US2002076537A1PendingUtilityA1

Laminated structure

31
Assignee: UNIPAC OPTOELECTRONICS CORPPriority: Dec 16, 2000Filed: Aug 1, 2001Published: Jun 20, 2002
Est. expiryDec 16, 2020(expired)· nominal 20-yr term from priority
Inventors:Ling-Yi ChuangLi-Chang Lu
H05K 3/321Y10T428/24983H05K 2201/10674Y10T29/49144H05K 2201/0133Y10T428/24802Y10T29/49126Y10T428/24917H05K 3/102H05K 2203/1189H05K 2201/10977H10W 74/15H10W 72/07331H10W 72/073H10W 72/072H10W 72/241H10W 72/354H10W 72/255H10W 72/223H10W 72/245H10W 72/235H10W 72/252H10W 72/30
31
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Claims

Abstract

A first substrate, a second substrate, an intermediate and a plurality of particles form a laminated structure. The first substrate has a first conjunction portion and a second conjunction portion, and the second substrate has a third conjunction portion and a fourth conjunction portion which are characterized by a first hardness. The intermediate is disposed between the first substrate and the second substrate. The particles provided with a second hardness greater than the first hardness are coated on the third conjunction portion to contact the first conjunction portion and coated on the fourth conjunction portion to contact the second conjunction portion. A height difference with reference to the base surface of the second substrate exists between the end surface of the third conjunction portion and the end surface of the fourth conjunction portion. A height difference that exists between the fourth conjunction portion and the third conjunction portion can be compensated for by the particles embedded in the fourth conjunction portion. Thus the bridging of the third conjunction portion and the first conjunction portion can be uniformly performed by the particles located between the two.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A laminated structure, comprising: 
 a first substrate having a first conjunction portion;    a second substrate having a third conjunction portion which is provided with a first hardness;    an intermediate disposed between the first substrate and the second substrate; and    a plurality of particles provided with a second hardness greater than the first hardness, disposed on the third conjunction portion for contacting the first conjunction portion.    
     
     
         2 . The laminated structure as claimed in  claim 1 , wherein the first substrate comprises a second conjunction portion and the second substrate comprises a fourth conjunction portion which is provided with the first hardness, and the particles are disposed on the fourth conjunction portion for contacting the second conjunction portion.  
     
     
         3 . The laminated structure as claimed in  claim 2 , wherein the third conjunction and the fourth conjunction are two bumps protruding from the second substrate.  
     
     
         4 . The laminated structure as claimed in  claim 2 , wherein the particles are coated on the third conjunction and the fourth conjunction.  
     
     
         5 . The laminated structure as claimed in  claim 1 , wherein the particles are coated on the third conjunction.  
     
     
         6 . The laminated structure as claimed in  claim 1 , wherein the particles are partially made of conductive material.  
     
     
         7 . The laminated structure as claimed in  claim 1 , wherein the particles are made of nickel and the first conjunction portion is made of gold.  
     
     
         8 . The laminated structure as claimed in  claim 1 , wherein the intermediate is made of rubber.  
     
     
         9 . A laminated structure, comprising: 
 a first substrate having a first conjunction portion and a second conjunction portion;    a second substrate having a third conjunction portion and a fourth conjunction portion which provide a first hardness;    an intermediate disposed between the first substrate and the second substrate; and    a plurality of particles provided with a second hardness greater than the first hardness, disposed on the third conjunction portion for contacting the first conjunction portion and disposed on the fourth conjunction portion for contacting the second conjunction portion.    
     
     
         10 . The laminated structure as claimed in  claim 9 , wherein the third conjunction and the fourth conjunction are two bumps protruding from the second substrate.  
     
     
         11 . The laminated structure as claimed in  claim 9 , wherein the particles are coated on the third conjunction and the fourth conjunction.  
     
     
         12 . The laminated structure as claimed in  claim 9 , wherein the particles are partially made of conductive material.  
     
     
         13 . The laminated structure as claimed in  claim 9 , wherein the particles are made of nickel and the first conjunction portion is made of gold.  
     
     
         14 . The laminated structure as claimed in  claim 9 , wherein the intermediate is made of rubber.  
     
     
         15 . A method for forming a laminated structure by connecting a first substrate to a second substrate with a plurality of particles and an intermediate, the first substrate having a first conjunction portion and a second conjunction portion and the second substrate having a third conjunction portion and a fourth conjunction portion, comprising the steps of: 
 applying the particles on the third conjunction portion and the fourth conjunction portion;    applying the intermediate between the first substrate and the second substrate;    bringing the first substrate and the second substrate close to each other to clamp the intermediate between; and    contacting the particles located on the third conjunction portion and the fourth conjunction portion on the first conjunction portion and the second conjunction portion.    
     
     
         16 . The method for forming a laminated structure as claimed in  claim 15 , wherein the third conjunction and the fourth conjunction are two bumps protruded from the second substrate.  
     
     
         17 . The method for forming a laminated structure as claimed in  claim 15 , wherein the third conjunction portion and the fourth conjunction portion are provided with the first hardness, and the particles are provided with a second hardness greater than the first hardness.  
     
     
         18 . The method for forming a laminated structure as claimed in  claim 15 , wherein the particles are partially made of conductive material.  
     
     
         19 . The method for forming a laminated structure as claimed in  claim 15 , wherein the particles are made of nickel and the first conjunction portion are made of gold.  
     
     
         20 . The method for forming a laminated structure as claimed in  claim 15 , wherein the intermediate is made of rubber.

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