US2001052653A1PendingUtilityA1

Semiconductor device and method of producing the same

38
Priority: Nov 17, 1998Filed: Jul 13, 2001Published: Dec 20, 2001
Est. expiryNov 17, 2018(expired)· nominal 20-yr term from priority
Inventors:Mitsuo AbeYoshihiro KubotaYoshitsugu KatohMichio HayakawaRyuji NomotoMitsutaka SatoSeiichi OrimoHiroshi InoueToshio Hamano
H10W 90/754H10W 90/734H10W 74/00H10W 72/07353H10W 72/5363H10W 72/951H10W 72/931H10W 72/884H10W 72/536H10W 72/334H10W 72/075H10W 40/10H10W 74/117H04N 23/55H04N 23/54
38
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Claims

Abstract

A semiconductor device and a method of producing the semiconductor device are provided. This semiconductor device includes a semiconductor chip, a printed wiring board, a heat spreader, a sealing resin, and solder balls. The printed wiring board is provided with the solder balls on an outer portion and a wiring layer on an inner portion. Wires are bonded to the wiring layer, and an opening is formed in the center of the printed wiring board. The heat spreader is bonded to the printed wiring board, with the semiconductor chip being thermally connected to the stage portion of the heat spreader. The sealing resin is made up of a first sealing resin portion and a second sealing resin portion. The first and second sealing resin portions sandwich the heat spreader.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A semiconductor device comprising: 
 a semiconductor chip;    a heat spreading plate having a stage portion, the semiconductor chip being mounted on the heat spreading plate;    a wiring board supported by the heat spreading plate; and    a sealing resin which seals the semiconductor chip and the heat spreading plate so that the stage portion is exposed from the sealing resin.    
     
     
         2 . The semiconductor device according to    claim 1   , wherein: 
 the wiring board includes a first wiring layer formed on a packaging side surface of the wiring board, and an opening portion through which the semiconductor chip is mounted; and    the first wiring layer includes an outer portion having external connecting terminals, and an inner portion having wires electrically connected to the semiconductor chip.    
     
     
         3 . The semiconductor device according to    claim 1   , wherein: 
 the heat spreading plate further includes a fixed portion on a side surface opposite to a packaging side surface of the wiring board, and connecting portions for connecting the fixed portion and the stage portion; and    the stage portion of the heat spreading plate is sunken from the fixed portion in a position facing an opening portion of the wiring board, and is thermally connected to the semiconductor chip.    
     
     
         4 . The semiconductor device according to    claim 1   , wherein: 
 the sealing rein includes a first sealing resin portion formed on a semiconductor chip bonding surface of the heat spreading plate, and a second sealing resin portion of the sealing resin formed on a surface opposite to the semiconductor chip bonding surface of the heat spreading plate; and    the stage portion is exposed from the second sealing resin portion.    
     
     
         5 . The semiconductor device according to    claim 1   , wherein the wiring board is a film-type board having a tape material as a base material.  
     
     
         6 . The semiconductor device according to    claim 1   , wherein the wiring board is an inorganic board made of an inorganic material.  
     
     
         7 . The semiconductor device according to    claim 1   , wherein a first resist is formed on a packaging side surface of the wiring board, and a second resist is formed on a side surface opposite to the packaging side surface of the wiring board.  
     
     
         8 . The semiconductor device according to    claim 1   , wherein the heat spreading plate extends to an edge of the wiring board.  
     
     
         9 . The semiconductor device according to    claim 3   , wherein an elastic portion is formed at each of the connecting portions connecting the fixed portion and the stage portion.  
     
     
         10 . The semiconductor device according to    claim 4   , wherein the stage portion protrudes from a surface of the second sealing resin portion.  
     
     
         11 . The semiconductor device according to    claim 4   , wherein an area of the second sealing resin portion is smaller than an area of the wiring board.  
     
     
         12 . The semiconductor device according to    claim 2   , wherein the wiring board further includes a second wiring layer formed on a side surface opposite to the packaging side surface of the wiring board.  
     
     
         13 . The semiconductor device according to    claim 1   , wherein the wiring board has a laminated structure.  
     
     
         14 . The semiconductor device according to    claim 1   , wherein the heat spreading plate has an anchor portion to be wedged into the wiring board.  
     
     
         15 . The semiconductor device according to    claim 2   , wherein the heat spreading plate has an engaging portion for engaging the heat spreading plate with a rim of the opening portion.  
     
     
         16 . The semiconductor device according to    claim 2   , wherein the heat spreading plate is disposed in a position opposite to a bonding position of the wires to the wiring board.  
     
     
         17 . The semiconductor device according to    claim 3   , wherein the connecting portions extend outward from the rim of the opening portion formed in the wiring board.  
     
     
         18 . The semiconductor device according to    claim 1   , wherein a thin portion is formed on an outer periphery of the heat spreading plate.  
     
     
         19 . The semiconductor device according to    claim 1   , wherein a thin portion is formed on an outer periphery of the wiring board.  
     
     
         20 . The semiconductor device according to    claim 1   , wherein the stage portion is provided with a vent hole for releasing vapor existing inside the semiconductor device upon packaging.  
     
     
         21 . The semiconductor device according to    claim 20   , wherein the stage portion is provided with a tape member for blocking the vent hole on a semiconductor chip mounting side.  
     
     
         22 . The semiconductor device according to    claim 20   , wherein the stage portion is provided with a tape member for blocking the vent hole on an opposite side to a semiconductor chip mounting side.  
     
     
         23 . The semiconductor device according to    claim 1   , wherein the stage portion has a plating portion having corrosion resistance on an exposed region of the stage portion from the sealing resin.  
     
     
         24 . The semiconductor device according to    claim 4   , wherein the wiring board has solder balls as external connecting terminals, and the first sealing resin portion has a protruding portion protruding from the wiring board.  
     
     
         25 . A method of producing a semiconductor device, comprising the steps of: 
 forming a wiring board having a first wiring layer and an opening portion;    forming a heat spreading plate having a fixed portion and a stage portion;    temporarily fixing the heat spreading plate to the wiring board, with the stage portion facing the opening portion;    mounting a semiconductor chip to the stage portion;    forming a sealing resin for permanently fixing the heat spreading plate to the wiring board, with the stage portion being exposed from the sealing resin; and    cutting collectively the heat spreading plate, the wiring board, and the sealing resin, to form individual semiconductor devices.    
     
     
         26 . The method according to    claim 25   , wherein: 
 the first wiring layer of the wiring board includes an outer portion provided with external connecting terminals, and an inner portion having wires electrically connected to the semiconductor chip;    the semiconductor chip is mounted through the opening portion; and    the first wiring layer is formed on a packaging side surface of the wiring board.    
     
     
         27 . The method according to    claim 25   , wherein: 
 the fixed portion of the heat spreading plate is fixed to the wiring board;    the stage portion is sunken from the fixed portion; and    the heat spreading plate further includes connecting portions for connecting the fixed portion and the stage portion.    
     
     
         28 . The method according to    claim 26   , further comprising the step of bonding wires between the semiconductor chip and the first wiring layer provided to the wiring board.  
     
     
         29 . The method according to    claim 25   , the sealing resin includes a first sealing resin portion for sealing the semiconductor chip mounted onto the heat spreading plate, and a second sealing resin portion on a surface opposite to a semiconductor chip boding surface of the heat spreading plate.  
     
     
         30 . The method according to    claim 27   , wherein the step of forming the heat spreading plate includes the step-of forming slits for reducing stress at junctions of the connecting portions and the fixed portion and at junctions of the connecting portions and the stage portion.  
     
     
         31 . The method according to    claim 25   , wherein the step of forming the heat spreading plate includes the step of forming an anchor hole for improving sealing between the wiring board and the sealing resin.  
     
     
         32 . The method according to    claim 25   , wherein the step of forming the heat spreading plate includes the step of forming a slit hole along a cutting position where cutting is to be carried out in the cutting step.  
     
     
         33 . The method according to    claim 25   , wherein the step of forming the heat spreading plate includes the step of forming an irregular surface portion on a semiconductor chip mounting surface of the stage portion.  
     
     
         34 . The method according to    claim 25   , wherein the step of forming the wiring board includes the step of forming gaps where no bonding pads exist within a bonding pad forming region, the bonding pads being arranged in a grid pattern.  
     
     
         35 . The method according to    claim 25   , wherein: 
 the step of forming the wiring board includes the step of forming a dummy pattern in a position where the bonding pads do not exist on the wiring board; and    the step of temporarily fixing the heat spreading plate includes the step of fixing the dummy pattern and the fixed portion of the heat spreading plate by welding.    
     
     
         36 . The method according to    claim 25   , wherein: 
 a plurality of semiconductor chips are provided to the wiring board and the heat spreading plate; and    the step of forming the sealing resin includes the step of forming a large-area sealing resin collectively on surfaces of the wiring board and the heat spreading plate.    
     
     
         37 . The method according to    claim 25   , wherein the sealing resin is formed by a transfer molding method or a screen printing method.

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