Methods for break-in and conditioning a fixed abrasive polishing pad

Abstract

The present invention relates to methods for break-in and conditioning polishing pads containing a fixed abrasive matrix. The polishing pads are useful for chemical-mechanical polishing (CMP). The present invention also relates to a method of determining the wear rate of a fixed abrasive polishing pad.

What is claimed:  
     
         1 . A method of conditioning a fixed abrasive polishing pad, comprising: 
 a. providing a fixed abrasive polishing pad;    b. providing a conditioning element, wherein the element, comprises: an upper surface and a lower conditioning surface, comprising: abrasive particles;    c. contacting the polishing pad and conditioning element;    wherein one or both of the pad and conditioning element are in motion relative to the other.    
     
     
         2 . A method according to  claim 1 , wherein the abrasive particles are diamond particles with a diameter of from 5 to 50 microns and the density of the particles present on the conditioning surface is from about 5 to 100 particles/mm 2  of the surface.  
     
     
         3 . A method according to  claim 2 , wherein the conditioning element is a disk or a ring, the abrasive particles have a diameter of from 1 to 50 microns, and the density of the particles present on the conditioning surface is from about 20 to 80 particles/mm 2  of the surface.  
     
     
         4 . A method according to  claim 3 , wherein the conditioning element is a disk, the abrasive particles have a diameter of about 35 microns, and the density of the particles present on the conditioning surface is about 50 particles/mm 2  of the surface.  
     
     
         5 . A method according to  claim 1 , wherein a down force is applied to the conditioning element and the down force is about 0.5 to 6 lbs.  
     
     
         6 . A method according to  claim 5 , wherein the down force is about 1 to 4 lbs.  
     
     
         7 . A method according to  claim 6 , wherein the down force is about 2 lbs.  
     
     
         8 . A method according to  claim 1 , wherein the conditioning is to break-in the polishing pad and the conditioning element is swept uni-directionally across the pad 1 to 50 times.  
     
     
         9 . A method according to  claim 8 , wherein the conditioning element is swept uni-directionally across the pad 1 to 10 times.  
     
     
         10 . A method according to  claim 8 , wherein the conditioning element is swept uni-directionally across the pad until surface temperature of polishing pad during polishing is stable from run to run and within preset temperature limits is achieved during the polishing process.  
     
     
         11 . A method according to  claim 1 , wherein the conditioning is to recondition the polishing pad and the conditioning element is swept uni-directionally across the pad 1 to 10 times.  
     
     
         12 . A method according to  claim 11 , wherein the conditioning element is swept uni-directionally across the pad 1 to 5 times.  
     
     
         13 . A method according to  claim 11 , wherein the conditioning element is swept uni-directionally across the pad until surface temperature of polishing pad during polishing is stable from run to run and within preset temperature limits is achieved during the polishing process.  
     
     
         14 . A method according to  claim 1 , wherein from 0.2 to 3.0 microns of polishing pad are removed by the conditioning element.  
     
     
         15 . A method according to  claim 14 , wherein from 1.5 to 3.0 microns of polishing pad are removed by the conditioning element.  
     
     
         16 . A method according to  claim 1 , wherein: 
 the conditioning element is a disk, the abrasive particles are diamond particles with a diameter of about 35 microns, and the density of the particles present on the conditioning surface is about 50 particles/mm 2  of the surface;    a down force is applied to the conditioning element and the down force is about 2 lbs;    the conditioning is to recondition the polishing pad and the conditioning element is swept uni-directionally across the pad 1 to 5 times; and, from 1.5 to 3.0 microns of the polishing pad are removed by the conditioning element.    
     
     
         17 . A method according to  claim 1 , wherein the fixed abrasive polishing pad has a surface roughness of about 0.5 to 1.0 μm after contact with the conditioning element.  
     
     
         18 . A method according to  claim 1 , wherein the fixed abrasive polishing pad has a Peak-Valley distance of about 1 to 20 μm after contact with the conditioning element.