Contact probe and probe device

Abstract

A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.

What is claimed as new and is desired to be secured by letters patent of the United States is:  
     
         1 . In a probe device, an improved contact probe comprising: 
 a film;    a plurality of wiring patterns formed on the film, each wiring pattern having a front end portion projecting from the film so as to form contact pins; and    a metal layer provided on the film.    
     
     
         2 . The probe device according to    claim 1   , wherein the contact pins of the contact probe are made of a nickel-manganese alloy including manganese in a range from 0.05 wt. % to 1.5 wt. %.  
     
     
         3 . The probe device according to    claim 1   , wherein the contact pins of the contact probe are bent at a middle position thereof.  
     
     
         4 . The probe device according to    claim 3   , wherein each of the contact pins of the contact probe has a tip portion opposite an end portion, the tip portion configured such that when the tip portion is brought into contact with an object of measurement, an angle of the tip portion with respect to a contact face thereof is in a range of 60° to 90°, and the end portion configured such that an angle of the end portion with respect to the contact face is in a range of 0° to 30°.  
     
     
         5 . The probe device according to    claim 4   , further comprising: 
 a substrate attached to the contact probe, the substrate having terminals connected to respective base ends of the wiring patterns; and    an inclination holding member having a lower face inclined at angle in a range of 0° to 30° with respect to the contact face of an object of measurement and configured to maintain the end portion so that the angle of the end portion with respect to the contact face is in the range of 0° to 30°;    wherein the contact probe is supported by the inclination holding member such that the metal layer of the film is brought into contact with the lower face of the inclination holding member.    
     
     
         6 . The probe device according to    claim 1   , the contact probe further comprising: 
 a contact probe main body including a plurality of the wiring patterns disposed as main wiring patterns; and    a contact probe branch portion which branches from the contact probe main body, integrally formed with the contact probe main body, and includes a plurality of the wiring patterns disposed as branch wiring patterns formed by dividing portions of the main wiring patterns.    
     
     
         7 . The probe device according to    claim 6   , further comprising: 
 a wiring substrate having a plurality of substrate side wiring patterns respectively connected to middle portions or rear end portions of the main wiring patterns and the branch wiring patterns; and    support members for supporting respective front end portions of the main wiring patterns.    
     
     
         8 . The probe device according to    claim 7   , wherein the wiring substrate comprises a rectangular opening for arranging the contact probe, a plurality of the contact pins of the contact probe are arranged along a diagonal line of the rectangular opening and the contact probe main body and the contact probe branch portion are respectively distributed to two sides of the rectangular opening opposed to the diagonal line; and 
 wherein the main wiring patterns and the branch wiring patterns are respectively connected to the substrate side wiring patterns at the two sides of the rectangular opening.    
     
     
         9 . The probe device according to    claim 7   , wherein the substrate side wiring patterns are respectively formed on a front face and a back face of the wiring substrate; 
 wherein the contact probe main body and the contact probe branch portion are respectively distributed to the front face and the back face of the wiring substrate by folding a portion of either one thereof; and    wherein the main wiring patterns and the branch wiring patterns are respectively connected to the substrate side wiring patterns at the two sides of the rectangular opening.    
     
     
         10 . The probe device according to    claim 1   , the contact probe further comprising: 
 a contact probe main body including the wiring patterns disposed as a plurality main wiring patterns; and    at least one of branch wiring plate connected to the contact probe main body by attaching a portion of the branch wiring plate to the contact probe main body, and including a plurality of branch wiring patterns;    wherein the branch wiring patterns are each connected to portions of the plurality of main wiring patterns.    
     
     
         11 . A probe device according to    claim 10   , further comprising: 
 a wiring substrate having a plurality of substrate side wiring patterns respectively connected to middle portions or rear end portions of the main wiring patterns and the branch wiring patterns; and    supporting members for supporting the respective front end portions of the main wiring patterns;    wherein the substrate side wiring patterns are respectively formed on a front face and a back face of the wiring substrate;    wherein the contact probe main body and the branch wiring plate are respectively distributed to the front face and the back face of the wiring substrate; and    wherein the main wiring patterns and the branch wiring patterns are respectively connected to the substrate side wiring patterns at the two sides of the rectangular opening.    
     
     
         12 . The probe device according to    claim 1   , further comprising: 
 a plurality of the contact probes arranged such that axial lines of the contact pins are substantially vertical to a contact face of an object of measurement, and the plurality of contact probes are disposed in parallel so as to provide spaces between respective faces of the films of the plurality of contact probes.    
     
     
         13 . The probe device according to    claim 12   , wherein a direction of bending of the contact pins of the plurality of the contact probes when a buckling load is applied is configured to be substantially constant.  
     
     
         14 . The probe device according to    claim 13   , wherein a position of buckling points in axial line directions of the contact pins of the plurality of the contact probes is configured to be substantially constant.  
     
     
         15 . The probe device according to    claim 13   , further comprising: 
 a metal film disposed on a back side the contact pins of the plurality of the contact probes at a specified position in an axial line direction, and which is subjected to a half-etching treatment.    
     
     
         16 . A contact probe comprising: 
 a first contact probe, including,    a first film, and    a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins; and    a second contact probe connected to the first contact probe, including,    a second film, and    a plurality of second wiring patterns formed on the second film;    wherein the plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.    
     
     
         17 . The contact probe according to the    claim 16   , wherein the plurality of first wiring patterns are densely formed, the plurality of second wiring patterns are densely formed at a vicinity of the connection to the plurality of first wiring patterns, and the plurality of second wiring patterns are coarsely formed at a position remote from the vicinity of the connection to the plurality of first wiring patterns.  
     
     
         18 . The contact probe according to the    claim 16   , wherein the plurality of first wiring patterns are formed densely at front end portions thereof and are coarsely formed at rear end portions thereof, and the plurality of second wiring patterns are coarsely formed and connected to the first wiring patterns at the rear end portions thereof.  
     
     
         19 . The contact probe according to    claim 17   , wherein an area of the first contact probe is configured to be smaller than an area of the second contact probe.  
     
     
         20 . The contact probe according to    claim 18   , further comprising: 
 an anisotropic conductive tape connecting the first contact probe and the second contact probe such that a face of the first contact probe where the plurality of first wiring patterns are formed is opposed to a face of the second contact probe where the plurality of second wiring patterns are formed.