Laminated structure
Abstract
A first substrate, a second substrate, an intermediate and a plurality of particles form a laminated structure. The first substrate has a first conjunction portion and a second conjunction portion, and the second substrate has a third conjunction portion and a fourth conjunction portion which are characterized by a first hardness. The intermediate is disposed between the first substrate and the second substrate. The particles provided with a second hardness greater than the first hardness are coated on the third conjunction portion to contact the first conjunction portion and coated on the fourth conjunction portion to contact the second conjunction portion. A height difference with reference to the base surface of the second substrate exists between the end surface of the third conjunction portion and the end surface of the fourth conjunction portion. A height difference that exists between the fourth conjunction portion and the third conjunction portion can be compensated for by the particles embedded in the fourth conjunction portion. Thus the bridging of the third conjunction portion and the first conjunction portion can be uniformly performed by the particles located between the two.
Claims
exact text as granted — not AI-modified1 . A method for forming a laminated structure by connecting a first substrate to a second substrate with a plurality of particles and an intermediate, the first substrate having a first conjunction portion and a second conjunction portion and the second substrate having a third conjunction portion and a fourth conjunction portion, comprising the steps of:
applying the particles on the third conjunction portion and the fourth conjunction portion, wherein a portion of the particles have a shape of a ball and another portion of the particles have a shape of a cube; applying the intermediate between the first substrate and the second substrate; bringing the first substrate and the second substrate close to each other to clamp the intermediate between; and contacting the particles located on the third conjunction portion and the fourth conjunction portion on the first conjunction portion and the second conjunction portion.
2 . The method for forming a laminated structure as claimed in claim 1 , wherein the third conjunction and the fourth conjunction are two bumps protruded from the second substrate.
3 . The method for forming a laminated structure as claimed in claim 1 , wherein the third conjunction and the fourth conjunction portion are provided with the first hardness, and the particles are provided with a second hardness greater than the first hardness.
4 . The method for forming a laminated structure as claimed in claim 1 , wherein the particles are partially made of conductive material.
5 . The method for forming a laminated structure as claimed in claim 1 , wherein the particles are made of nickel and the first conjunction portion is made of gold.
6 . The method for forming a laminated structure as claimed in claim 1 , wherein the intermediated is made of rubber.Join the waitlist — get patent alerts
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