Retention of a polishing pad on a platen

Abstract

A polishing pad is retained on a platen by structures which do not require adhesive. In one embodiment, a polishing pad has a top polishing surface and an undersurface. The undersurface has a surface profile which is configured to interfit with a complementary surface profile on a platen. The surface profile of the undersurface may comprise an array of parallel ridges and grooves.

We claim:  
     
         1 . A polishing pad which can be mounted on a platen, the polishing pad comprising: 
 a top polishing surface and an undersurface, the undersurface having a surface profile which is configured to interfit with a complementary surface profile on the platen.    
     
     
         2 . The polishing pad of    claim 1    wherein the surface profile of the undersurface comprises an array of parallel ridges and grooves.  
     
     
         3 . The polishing pad of    claim 2    wherein the difference in widths of each ridge or groove on the polishing pad forming a mating pair with a corresponding groove or ridge on the platen is less than about 5 percent of the width of the larger of the pair.  
     
     
         4 . The polishing pad of    claim 2    wherein each of the ridges has a height of about 0.025 inch and a width of about 0.090 inch and each of the grooves has a depth of about 0.025 inch and a width of about 0.095 inch.  
     
     
         5 . The polishing pad of    claim 1    wherein the surface profile of the undersurface comprises a portion of a hook and loop fastener.  
     
     
         6 . The polishing pad of    claim 1    wherein the surface profile of the undersurface comprises a textured surface.  
     
     
         7 . A platen for receiving a polishing pad, the platen comprising a front face having a surface profile which is configured to interfit with a complementary surface profile on the polishing pad.  
     
     
         8 . The platen of    claim 7    wherein the surface profile of the front face comprises an array of parallel ridges and grooves.  
     
     
         9 . The platen of    claim 8    wherein the difference in widths of each ridge or groove on the platen forming a mating pair with a corresponding groove or ridge on the polishing pad is less than about 5 percent of the width of the larger of the pair.  
     
     
         10 . The platen of    claim 8    wherein each of the ridges has a height of about 0.025 inch and a width of about 0.090 inch and each of the grooves has a depth of about 0.025 inch and a width of about 0.095 inch.  
     
     
         11 . The platen of    claim 7    wherein the surface profile of the front face comprises a portion of a hook and loop fastener.  
     
     
         12 . The platen of    claim 7    wherein the surface profile of the front face comprises a textured surface.  
     
     
         13 . A polishing apparatus comprising: 
 a platen having a front face and a surface profile on the front face; and    a polishing pad having an undersurface with a surface profile which is configured to interfit with the surface profile on the platen.    
     
     
         14 . The polishing apparatus of    claim 13    wherein the surface profiles comprise an array of parallel ridges and grooves.  
     
     
         15 . The polishing apparatus of    claim 14    wherein the difference in widths of each ridge or groove on the platen forming a mating pair with a corresponding groove or ridge on the polishing pad is less than about 5 percent of the width of the larger of the pair.  
     
     
         16 . The polishing apparatus of    claim 14    wherein each of the ridges has a height of about 0.025 inch and a width of about 0.090 inch and each of the grooves has a depth of about 0.025 inch and a width of about 0.095 inch.  
     
     
         17 . The polishing apparatus of    claim 13    wherein the surface profiles comprise a hook and loop fastener.  
     
     
         18 . The polishing apparatus of    claim 13    wherein the surface profiles comprise textured surfaces.  
     
     
         19 . A platen for receiving a polishing pad, the platen comprising a microporous material.  
     
     
         20 . A polishing apparatus comprising: 
 a platen comprising microporous material, the platen having a front face and a back face;    a polishing pad in contact with the front face; and    a vacuum generator connected to the back face for applying a vacuum to the microporous material, wherein the vacuum is communicated through the microporous material to the front face, thereby adhering the polishing pad to the front face.    
     
     
         21 . The polishing apparatus of    claim 20    further comprising a surface profile on the front face of the platen; and 
 a surface profile on the undersurface of the polishing pad which is configured to interfit with the surface profile on the platen.  
 
     
     
         22 . A polishing pad comprising a top polishing surface and a non-porous polymeric undersurface for attachment to a platen.  
     
     
         23 . A platen comprising a non-porous polymeric front face for receiving a polishing pad.  
     
     
         24 . A polishing apparatus comprising: 
 a platen having a front face,    a polishing pad having a non-porous polymeric surface layer arranged in confronting relationship to the front face of the platen; and    a liquid layer disposed between the front face of the platen and the surface layer of the polishing pad, wherein the polishing pad is adhered to the platen by capillary attraction of the liquid layer for the front face and the surface layer.    
     
     
         25 . The polishing apparatus of    claim 24    wherein the front face of the platen has a non-porous polymeric surface layer, and the liquid layer is disposed between the surface layer of the platen and the surface layer of the polishing pad.  
     
     
         26 . The polishing apparatus of    claim 25    further comprising a surface profile on the surface layer of the platen; and 
 a surface profile on the surface layer of the polishing pad which is configured to interfit with the surface profile On the platen.  
 
     
     
         27 . A polishing pad comprising a top polishing surface and a electrostatic polymeric undersurface for attachment to a platen.  
     
     
         28 . A platen comprising an electrostatic polymeric front face for receiving a polishing pad.  
     
     
         29 . A polishing apparatus comprising: 
 a platen and a polishing pad each having a polymeric surface layer which can hold a static electrical charge, the surface layers being in contact with each other, wherein the polishing pad is adhered to the platen by electrostatic forces between the surface layer of the polishing pad and the surface layer of the platen.    
     
     
         30 . The polishing apparatus of    claim 29    further comprising a surface profile on the surface layer of the platen; and 
 a surface profile on the surface layer of the polishing pad which is configured to interfit with the surface profile on the platen.  
 
     
     
         31 . A platen comprising a textured front face for receiving a polishing pad.  
     
     
         32 . The platen of    claim 31    wherein the texture is arranged to offset a rotational force produced when the polishing pad is applied to a workpiece.  
     
     
         33 . A platen comprising a front face having a plurality of pins extending therefrom for engaging the undersurface of the polishing pad.  
     
     
         34 . The platen of    claim 33    wherein the pins are arranged to offset a rotational force produced when the polishing pad is applied to a workpiece.  
     
     
         35 . A polishing apparatus comprising: 
 a platen comprising an air-permeable material, the platen having a back face and a textured front face;    a polishing pad having an undersurface in contact with the front face; and    a vacuum generator connected to the back face for applying a vacuum through the air-permeable material, wherein the vacuum is communicated through the air-permeable material to the front face of the platen, thereby adhering the polishing pad to the platen and the texture on the front face additionally stabilizing the polishing pad.    
     
     
         36 . The polishing apparatus of    claim 35    wherein the air-permeable material is a microporous material.  
     
     
         37 . The polishing apparatus of    claim 35    wherein the air-permeable material is a material comprising at least one aperture connecting the back face and the front face.  
     
     
         38 . The polishing apparatus of    claim 35    wherein the texture on the front face of the platen is arranged to offset a rotational force produced when the polishing pad is applied to a workpiece.  
     
     
         39 . The polishing apparatus of    claim 35    wherein the undersurface of the polishing pad is capable of being deformed or penetrated by the textured front face of the platen.  
     
     
         40 . A polishing apparatus comprising: 
 a platen comprising an air-permeable material, the platen having a back face and a front face comprising a plurality of pins extending therefrom;    a polishing pad having an undersurface in contact with the front face; and    a vacuum generator connected to the back face for applying a vacuum through the air-permeable material, wherein the vacuum is communicated through the air-permeable material to the front face of the platen, thereby adhering the polishing pad to the platen and the pins on the front face additionally stabilizing the polishing pad.    
     
     
         41 . The polishing apparatus of    claim 40    wherein the air-permeable material is a microporous material.  
     
     
         42 . The polishing apparatus of    claim 40    wherein the air-permeable material is a material comprising at least one aperture connecting the back face and the front face.  
     
     
         43 . The polishing apparatus of    claim 40    wherein the pins on the front face of the platen are arranged to offset a rotational force produced when the polishing pad is applied to a workpiece.  
     
     
         44 . The polishing apparatus of    claim 40    wherein the undersurface of the polishing pad is capable of being deformed or penetrated by the pins.