Gate driver multi-chip module

Abstract

A multi-chip module (MCM) provides power circuitry on a computer motherboard in a package of reduced size without sacrificing performance. The MCM co-packages essential power circuit components on a ball grid array (BGA) substrate. Two power MOSFETs disposed on the BGA substrate are connected in a half-bridge arrangement between an input voltage and ground. A MOSFET gate driver is electrically connected to respective gate inputs of the two power MOSFETs for alternately switching the power MOSFETs to generate an alternating output voltage at a common output node between the power MOSFETs. At least one Schottky diode is disposed on the BGA substrate and connected between the common output node and ground to minimize losses during deadtime conduction periods. The input capacitor of the circuit is contained within the MCM housing and is located close to the MOSFETs, reducing stray inductance in the circuit. The MCM package is thin and has dimensions of about 1 cm by 1 cm or less.

What is claimed is:  
     
         1 . A multi-chip module (MCM) for providing power circuitry on a computer motherboard, comprising: 
 a ball grid array (BGA) substrate;    two power MOSFETs disposed on the BGA substrate and connected in a half-bridge arrangement between an input voltage and ground;    a MOSFET gate driver disposed on the BGA substrate and electrically connected to respective gate inputs of the two power MOSFETs for alternatively switching the power MOSFETs to generate an alternating output voltage at a common output node between the power MOSFETs; and    at least one diode disposed on the BGA substrate and connected between the common output node and ground to minimize losses during deadtime conduction periods; and    an input capacitor disposed on the substrate and connected between the input voltage and ground.    
     
     
         2 . The module of  claim 1 , further comprising another diode connected in parallel with the diode connected between the common output node and between the common output node and ground.  
     
     
         3 . The module of  claim 1 , wherein the substrate has an area of about 1 cm by 1 cm or less.  
     
     
         4 . The module of  claim 1 , wherein the input capacitor is spaced from the MOSFETs by less than 1 cm.  
     
     
         5 . The module of  claim 1 , wherein the input capacitor is located adjacent the first and second MOSFETs.  
     
     
         6 . The module of  claim 1  which further includes an insulation housing enclosing the substrate, the MOSFETs, the gate driver and the at least one diode, the ball grid array being exposed through the bottom of the housing for mounting to a mother board.  
     
     
         7 . The module of  claim 6 , wherein the housing has an area of about 1 cm by 1 cm or less.  
     
     
         8 . The module of  claim 6 , wherein the input capacitor is located adjacent the first and second MOSFETs.