Inventor · disambiguated record
Homayoun Talieh
Also filed as: TALIEH HOMAYOUN
104 granted patents·29 pending applications·6,930 citations·filing 1994–2020
99Inventor score
Top patents by PatentIndex Score
133 records- 0199US7172497B2Fabrication of semiconductor interconnect structuresASM NUTOOL INC·Filed 2002·Granted Feb 6, 2007·551 cites·16 claims
- 0299US7147766B2Chip interconnect and packaging deposition methods and structuresASM NUTOOL INC·Filed 2003·Granted Dec 12, 2006·554 cites·30 claims
- 0399US7129165B2Method and structure to improve reliability of copper interconnectsASM NUTOOL INC·Filed 2004·Granted Oct 31, 2006·559 cites·21 claims
- 0499US6497800B1Device providing electrical contact to the surface of a semiconductor workpiece during metal platingNUTOOL INC·Filed 2000·Granted Dec 24, 2002·144 cites·18 claims
- 0599US6413388B1Pad designs and structures for a versatile materials processing apparatusNUTOOL INC·Filed 2000·Granted Jul 2, 2002·191 cites·52 claims
- 0699US6176992B1Method and apparatus for electro-chemical mechanical depositionNUTOOL INC·Filed 1998·Granted Jan 23, 2001·664 cites·50 claims
- 0798US7491308B2Method of making rolling electrical contact to wafer front surfaceNOVELLUS SYSTEMS INC·Filed 2005·Granted Feb 17, 2009·18 cites·19 claims
- 0898US6413403B1Method and apparatus employing pad designs and structures with improved fluid distributionNUTOOL INC·Filed 2000·Granted Jul 2, 2002·93 cites·22 claims
- 0998US5692947ALinear polisher and method for semiconductor wafer planarizationONTRAK SYSTEMS INC·Filed 1996·Granted Dec 2, 1997·249 cites·10 claims
- 1098US5558568AWafer polishing machine with fluid bearingsONTRAK SYSTEMS INC·Filed 1994·Granted Sep 24, 1996·204 cites·17 claims
- 1197US6867136B2Method for electrochemically processing a workpieceNUTOOL INC·Filed 2002·Granted Mar 15, 2005·141 cites·32 claims
- 1297US6610190B2Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrateNUTOOL INC·Filed 2001·Granted Aug 26, 2003·65 cites·42 claims
- 1397US6471847B2Method for forming an electrical contact with a semiconductor substrateNUTOOL INC·Filed 2001·Granted Oct 29, 2002·113 cites·16 claims
- 1497US6402925B2Method and apparatus for electrochemical mechanical depositionNUTOOL INC·Filed 2000·Granted Jun 11, 2002·134 cites·32 claims
- 1597US6355153B1Chip interconnect and packaging deposition methods and structuresNUTOOL INC·Filed 1999·Granted Mar 12, 2002·206 cites·11 claims
- 1697US5593344AWafer polishing machine with fluid bearings and drive systemsONTRAK SYSTEMS INC·Filed 1994·Granted Jan 14, 1997·154 cites·25 claims
- 1796US6942780B2Method and apparatus for processing a substrate with minimal edge exclusionASM NUTOOL INC·Filed 2003·Granted Sep 13, 2005·45 cites·32 claims
- 1896US6630059B1Workpeice proximity plating apparatusNUTOOL INC·Filed 2000·Granted Oct 7, 2003·92 cites·30 claims
- 1996US6482307B2Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishingNUTOOL INC·Filed 2000·Granted Nov 19, 2002·126 cites·28 claims
- 2096US6328872B1Method and apparatus for plating and polishing a semiconductor substrateNUTOOL INC·Filed 1999·Granted Dec 11, 2001·207 cites·50 claims
- 2196US5650039AChemical mechanical polishing apparatus with improved slurry distributionAPPLIED MATERIALS INC·Filed 1994·Granted Jul 22, 1997·124 cites·4 claims
- 2296US5575707APolishing pad cluster for polishing a semiconductor waferONTRAK SYSTEMS INC·Filed 1994·Granted Nov 19, 1996·134 cites·15 claims
- 2395US6902659B2Method and apparatus for electro-chemical mechanical depositionASM NUTOOL INC·Filed 2002·Granted Jun 7, 2005·73 cites·37 claims
- 2495US6478936B1Anode assembly for plating and planarizing a conductive layerNUTOOL INC·Filed 2000·Granted Nov 12, 2002·46 cites·53 claims
- 2595US6409904B1Method and apparatus for depositing and controlling the texture of a thin filmNUTOOL INC·Filed 1999·Granted Jun 25, 2002·170 cites·30 claims
- 2695US6251235B1Apparatus for forming an electrical contact with a semiconductor substrateNUTOOL INC·Filed 1999·Granted Jun 26, 2001·138 cites·21 claims
- 2795US6207572B1Reverse linear chemical mechanical polisher with loadable housingNUTOOL INC·Filed 2000·Granted Mar 27, 2001·47 cites·20 claims
- 2895US6103628AReverse linear polisher with loadable housingNUTOOL INC·Filed 1998·Granted Aug 15, 2000·108 cites·18 claims
- 2994US6780772B2Method and system to provide electroplanarization of a workpiece with a conducting material layerNUTOOL INC·Filed 2001·Granted Aug 24, 2004·73 cites·16 claims
- 3094US6352623B1Vertically configured chamber used for multiple processesNUTOOL INC·Filed 1999·Granted Mar 5, 2002·131 cites·66 claims
- 3193US6852630B2Electroetching process and systemASM NUTOOL INC·Filed 2001·Granted Feb 8, 2005·73 cites·23 claims
- 3293US6837979B2Method and apparatus for depositing and controlling the texture of a thin filmASM NUTOOL INC·Filed 2002·Granted Jan 4, 2005·60 cites·9 claims
- 3393US6676822B1Method for electro chemical mechanical depositionNUTOOL INC·Filed 2000·Granted Jan 13, 2004·53 cites·31 claims
- 3493US6666959B2Semiconductor workpiece proximity plating methods and apparatusNUTOOL INC·Filed 2001·Granted Dec 23, 2003·50 cites·11 claims
- 3593US6354916B1Modified plating solution for plating and planarization and process utilizing sameNU TOOL INC·Filed 2000·Granted Mar 12, 2002·87 cites·18 claims
- 3693US5938504ASubstrate polishing apparatusAPPLIED MATERIALS INC·Filed 1995·Granted Aug 17, 1999·75 cites·35 claims
- 3792US6908374B2Chemical mechanical polishing endpoint detectionNUTOOL INC·Filed 2002·Granted Jun 21, 2005·43 cites·29 claims
- 3892US5944582AChemical mechanical polishing with a small polishing padAPPLIED MATERIALS INC·Filed 1997·Granted Aug 31, 1999·59 cites·13 claims
- 3991US6958114B2Method and apparatus for forming an electrical contact with a semiconductor substrateASM NUTOOL INC·Filed 2002·Granted Oct 25, 2005·37 cites·28 claims
- 4091US6857947B2Advanced chemical mechanical polishing system with smart endpoint detectionASM NUTOOL INC·Filed 2003·Granted Feb 22, 2005·43 cites·49 claims
- 4190US7198551B2Substrate polishing apparatusAPPLIED MATERIALS INC·Filed 2005·Granted Apr 3, 2007·9 cites·16 claims
- 4289US6248398B1Coater having a controllable pressurized process chamber for semiconductor processingAPPLIED MATERIALS INC·Filed 1996·Granted Jun 19, 2001·90 cites·10 claims
- 4388US11315569B1Transcription and analysis of meeting recordingsMEMORIA INC·Filed 2020·Granted Apr 26, 2022·42 cites·31 claims
- 4488US7329335B2Device providing electrical contact to the surface of a semiconductor workpiece during processingNOVELLUS SYSTEMS INC·Filed 2003·Granted Feb 12, 2008·11 cites·8 claims
- 4588US6722946B2Advanced chemical mechanical polishing system with smart endpoint detectionNUTOOL INC·Filed 2002·Granted Apr 20, 2004·26 cites·19 claims
- 4687US6179690B1Substrate polishing apparatusAPPLIED MATERIALS INC·Filed 1999·Granted Jan 30, 2001·41 cites·11 claims
- 4787US5934979AChemical mechanical polishing apparatus using multiple polishing padsAPPLIED MATERIALS INC·Filed 1997·Granted Aug 10, 1999·43 cites·17 claims
- 4886US6974769B2Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallizationASM NUTOOL INC·Filed 2003·Granted Dec 13, 2005·42 cites·15 claims
- 4985US6939206B2Method and apparatus of sealing wafer backside for full-face electrochemical platingASM NUTOOL INC·Filed 2002·Granted Sep 6, 2005·33 cites·48 claims
- 5085US6905588B2Packaging deposition methodsASM NUTOOL INC·Filed 2001·Granted Jun 14, 2005·12 cites·7 claims
Showing the top 50 of 133 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Homayoun Talieh files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →