Modified plating solution for plating and planarization and process utilizing same

Abstract

A modified plating solution that can be used to electroplate a high quality conductive material that can be effectively polished and planarized includes (1) a solvent, (2) an ionic species of the conductive material to be deposited, (3) at least one additive to improve electrical and structural properties, and (4) a modifying agent.

What is claimed is:  
     
         1 . A process of depositing and simultaneously polishing and planarizing a high quality conductive layer on a surface of a substrate, comprising: 
 loading a substrate on a holder;    applying electrical power to the surface of the said substrate;    introducing a plating solution comprising an oxidizer on an abrasive polishing pad;    pressing the abrasive polishing pad against the surface of said substrate;    contacting the plating solution with the surface of the substrate and a second electrode;    applying a potential difference between the surface of the substrate and the second electrode;    depositing a conductive layer on the surface of the substrate; and    moving the abrasive pad and the surface of the substrate with respect to each other, thereby simultaneously polishing and planarizing the conductive layer on said substrate.    
     
     
         2 . A process according to  claim 1 , wherein the conductive layer comprises copper.  
     
     
         3 . A process according to  claim 1 , wherein the plating solution comprises an acidic copper plating solution.  
     
     
         4 . A process according to  claim 3 , wherein the acidic copper plating solution has a pH value of less than 4.  
     
     
         5 . A process according to  claim 1 , wherein said oxidizer is selected from the group consisting of an inorganic oxidizer, an organic oxidizer, and mixtures thereof.  
     
     
         6 . A process according to  claim 5 , wherein the oxidizer is an organic nitrite.  
     
     
         7 . A process according to  claim 6 , wherein the nitrite is selected from the group consisting of alkyl nitrites, aromatic nitrites, and polyaromatic nitrites.  
     
     
         8 . A process according to  claim 7 , wherein the organic nitrite is an alkyl nitrite.  
     
     
         9 . A process according to  claim 8 , wherein the alkyl nitrite is butyl nitrite.  
     
     
         10 . A process according to  claim 1 , wherein the oxidizer is an organic nitrate.  
     
     
         11 . A process according to  claim 1 , wherein the substrate comprises surface features having a width of about 10-100 microns.  
     
     
         12 . A modified plating solution for simultaneous polishing and planarization of a substrate, comprising: 
 a solvent;    an ionic species of a conductive material; and    an oxidizer.    
     
     
         13 . A modified plating solution according to  claim 12 , wherein said oxidizer is selected from the group consisting of an inorganic oxidizer, an organic oxidizer, and mixtures thereof.  
     
     
         14 . A modified plating solution according to  claim 12 , wherein said oxidizer is an organic nitrite selected from the group consisting of alkyl nitrites, aromatic nitrites, and polyaromatic nitrites.  
     
     
         15 . A modified plating solution according to  claim 12 , wherein said solution has a pH value of less than 4.  
     
     
         16 . A modified plating solution according to  claim 12 , wherein said oxidizer is present in an amount of more than 500 ppm.  
     
     
         17 . A modified plating solution according to  claim 12 , wherein said oxidizer is present in an amount of 0.01 to 10 wt. % of said solution.  
     
     
         18 . A modified plating solution according to  claim 12 , wherein said conductive metal is Cu.  
     
     
         19 . A modified plating solution according to  claim 12 , wherein said conductive metal is selected from the group consisting of W, Au, Ni, Pt, Pd, Ag, Co, Sn, Pb and their alloys.  
     
     
         20 . A modified plating solution according to  claim 12 , further comprising at least one additive selected from the group consisting of levelers, brighteners, grain refiners, wetting agents, and stress-reducing agents.