Substrate processing apparatus

Abstract

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus in which a substrate is processed at a high pressure and a low pressure. The substrate processing apparatus of the present invention includes: a process chamber (100) including a chamber body (110) which has an opened upper portion and in which an installation groove (130) is defined at a central side of a bottom surface (120) thereof, and a gate (111) configured to load/unload a substrate (1) is disposed at one side thereof, and a top lid (140) coupled to the upper portion of the chamber body (110) to define an inner space (S1); a substrate support (200) installed to be inserted into the installation groove (130) of the chamber body (110) and having a top surface on which the substrate (1) is seated.

What is claimed is: 
     
       1. A substrate processing apparatus comprising:
 a process chamber comprising a chamber body which has an opened upper portion and in which an installation groove is defined at a central side of a bottom surface thereof, and a gate configured to load/unload a substrate is disposed at one side thereof, and a top lid coupled to the upper portion of the chamber body to define an inner space; 
 a substrate support installed to be inserted into the installation groove of the chamber body and having a top surface on which the substrate is seated; 
 an inner lid part which is installed to be vertically movable in the inner space and of which a portion is in close contact with the bottom surface adjacent to the installation groove through descending to define a sealed processing space in which the substrate support is disposed; 
 a gas supply part installed to communicate with the processing space and configured to supply a process gas to the processing space; 
 an inner lid driving part installed to pass through the top lid to drive the vertical movement of the inner lid part; and 
 a filling member installed between the substrate support and an inner surface of the installation groove to occupy at least a portion of a space between the substrate support and the inner surface of the installation groove. 
 
     
     
       2. The substrate processing apparatus of  claim 1 , wherein the filling member is provided in a shape corresponding to an interspace between the installation groove and the substrate support so that the processing space is minimized. 
     
     
       3. The substrate processing apparatus of  claim 1 , wherein the substrate support comprises:
 a substrate support plate on which the substrate is seated on the top surface thereof; and 
 a substrate support post passing through a bottom surface of the process chamber so as to be connected to the substrate support plate, 
 wherein the filling member is installed to be adjacent to a side surface and a bottom surface of the substrate support plate. 
 
     
     
       4. The substrate processing apparatus of  claim 3 , wherein the filling member is installed to be spaced apart from the substrate support plate so as to surround the side surface and the bottom surface of the substrate support plate. 
     
     
       5. The substrate processing apparatus of  claim 1 , wherein the substrate support is installed to be spaced apart from the filling member. 
     
     
       6. The substrate processing apparatus of  claim 1 , wherein the filling member is made of at least one of quartz, ceramic, or SUS. 
     
     
       7. The substrate processing apparatus of  claim 1 , wherein the filling member comprises:
 an insulating part configured to block heat from the processing space to the outside; and 
 a reflection part provided on a surface of the insulating part to reflect heat. 
 
     
     
       8. The substrate processing apparatus of  claim 7 , wherein the reflection part is applied on the surface of the insulating part. 
     
     
       9. The substrate processing apparatus of  claim 1 , further comprising:
 a plurality of substrate support pins passing through the filling member and the substrate support to move vertically, thereby supporting the substrate; and 
 an annular substrate support ring which is elevated through an external substrate support driving pin and on which the plurality of substrate support pins are installed, 
 wherein the process chamber further comprises a support pin installation groove defined in a bottom surface so that the substrate support ring is installed. 
 
     
     
       10. The substrate processing apparatus of  claim 9 , wherein the substrate support pin installation groove is defined in the installation groove and covered by the filling member. 
     
     
       11. The substrate processing apparatus of  claim 1 , further comprising:
 a plurality of substrate support pins passing through the substrate support to move vertically, thereby supporting the substrate; and 
 an annular substrate support ring which is elevated through an external substrate support driving pin and on which the plurality of substrate support pins are installed, 
 wherein the filling member further comprises a support pin installation groove defined so that the substrate support ring is installed.