Inventor · disambiguated record
Norihito Tsukahara
Also filed as: TSUKAHARA NORIHITO
41 granted patents·13 pending applications·700 citations·filing 1995–2025
98Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD27PANASONIC IP MAN CO LTD9PANASONIC CORP7TSUKAHARA NORIHITO5KOYAMA MASAYOSHI2
Top patents by PatentIndex Score
54 records- 0197US6531022B1Mounting method of semiconductor elementMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Mar 11, 2003·122 cites·12 claims
- 0295US7229293B2Connecting structure of circuit board and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jun 12, 2007·58 cites·10 claims
- 0390US6780668B1Package of semiconductor device and method of manufacture thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Aug 24, 2004·56 cites·29 claims
- 0490US5686353ASemiconductor device and manufacturing method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Nov 11, 1997·119 cites·12 claims
- 0589US6051093AMounting method of semiconductor elementMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Apr 18, 2000·59 cites·1 claims
- 0688US9162249B2Paste dispenser for applying paste containing fillers using nozzle with pin and application method using the sameKOYAMA MASAYOSHI·Filed 2009·Granted Oct 20, 2015·13 cites·12 claims
- 0785US7935892B2Electronic circuit device and method for manufacturing samePANASONIC CORP·Filed 2006·Granted May 3, 2011·14 cites·11 claims
- 0885US5917156ACircuit board having electrodes and pre-deposit solder receiverMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Jun 29, 1999·62 cites·3 claims
- 0980US7071090B2Semiconductor element having protruded bump electrodesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jul 4, 2006·7 cites·5 claims
- 1079US7186925B2Electronic circuit device and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Mar 6, 2007·18 cites·6 claims
- 1179US6207549B1Method of forming a ball bond using a bonding capillaryMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Mar 27, 2001·45 cites·32 claims
- 1275US7471260B2Semiconductor memory module having built-in antennaPANASONIC CORP·Filed 2006·Granted Dec 30, 2008·7 cites·11 claims
- 1374US9076752B2Semiconductor device and method for manufacturing the samePANASONIC CORP·Filed 2013·Granted Jul 7, 2015·4 cites·13 claims
- 1473US7924228B2Storage medium with built-in antennaPANASONIC CORP·Filed 2006·Granted Apr 12, 2011·8 cites·12 claims
- 1573US7090482B2Semiconductor device package manufacturing method and semiconductor device package manufactured by the methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Aug 15, 2006·17 cites·11 claims
- 1672US8062489B2Method for forming artificial lipid membraneOKI AKIO·Filed 2010·Granted Nov 22, 2011·2 cites·14 claims
- 1767US8025237B2Antenna built-in module, card type information device, and methods for manufacturing themPANASONIC CORP·Filed 2006·Granted Sep 27, 2011·5 cites·9 claims
- 1867US2025226593A1Array antenna structure and array antenna modulePANASONIC IP MAN CO LTD·Filed 2025·Application pending·0 cites
- 1967US2025233322A1Antenna structure and array antenna structurePANASONIC IP MAN CO LTD·Filed 2025·Application pending·0 cites
- 2065US7375421B2High density multilayer circuit moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted May 20, 2008·3 cites·7 claims
- 2164US11745145B2Ion-sensitive substance, ion-sensitive membrane using the same, and method for producing the ion-sensitive substancePANASONIC IP MAN CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·13 claims
- 2264US7176055B2Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 13, 2007·10 cites·26 claims
- 2362US2021348097A1Cell culture chipPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 2461US11773513B2Device and method for manufacturing fiber assemblyPANASONIC IP MAN CO LTD·Filed 2022·Granted Oct 3, 2023·0 cites·5 claims
- 2561US7180749B2Circuit board and its manufacturing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 20, 2007·8 cites·15 claims
- 2660US6232211B1Two-step projecting bump for semiconductor chip and method for forming the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted May 15, 2001·25 cites·19 claims
- 2759US12215448B2Fiber assembly and method for producing fiber assemblyPANASONIC IP MAN CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·5 claims
- 2859US7297876B2Circuit board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Nov 20, 2007·8 cites·6 claims
- 2958US6894387B2Semiconductor element having protruded bump electrodesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 17, 2005·6 cites·17 claims
- 3057US8816481B2Semiconductor device having a porous nickel plating partPANASONIC CORP·Filed 2012·Granted Aug 26, 2014·1 cites·12 claims
- 3157US8237057B2Wiring board and wiring board manufacturing methodHIROSE TAKAYUKI·Filed 2009·Granted Aug 7, 2012·1 cites·22 claims
- 3254US2022073864A1Fiber sheet, method for manufacturing fiber sheet, and cell culture chipPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 3352US7180007B2Electronic circuit device and its manufacturing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Feb 20, 2007·5 cites·8 claims
- 3452US6825055B2Method for assembling integral type electronic component and integral type electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Nov 30, 2004·3 cites·13 claims
- 3552US2021285138A1Fiber mesh sheet, method for manufacturing fiber mesh sheet, and cell culture chip formed of fiber mesh sheetPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 3650US8115109B2Circuit board and method for jointing circuit boardKOYAMA MASAYOSHI·Filed 2009·Granted Feb 14, 2012·0 cites·6 claims
- 3750US7376318B2Circuit board and its manufacturing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2007·Granted May 20, 2008·0 cites·12 claims
- 3849US7233069B2Interconnection substrate and fabrication method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jun 19, 2007·2 cites·20 claims
- 3948US7353600B2Circuit board fabrication method and circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Apr 8, 2008·2 cites·5 claims
- 4048US6971167B2Multilayered circuit board forming method and multilayered circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Dec 6, 2005·2 cites·17 claims
- 4147US7381902B2Wiring board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jun 3, 2008·1 cites·5 claims
- 4247US7084008B2Manufacturing method for electronic component-mounted component, manufacturing method for electronic component-mounted completed product with the electronic component-mounted component, and electronic component-mounted completed productMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Aug 1, 2006·2 cites·12 claims
- 4345US9927400B2Field asymmetric ion mobility spectrometer and method for separating mixture using the samePANASONIC IP MAN CO LTD·Filed 2016·Granted Mar 27, 2018·0 cites·18 claims
- 4443US2005001315A1Method for assembling integral type electronic device, and integral type electronic deviceFiled 2004·Application pending·0 cites
- 4541US2007200217A1Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted componentTSUKAHARA NORIHITO·Filed 2007·Application pending·0 cites
- 4640US9018035B2Pressed-contact type semiconductor device and method for manufacturing the samePANASONIC CORP·Filed 2012·Granted Apr 28, 2015·0 cites·8 claims
- 4740US2007127224A1Electronic circuit device and method of manufacturing the sameTSUKAHARA NORIHITO·Filed 2007·Application pending·0 cites
- 4839US2005093172A1Electronic circuit device, and method and apparatus for manufacturing the sameFiled 2004·Application pending·0 cites
- 4939US2002026703A1Method for mounting parts, and IC card and manufacturing method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Application pending·0 cites
- 5037US6357106B1Method for mounting parts and making an IC cardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Mar 19, 2002·5 cites·4 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →