portion.
7. The method of claim 6 , wherein the rotatable device comprises:
a rotatable shaft arranged in an elongated direction of the first cylindrical portion;
a plurality of staggered blades disposed on a surface of the rotation shaft; and
an electric motor coupled to the rotatable shaft; and, wherein the method further comprises:
rotating, through the electric motor, the rotatable shaft when the first cylindrical portion receives the gas stream.
8. The method of claim 7 , wherein the plurality of staggered blades are arranged at an angle not perpendicular to the surface of the rotation shaft.
9. The method of claim 6 , wherein the rotatable device is disposed externally to the second cylindrical portion and the third cylindrical portion.
10. The method of claim 6 , wherein the particle remover further comprises a plurality of support connections configured to couple a portion of the second cylindrical portion to an inner wall of the first cylindrical portion in a spoke structure.
11. The method of claim 6 , wherein the first, second, and third cylindrical portions have a same longitudinal center axis.
12. The method of claim 6 , wherein a cross-sectional area of the first cylindrical portion is equal to or greater than a cross-sectional area of the second cylindrical portion, and a cross-sectional area of the third cylindrical portion is greater than a cross-sectional area of the first cylindrical portion.
13. A method for gas stream delivery in a wafer process system, the method comprising:
coupling an inlet port of a particle remover to a precursor source of the wafer process system;
coupling an outlet port of the particle remover to a reaction chamber of the wafer process system;
providing a gas stream generated from the precursor source of the wafer process system, wherein the gas stream contains a target gas and unwanted particles;
generating a centrifugal force to drive the unwanted particles away from a rotatable shaft of the particle remover; and
diverting the unwanted particles to a side pathway while moving the target gas toward the outlet port coupled to reaction chamber of the wafer process system.
14. The method of claim 13 , wherein generating the centrifugal force comprises:
rotating the rotatable shaft.
15. The method of claim 14 , wherein the particle remover further comprises:
a plurality of blades disposed on a surface of the rotatable shaft.
16. The method of claim 15 , wherein the plurality of blades are a plurality of staggered blades.
17. The method of claim 15 , wherein the plurality of blades are arranged at an angle not perpendicular to the surface of the rotatable shaft.
18. The method of claim 13 , further comprising:
collecting the unwanted particles in a collection reservoir.
19. The method of claim 13 , wherein the inlet port comprises a first cylindrical portion, the outlet port comprises a second cylindrical portion, and the particle remover further comprises a third cylindrical portion coupled to the first cylindrical portion and surrounding the second cylindrical portion.
20. The method of claim 19 , wherein the side pathway is disposed in the third cylindrical portion.Cited by (0)
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