Method for mounting parts, and IC card and manufacturing method thereof

Abstract

The present invention provides a method for mounting parts, and an IC card and its manufacturing method, capable of reducing the number of steps, increasing productivity, reducing in costs, and miniaturizing the chip. For this purpose, in the present invention, a first electrode ( 7 a ) of the IC chip ( 4 ) for processing signals received from a coil ( 3 ) is connected to an internal end ( 3 b ) of a coil pattern ( 2 ) formed on a first substrate ( 1 a ), and an external end ( 3 a ) of the coil pattern ( 2 ) and a second electrode ( 7 b ) of the IC chip ( 4 ) are connected via a jumper wiring means ( 8 ).

What is claimed is:  
     
         1 . A method for mounting parts, wherein a circuit is formed by the steps of: 
 printing a circuit pattern on a substrate with a conductive paste;    placing a part on said circuit pattern such that an electrode is connected to the circuit pattern; and    curing said conductive paste to electrically connect the electrode with the circuit pattern.    
     
     
         2 . A method for mounting parts, wherein a circuit is formed by the steps of: 
 printing a circuit pattern on a substrate with a conductive paste;    placing a part having a bump formed on an electrode pad thereof on said circuit pattern such that an electrode is connected to the circuit pattern; and    curing said conductive paste to electrically connect the electrode with the circuit pattern.    
     
     
         3 . The method for mounting parts according to  claim 2 , wherein the bump is formed of metals or by plating.  
     
     
         4 . An IC card which is a non-contact IC card having a coil and an IC chip therewithin and transferring data to and from an outside media via said coil, wherein 
 a first electrode of the IC chip for processing signals received from the coil is connected to an internal end of a coil pattern formed on a substrate, and    an external end of the coil pattern and a second electrode of said IC chip are connected via a jumper wiring means.    
     
     
         5 . The IC card according to  claim 4 , wherein the jumper wiring means is a wire having an insulated covered portion in the middle thereof and exposed conductive portions at both ends thereof, or a foil formed of an insulating sheet attached with a metal film.  
     
     
         6 . A method for manufacturing an IC card, wherein in manufacturing a non-contact IC card having a coil and an IC chip therewithin and transferring data to and from an outside media via said coil, the method comprises the steps of: 
 printing a circuit pattern including a coil pattern on a substrate with a conductive paste;    placing the IC chip on said circuit pattern such that an electrode is connected to the circuit pattern; and    placing a jumper wiring means for connecting over the coil an electrode pad at an external end of said coil to an electrode pad drawn out of the IC chip or a signal line to said IC chip, before said conductive paste is cured; and    curing said conductive paste.    
     
     
         7 . A method for manufacturing an IC card, wherein in manufacturing a non-contact IC card having a coil and an IC chip therein and transferring data to and from an outside media via said coil, the method comprises the steps of: 
 printing a circuit pattern including the coil pattern on the substrate by means of the conductive paste;    placing the IC chip on said circuit pattern such that an electrode is connected to the circuit pattern; and    placing a jumper wiring means for connecting over the coil an electrode pad at an external end of said coil to an electrode pad drawn out of the IC chip, after the conductive paste is cured.    
     
     
         8 . The method for manufacturing the IC card according to  claim 7 , wherein the IC card is configured by: printing a pattern with insulating ink at a portion of the coil crossing over the jumper wiring means, said pattern linking the electrode pad at the external end of the coil and the electrode pad drawn out of the IC chip; and printing conductive ink over said pattern.  
     
     
         9 . A method for manufacturing the IC card, wherein in manufacturing a non-contact IC card having a coil and an IC chip therewithin and transferring data to and from an outside media via said coil, the method comprises the steps of: 
 printing a circuit pattern including the coil pattern on a first substrate with the conductive paste;    placing the IC chip on said circuit pattern such that an electrode is connected to the circuit pattern, and curing said conductive paste;    printing the conductive paste to form a jumper wiring means on a second substrate at a position corresponding to a portion of the first substrate for connecting the electrode pad at the external end of said coil and the electrode pad drawn out of the IC chip over the coil formed on said first substrate, said second substrate being laminated over said first substrate; and    applying said second substrate to said first substrate by way of interposing an insulating film having communicating openings formed at positions corresponding to the electrode pad at the external end of said coil and the electrode pad drawn out of the IC chip between the first and second substrates, and curing the conductive paste in order to connect the electrode of said first substrate and the conductive paste of said second substrate.    
     
     
         10 . A method for manufacturing the IC card, wherein in manufacturing a non-contact IC card having a coil and an IC chip therewithin and transferring data to and from an outside media via said coil, the method comprises the steps of: 
 printing a circuit pattern on a substrate with the conductive paste;    placing the IC chip on said circuit pattern before the conductive paste is cured such that an electrode is connected to the circuit pattern;    curing said conductive paste; and    electrically connecting each end of the coil constituted of a wound line to said circuit pattern.    
     
     
         11 . A method for manufacturing the IC card, wherein in manufacturing a non-contact IC card having a coil and an IC chip therewithin and transferring data to and from an outside media via said coil, the method comprises the steps of: 
 printing a circuit pattern on a substrate with the conductive paste;    placing the IC chip on said circuit pattern before the conductive paste is cured such that an electrode is connected to the circuit pattern;    placing each end of the coil constituted of a wound line on said circuit pattern before the conductive paste is cured; and    curing said conductive paste.