US2002198356A1PendingUtilityA1

Novel heterobifunctional monomers and uses therefor

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Assignee: LOCTITEPriority: Feb 7, 2001Filed: Jul 22, 2002Published: Dec 26, 2002
Est. expiryFeb 7, 2021(expired)· nominal 20-yr term from priority
C08F 32/08C07D 207/448H05K 1/032H05K 1/0313C08G 61/08C08F 232/08C08G 61/02
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Claims

Abstract

In accordance with the present invention, there are provided novel heterobifunctional monomers and uses for the same. Invention compounds have many of the properties required by the microelectronics industry, such as, for example, hydrophobicity, high T g values, low dielectric constant, ionic purity, low coefficient of thermal expansion (CTE), and the like. These properties result in a thermoset that is particularly well suited to high performance applications where typical operating temperatures are often significantly higher than those at which prior art materials were suitable. Invention compounds are particularly ideal for use in the manufacture of electronic components, such as, for example, printed circuit boards, and the like.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A polymer comprising a plurality of norbornyl-containing heterobifunctional monomers, wherein said polymer has performance properties which render it suitable for use in the manufacture of electronic components.  
     
     
         2 . A polymer according to  claim 1  wherein said polymer has excellent moisture resistance.  
     
     
         3 . A polymer according to  claim 1  wherein said polymer has excellent ionic purity.  
     
     
         4 . A polymer according to  claim 1  wherein said polymer has low dielectric constant.  
     
     
         5 . A polymer according to  claim 1  wherein said polymer has good thermal properties.  
     
     
         6 . A polymer according to  claim 1  wherein said polymer is hydrophobic.  
     
     
         7 . A polymer according to  claim 1  wherein said polymer has high Tg.  
     
     
         8 . A polymer according to  claim 1  wherein said polymer has a low coefficient of thermal expansion.  
     
     
         9 . A polymer according to  claim 1  wherein said polymer is used for the manufacture of electronic components.  
     
     
         10 . A polymer according to  claim 9  wherein said electronic component is a printed circuit board.

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