Electronic circuit device and method of manufacturing the same

Abstract

An electronic component having connection terminals on one side thereof is bonded to a circuit board via an adhesive sheet having through-holes. The connection terminals on the electronic component are connected to electrode pads provided on the circuit board via a conductive adhesive in the through-holes. Thus, an electronic circuit device is formed. Using a polymeric resin film sheet for the circuit board and mounting an electronic component, e.g. an LSI, onto the circuit board can provide a small, light, thin, and inexpensive electronic circuit device.

1 - 7 . (canceled)  
     
     
         8 . A method of manufacturing an electronic circuit device, comprising: 
 bonding an adhesive sheet to a circuit board so that a through-hole, through said adhesive sheet, is aligned with an electrode pad provided on a surface of said circuit board;    providing a conductive adhesive in said through-hole; and    bonding a connection terminal, provided on one side of an electronic component, to said electrode pad on said circuit board via said conductive adhesive in said through-hole, and bonding said electronic component to said adhesive sheet.    
     
     
         9 . The method according to  claim 8 , wherein said adhesive sheet is one of a thermosetting resin sheet and a thermoplastic resin sheet.  
     
     
         10 . The method according to  claim 8 , wherein said conductive adhesive consists essentially of conductive particles and a thermosetting resin binder, and said adhesive sheet includes a thermosetting resin, with said thermosetting resin being such that it begins to cure at a lower temperature than does said thermosetting resin binder.