Inventor · disambiguated record
Ling-Yi Chuang
Also filed as: CHUANG LING-YI
19 granted patents·16 pending applications·8 citations·filing 2001–2024
87Inventor score
Files withCHANGXIN MEMORY TECH INC30AU OPTOELECTRONIC CORP1AU OPTRONICS CORP1CHUANG LING YI1CXMT CORP1
Top patents by PatentIndex Score
35 records- 0185US12426280B2Semiconductor structure with increased number of stacked memory dies and method of manufacturing the sameCHANGXIN MEMORY TECH INC·Filed 2023·Granted Sep 23, 2025·2 cites·20 claims
- 0284US11973045B2Semiconductor structure and method for forming sameCHANGXIN MEMORY TECH INC·Filed 2022·Granted Apr 30, 2024·1 cites·16 claims
- 0365US12374634B2Chip structure and semiconductor structure comprising auxiliary bonding region above guard ring structureCHANGXIN MEMORY TECH INC·Filed 2023·Granted Jul 29, 2025·0 cites·17 claims
- 0463US12512426B2Package structure and method for forming sameCHANGXIN MEMORY TECH INC·Filed 2022·Granted Dec 30, 2025·0 cites·5 claims
- 0560US12347765B2Semiconductor structure and method for fabricating sameCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jul 1, 2025·0 cites·15 claims
- 0658US12040298B2Packaging method and packaging structure thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jul 16, 2024·0 cites·19 claims
- 0758US2024339423A1Semiconductor packaging structure and method for forming the sameCXMT CORP·Filed 2024·Application pending·0 cites
- 0857US12424505B2Wafer warpage adjustment structure and method for manufacturing the sameCHANGXIN MEMORY TECH INC·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 0955US12431456B2Package structure including a first non-conductive layer having a greater melt viscosity than a second non-conductive layer and method for fabricating the package structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Sep 30, 2025·0 cites·16 claims
- 1054US11545468B2Wafer stacking method and wafer stacking structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jan 3, 2023·0 cites·20 claims
- 1153US12261137B2Bonding structure and method for forming the sameCHANGXIN MEMORY TECH INC·Filed 2022·Granted Mar 25, 2025·0 cites·14 claims
- 1253US11488917B1Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Nov 1, 2022·0 cites·20 claims
- 1353US2023223264A1Method for manufacturing semiconductor structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 1452US11348873B2Wafer stacking method and wafer stacking structureCHANGXIN MEMORY TECH INC·Filed 2020·Granted May 31, 2022·0 cites·16 claims
- 1551US2023413539A1Semiconductor structure and semiconductor memoryCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 1650US12211813B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jan 28, 2025·0 cites·19 claims
- 1750US11984417B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted May 14, 2024·0 cites·20 claims
- 1850US11855032B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2020·Granted Dec 26, 2023·0 cites·17 claims
- 1950US11282789B2Semiconductor structure, memory device, semiconductor device and method of manufacturing the sameCHANGXIN MEMORY TECH INC·Filed 2020·Granted Mar 22, 2022·0 cites·20 claims
- 2050US2024055399A1Semiconductor structure, method for manufacturing semiconductor structure, and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 2150US2024055408A1Semiconductor package structure and method for preparing semiconductor package structureCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 2250US2023352317A1Method for manufacturing semiconductor device and semiconductor deviceCHUANG LING YI·Filed 2022·Application pending·0 cites
- 2350US2024055333A1Semiconductor structure and method for manufacturing sameCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 2450US2024057353A1Semiconductor package structure and method for manufacturing sameCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 2549US11876064B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2020·Granted Jan 16, 2024·0 cites·18 claims
- 2649US6802930B2Method of making a laminated structureAU OPTRONICS CORP·Filed 2002·Granted Oct 12, 2004·5 cites·3 claims
- 2749US2023009114A1Method for forming semiconductor structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Application pending·0 cites
- 2849US2023011266A1Method for forming semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Application pending·0 cites
- 2948US2024055420A1Semiconductor package structure and manufacturing method thereforCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 3047US2024057349A1Semiconductor package structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 3147US2024057352A1Semiconductor structure and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 3244US11798885B2Method of fabricating copper pillar bump structure with solder supporting barrierCHANGXIN MEMORY TECH INC·Filed 2021·Granted Oct 24, 2023·0 cites·3 claims
- 3343US2021287917A1Chip molding structure, wafer level chip scale packaging structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Application pending·0 cites
- 3432US2004244906A1Laminated structureAU OPTOELECTRONIC CORP·Filed 2004·Application pending·0 cites
- 3531US2002076537A1Laminated structureUNIPAC OPTOELECTRONICS CORP·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →