Assignee
GA TEK INC
US·22 granted patents·7 pending applications·448 citations·filing 1994–2003
Top patents by PatentIndex Score
29 records- 0187US6284982B1Method and component for forming an embedded resistor in a multi-layer printed circuitGA TEK INC·Filed 2000·Granted Sep 4, 2001·33 cites·5 claims
- 0285US6224951B1Method of forming a flexible laminate for flexible circuitGA TEK INC·Filed 2000·Granted May 1, 2001·28 cites·13 claims
- 0383US6132851AAdhesive compositions and copper foils and copper clad laminates using sameGA TEK INC·Filed 1994·Granted Oct 17, 2000·27 cites·19 claims
- 0482US6296949B1Copper coated polyimide with metallic protective layerGA TEK INC·Filed 1999·Granted Oct 2, 2001·58 cites·19 claims
- 0581US6132589ATreated copper foil and process for making treated copper foilGA TEK INC·Filed 1998·Granted Oct 17, 2000·39 cites·11 claims
- 0675US6426146B1Treated copper foil and process for making treated copper foilGA TEK INC·Filed 2000·Granted Jul 30, 2002·19 cites·18 claims
- 0771US5939043AProcess for preparing Lix Mn2 O4 intercalation compoundsGA TEK INC·Filed 1998·Granted Aug 17, 1999·45 cites·15 claims
- 0869US6824880B1Process for improving adhesion of resistive foil to laminating materialsGA TEK INC·Filed 2003·Granted Nov 30, 2004·17 cites·40 claims
- 0966US6341698B1Sheet stacking deviceGA TEK INC·Filed 1999·Granted Jan 29, 2002·23 cites·19 claims
- 1065US6117536AAdhesion promoting layer for use with epoxy prepregsGA TEK INC·Filed 1998·Granted Sep 12, 2000·20 cites·21 claims
- 1163US6146480AFlexible laminate for flexible circuitGA TEK INC·Filed 1999·Granted Nov 14, 2000·20 cites·10 claims
- 1262US6537675B1Protective coatings for improved tarnish resistance in metal foilsGA TEK INC·Filed 2000·Granted Mar 25, 2003·6 cites·27 claims
- 1360US6379487B1Component of printed circuit boardGA TEK INC·Filed 2000·Granted Apr 30, 2002·2 cites·7 claims
- 1460US6103135AMulti-layer laminate and method of producing sameGA TEK INC·Filed 1999·Granted Aug 15, 2000·26 cites·15 claims
- 1558US6316733B1Component for use in forming printed circuit boardsGA TEK INC·Filed 2000·Granted Nov 13, 2001·6 cites·13 claims
- 1656US6238778B1Component of printed circuit boardsGA TEK INC·Filed 1998·Granted May 29, 2001·15 cites·10 claims
- 1754US6361673B1Electroforming cellGA TEK INC·Filed 2000·Granted Mar 26, 2002·7 cites·20 claims
- 1854US6048646AMethod for treating copper current collectors for Li-ion and/or Li-ion polymer batteriesGA TEK INC·Filed 1998·Granted Apr 11, 2000·29 cites·8 claims
- 1950US6056185AMethod of connecting batteries to electronic circuitsGA TEK INC·Filed 1999·Granted May 2, 2000·15 cites·1 claims
- 2040US2001006740A1Component of printed circuit boardsGA TEK INC·Filed 2001·Application pending·0 cites
- 2140US2002050400A1Method and component for forming an embedded resistor in a multi-layer printed circuitGA TEK INC·Filed 2001·Application pending·0 cites
- 2240US2002020553A1Method and component for forming an embedded resistor in a multi-layer printed circuitGA TEK INC·Filed 2001·Application pending·0 cites
- 2339US2002020549A1Component for use in forming printed circuit boardsGA TEK INC·Filed 2001·Application pending·0 cites
- 2437US2002071637A1Packaging for fiber optic deviceGA TEK INC·Filed 2000·Application pending·0 cites
- 2535US6168703B1Copper foil and laminate containing a hydrogen inhibitorGA TEK INC·Filed 1999·Granted Jan 2, 2001·5 cites·12 claims
- 2632US6163208AOne bit digital phase shift keyed carrier recovery and demodulator circuitGA TEK INC·Filed 1998·Granted Dec 19, 2000·7 cites·18 claims
- 2731US2002021204A1Method and component for forming an embedded resistor in a multi-layer printed circuitGA TEK INC·Filed 2001·Application pending·0 cites
- 2828US6183607B1Anode structure for manufacture of metallic foilGA TEK INC·Filed 1999·Granted Feb 6, 2001·1 cites·20 claims
- 2928US2002146556A1Resistor foilGA TEK INC·Filed 2001·Application pending·0 cites
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