Component for use in forming printed circuit boards

Abstract

A component for use in manufacturing printed circuits that in a finished printed circuit constitutes a functional element. The component is comprised of a film substrate formed of a first polymeric material having a first side and a second side. At least one layer of a tiecoat metal is applied to the first side of the film substrate. At least one layer of copper on the at least one layer of a tiecoat metal, the layer of copper having an essentially uncontaminated exposed surface facing away from the at least one layer of tiecoat metal. A plurality of spaced apart, adhesion promoting areas of a tiecoat metal are provided on the second side of the film substrate defining regions of exposed polymeric material on the second side of the film substrate.

1 . A component for use in manufacturing printed circuits that in a finished printed circuit constitutes a functional element, said component comprised of: 
 a film substrate formed of a first polymeric material having a first side and a second side;    at least one layer of a tiecoat metal applied to said first side of said film substrate;    at least one layer of copper on said at least one layer of a tiecoat metal, said layer of copper having an essentially uncontaminated exposed surface facing away from said at least one layer of tiecoat metal; and    a plurality of spaced apart, discrete, adhesion promoting areas formed of a tiecoat metal on said second side of said film substrate, said adhesion promoting areas defining regions of exposed polymeric material on said second side of said film substrate.    
     
     
         2 . A component as defined in  claim 1 , wherein said first polymeric material is polyimide.  
     
     
         3 . A component as defined in  claim 2 , wherein said adhesion promoting areas define a continuous region of exposed polymeric material.  
     
     
         4 . A component as defined in  claim 2 , wherein said tiecoat metal is selected from the group consisting of chromium, nickel, titanium, aluminum, molybdenum, tantalum, gold, tin, indium, vanadium, silicon, iron, copper and alloys thereof.  
     
     
         5 . A component as defined in  claim 4 , wherein said tiecoat has a thickness of between 0Å and about 500Å.  
     
     
         6 . A component as defined in  claim 5 , wherein said copper layer has a thickness between about 0.1 μm and about 70 μm.  
     
     
         7 . A component as defined in  claim 6 , wherein said copper layer has a thickness of about 0.2 μm.  
     
     
         8 . A component as defined in  claim 6 , wherein said polyimide film has a thickness of between about 12.5 μm and about 125 μm.  
     
     
         9 . A component as defined in  claim 1 , wherein said first polymeric material is a polyimide, and said component is further comprised of a dimensionally stable adhesive film applied to said second side of said film substrate.  
     
     
         10 . A component as defined in  claim 9 , wherein said adhesive is selected from the group consisting of acrylics, epoxies, nitrite rubbers, phenolics, polyamides, polyarylene ethers, polybenzimidazoles, polyesters, polyimides, polyphenylquinoxalines, polyvinyl acetals, polyurethanes, silicones, vinyl-phenolics, urea-formaldehyde and combinations thereof.  
     
     
         11 . A component as defined in  claim 10 , wherein said adhesive film is an epoxy having a thickness between about 1 mil to about 3 mils.  
     
     
         12 . A component as defined in  claim 9 , further comprising a metal support substrate that constitutes a discardable element in the formation of a printed circuit board, one surface of said metal support substrate being essentially uncontaminated and engageable with said layer of copper, said support substrate attached to said layer of copper at its periphery to define a substantially uncontaminated central zone of copper inwardly of the edges of the copper layer.  
     
     
         13 . A component for use in manufacturing printed circuits that in a finished printed circuit constitutes a functional element, said component comprised of: 
 a film substrate formed of a first polymeric material having a first side and a second side;    at least one layer of a tiecoat metal applied to said first side of said film substrate;    at least one layer of copper on said at least one layer of a tiecoat metal, said layer of copper having an essentially uncontaminated exposed surface facing away from said at least one layer of tiecoat metal; and    a plurality of spaced apart, discrete, adhesion promoting areas formed of a tiecoat metal on said second side of said film substrate, said adhesion promoting areas defining regions of exposed polymeric material on said second side of said film substrate;    an uncured adhesive on said second side of said film substrate; and    a metal support substrate that constitutes a discardable element in the formation of a printed circuit board, one surface of said metal support substrate being essentially uncontaminated and engageable with said layer of copper, said support substrate attached to said layer of copper at its periphery to define a substantially uncontaminated central zone of copper inwardly of the edges of the copper layer.    
     
     
         14 . A multi-layer printed circuit, comprising: 
 a) an inner core formed from one or more printed circuit laminates, said printed circuit laminates comprised of a core substrate having a first surface with a strip conductor disposed thereon, and    b) at least one surface laminate, comprised of:    a film substrate formed of a first polymeric material;    at least one layer of a flash metal applied to a first side of said film substrate;    at least one layer of copper on said layer of flash metal;    a plurality of spaced apart, discrete, adhesion promoting areas formed of a metal or metal alloy on the second side of said film substrate; and    an adhesive layer between said surface laminate and said inner core.    
     
     
         15 . A multi-layer printed circuit as defined in  claim 14 , wherein said inner core is comprised of a reinforced polymer.  
     
     
         16 . A multi-layer printed circuit as defined in  claim 14 , wherein said inner core is comprised of a non-reinforced polymer.  
     
     
         17 . A method of forming a multi-layer printed circuit, comprising the steps of: 
 a) forming an inner core from one or more printed circuit laminates, each of said printed circuit laminates having a core substrate and a first surface with a strip conductor disposed thereon;    b) forming at least one surface laminate, said surface laminate comprised of:    a film substrate formed of a first polymeric material;    at least one layer of a flash metal applied to a first side of said film substrate;    at least on layer of copper on said layer of flash metal;    a plurality of spaced apart, discrete, adhesion promoting areas formed of a metal or metal alloy on the second side of said film substrate;    an adhesive layer between said surface laminate and said inner core; and    c) compressing said inner core and said surface laminate together under conditions of heat and pressure to create a first multi-layer printed circuit.    
     
     
         18 . A method as defined in  claim 17 , further comprising the step of: 
 d) forming a strip conductor from the layer of copper on the at least one surface laminate.    
     
     
         19 . A method as defined in  claim 17 , further comprising the step of: 
 e) drilling a through hole through said surface laminate connecting a strip conductor on said inner core with a strip conductor on said surface laminate.