Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component

Abstract

After a first electronic component is inserted into a base substrate, first circuit patterns are formed on the inserted first electronic component, and then a second electronic component is mounted on the first circuit patterns to complete an electronic component-mounted component. According to the above method, a thickness of a module may be decreased by a thickness of the base substrate. Further, since electronic components are surface-mounted, electronic components of arbitrary sizes and types may be used.

1 - 29 . (canceled)  
   
   
       30 . A method for manufacturing an electronic component-mounted component, comprising: 
 embedding a first electronic component in a sheet-like base substrate by pressing said first electronic component into said sheet-like base substrate;    forming a first circuit pattern on a circuit formation face of said sheet-like base substrate; and    establishing an electrical connection between said first circuit pattern and an electrode of said first electronic component once embedded in said sheet-like base substrate.    
   
   
       31 . The method according to  claim 30 , further comprising: 
 after establishing an electrical connection between said first circuit pattern and said electrode, mounting a second electronic component on said first circuit pattern.    
   
   
       32 . The method according to  claim 31 , further comprising: 
 electrically connecting said first circuit pattern to a conductor in a through hole that extends through said sheet-like base substrate in a thickness direction of said sheet-like base substrate.    
   
   
       33 . The method according to  claim 32 , further comprising: 
 electrically connecting said first circuit pattern to a second circuit pattern, on a face of said sheet-like base substrate that is opposite to said circuit formation face of said sheet-like base substrate, via said conductor in said through hole.    
   
   
       34 . The method according to  claim 33 , further comprising: 
 mounting a third electronic component on said second circuit pattern.    
   
   
       35 . The method according to  claim 32 , further comprising: 
 superposing a first substrate, having a second circuit pattern and a third circuit pattern, and said sheet-like base substrate in a thickness direction of said sheet-like base substrate and said first substrate such that said third circuit pattern and said conductor in said through hole become electrically interconnected; and then    mounting a third electronic component on said second circuit pattern,    wherein said second circuit pattern is spaced from said third circuit pattern in the thickness direction of said first substrate, and said first substrate also has a through hole for electrically interconnecting said second circuit pattern and said third circuit pattern.    
   
   
       36 . The method according to  claim 31 , further comprising: 
 superposing a first substrate, having a second circuit pattern and a third circuit pattern, and said sheet-like base substrate in a thickness direction of said sheet-like base substrate and said first substrate,    wherein said second circuit pattern is spaced from said third circuit pattern in the thickness direction of said first substrate, and said first substrate also has a through hole with a conductor therein electrically interconnecting said second circuit pattern and said third circuit pattern such that an electrode of said second electronic component is electrically connected to said second circuit pattern.    
   
   
       37 . The method according to  claim 30 , further comprising: 
 after embedding said first electronic component in said sheet-like base substrate, exposing said electrode of said first electronic component from a surface of said sheet-like base substrate by performing at least one of polishing processing and plasma discharge processing.    
   
   
       38 . The method according to  claim 37 , wherein 
 said first electronic component comprises a semiconductor device, and said electrode comprises a uniform-height protruding electrode on a surface electrode, such that exposing said electrode from a surface of said sheet-like base substrate comprises exposing said protruding electrode from said surface.    
   
   
       39 . The method according to  claim 37 , further comprising: 
 after exposing said electrode of said first electronic component from said surface of said sheet-like base substrate, printing solder paste or conductive adhesive onto said electrode,    wherein forming a first circuit pattern on a circuit formation face of said sheet-like base substrate comprises heat-hardening said electrode in a high-temperature furnace or in a high-temperature stage after printing the solder paste or conductive adhesive onto said electrode.    
   
   
       40 . The method according to  claim 37 , further comprising: 
 embedding another first electronic component in said sheet-like base substrate, wherein embedding said first electronic component and embedding said another first electronic component in said sheet-like base substrate comprises collectively embedding said first electronic component and said another first electronic component in said sheet-like base substrate;    exposing an electrode of said another first electronic component from said surface of said sheet-like base substrate; and    cutting said sheet-like base substrate into pieces such that said first electronic component and said another first electronic component are separated from each other.    
   
   
       41 . An electronic component-mounted component manufactured by the method of  claim 37 .  
   
   
       42 . The method according to  claim 30 , wherein 
 embedding said first electronic component in said sheet-like base substrate results in said electrode of said first electronic component being exposed from said circuit formation face of said sheet-like base substrate.    
   
   
       43 . The method according to  claim 30 , further comprising: 
 after embedding said first electronic component in said sheet-like base substrate and forming said first circuit pattern, performing lamination processing so as to dispose an insulating protective sheet on a face of said sheet-like base substrate that is opposite said circuit formation face of said sheet-like base substrate.    
   
   
       44 . The method according to  claim 30 , further comprising: 
 superposing said sheet-like base substrate and another sheet-like base substrate having a second electronic component embedded therein and a second circuit pattern on a circuit formation face thereof, with said second circuit pattern and an electrode of said second electronic component being electrically interconnected, thereby providing a stacked sheet-like substrate;    electrically connecting said first circuit pattern to a conductor in a through hole that extends through said sheet-like base substrate in a thickness direction of said sheet-like base substrate;    superposing a first substrate, having a third circuit pattern and a fourth circuit pattern, and said stacked sheet-like substrate in a thickness direction of said stacked sheet-like substrate and said first substrate such that said fourth circuit pattern and said conductor in said through hole become electrically interconnected; then    mounting a third electronic component on said third circuit pattern; and    mounting a fourth electronic component on said second circuit pattern,    wherein said third circuit pattern is spaced from said fourth circuit pattern in the thickness direction of said first substrate, and said first substrate also has a through hole for electrically interconnecting said third circuit pattern and said fourth circuit pattern.    
   
   
       45 . An electronic component-mounted component manufactured by the method of  claim 30 .  
   
   
       46 . A method for manufacturing a circuit component, comprising: 
 embedding a first electronic component in a sheet-like base substrate by pressing said first electronic component into said sheet-like base substrate; then    exposing an electrode of said first electronic component from a surface of said sheet-like base substrate by performing at least one of polishing processing and plasma discharge processing; and then    forming a conductive film on said electrode.    
   
   
       47 . A method for manufacturing a multilayer-laminated electronic component-mounted component, comprising: 
 after manufacturing an electronic component-mounted component by the method of  claim 46 , superposing on one face or both faces of said electronic component-mounted component in a thickness direction thereof, 
 (i) another electronic component-mounted component manufactured by the method of  claim 46 , or  
 (ii) a sheet-like base substrate having an electronic component embedded therein and a circuit pattern on a circuit formation face thereof, with this circuit pattern and an electrode of this electronic component being electrically interconnected; and  
   disposing an insulating protective sheet on superposed front and back faces.    
   
   
       48 . An electronic component-mounted component, comprising: 
 a sheet-like base substrate; and    an electronic component embedded in said sheet-like base substrate by pressing said electronic component into said sheet-like base substrate, said electronic component having an electrode exposed from a surface of said sheet-like base substrate by performing at least one of polishing processing and plasma discharge processing.    
   
   
       49 . The electronic component-mounted component according to  claim 48 , further comprising: 
 a circuit component formed by forming a conductive film on said electrode exposed from said surface of said sheet-like base substrate.    
   
   
       50 . An apparatus for manufacturing an electronic component-mounted component, comprising: 
 an electronic component feeding apparatus for feeding a sheet-like base substrate and an electronic component;    a vertical inverting apparatus for sucking the electronic component and then inverting the electronic component vertically;    an electronic component mounting apparatus for mounting the electronic component onto the sheet-like base substrate;    an electronic component embedding apparatus for embedding the electronic component in the sheet-like base substrate; and    an electrode exposing apparatus for exposing an electrode of the electronic component from a surface of the sheet-like base substrate by performing at least one of plasma discharge processing and polishing processing.