Wafer carrier rinsing mechanism

Abstract

A carrier rinse unit comprising a plurality of nozzles prepositioned to eject a cleaning fluid against a surface of a wafer while the wafer is rotated within a wafer carrier. The prepositioned nozzles may be angled to spray a leading edge, a trailing edge, an outer edge of the wafer, or any desired point on the surface of the wafer.

1 . An apparatus for removing foreign materials from a semiconductor wafer during a polishing process, comprising: 
 a rotatable wafer carrier for holding the wafer in place; and    a washer assembly having a plurality of prepositioned nozzles for ejecting a fluid against a surface of the wafer while the carrier is rotating in order to cleanse the surface.    
     
     
         2 . The apparatus of    claim 1   , wherein the prepositioned nozzles comprise a first set of nozzles positioned for spraying a leading edge of the wafer surface.  
     
     
         3 . The apparatus of    claim 2   , wherein the prepositioned nozzles comprise a second set of nozzles positioned for spraying a trailing edge of the wafer surface.  
     
     
         4 . The apparatus of    claim 1   , wherein the prepositioned nozzles are grouped into a plurality of nozzle banks extending outward from a center point.  
     
     
         5 . The apparatus of    claim 1   , wherein the prepositioned nozzles are oriented outward in order to force foreign materials towards an edge of the wafer surface.  
     
     
         6 . The apparatus of    claim 1   , wherein each prepositioned nozzle generates a unique spray pattern such that the fluid from any two nozzles do not interfere with each other.  
     
     
         7 . The apparatus of    claim 1   , wherein the prepositioned nozzles include a center nozzle that ejects fluid straight up.  
     
     
         8 . A carrier rinse mechanism for cleaning a wafer supported by a wafer carrier, comprising: 
 a first plurality of nozzle banks for ejecting fluid toward a surface of the wafer, wherein said first plurality of nozzle banks are angled in a first direction to spray a leading edge of the wafer surface; and    a second plurality of nozzle banks for ejecting fluid toward a surface of the wafer, wherein said first plurality of nozzle banks are angled in a second direction to spray a trailing edge of the wafer surface.    
     
     
         9 . The carrier rinse mechanism of    claim 8   , wherein a third plurality of nozzle banks are angled outward to in order to force foreign materials towards an edge of the wafer surface.  
     
     
         10 . The carrier rinse mechanism of    claim 8   , wherein a fourth plurality of nozzle banks eject their fluid in a generally upward direction.  
     
     
         11 . A method for removing foreign materials from a wafer during a chemical mechanical polishing process, comprising the steps of: 
 securing the wafer in a wafer carrier;    positioning the wafer carrier proximate a polishing mechanism;    polishing a surface of the wafer for a predetermined time;    moving the wafer carrier proximate a carrier rinse unit;    rotating the wafer relative to a carrier rinse unit; and    spraying the wafer with a fluid from the carrier rinse unit, wherein the unit includes a first plurality of nozzle banks angled in a first direction to spray a leading edge of the wafer surface as the wafer rotates.    
     
     
         12 . The method of    claim 11   , wherein the carrier rinse unit comprises a second plurality of nozzle banks angled in a second direction to spray a trailing edge of the wafer surface.  
     
     
         13 . The method of    claim 11   , wherein the carrier rinse unit comprises a third plurality of nozzle banks angled in an outward direction to spray the foreign material off an edge of the wafer.  
     
     
         14 . The method of    claim 11   , further comprising the steps, prior to the securing step, of: 
 moving the wafer carrier proximate the carrier rinse unit; and    spraying the carrier with a fluid from the rinse unit.