Method for processing specimens, an apparatus therefor and a method of manufacture of a magnetic head
Abstract
A method of processing specimens, an apparatus therefor, and a method of manufacture of a magnetic head are provided wherein a complicated conventional post processing step for removing corrosion products is eliminated by a corrosion prevention processing for removing only a residual chlorine compound produced in the gas plasma etching. More specifically, the method is comprised of the steps of: forming a lamination film including a seed layer made of NiFe alloy, an upper magnetic pole made of NiFe alloy connected to the seed layer, a gap layer made of oxide film in close contact with the seed layer, and a shield layer made of NiFe alloy in close contact with the gap layer; plasma-etching the seed layer with a gas which contains chlorine using the upper magnetic pole as a mask; and after that removing the residual chlorine compound by a plasma post treatment with a gas plasma which contains H2O or methanol.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of processing a specimen comprising the steps of:
a first step of etching a specimen of lamination film formed on a substrate using a gas plasma which contains chlorine in an etching chamber at a temperature below 200° C. of the specimen, said lamination film including at least one layer of NiFe alloy or NiFeCo alloy; and a second step of plasma post processing for removing a residual chlorine compound deposited on a surface of said lamination film which is exposed by said first step using a gas plasma which contains H 2 O or methanol under pressure of 50 Pa or more, and at a temperature below 200° C. of the specimen.
2 . A method of processing a specimen according to claim 1 , wherein said gas plasma is produced using at least one selected from the group consisting of Cl2, BC13, Ar and O2, or in combination therebetween.
3 . A method of processing a specimen according to claim 1 , wherein said lamination film further includes at least one of the following, which is to be processed by gas plasma etching in said processing chamber,
(A) a photo resist layer, (B) an alumina (Al2O3) layer, (C) a silicon oxide layer, (D) a Cu layer, (E) a Ta layer, and (F) a Cr layer.
4 . A method of processing a specimen according to claim 1 , wherein said substrate is a sintered substrate composed of A1203 and TiC, and a layer of NiFe alloy is formed on said substrate, which is subjected to a gas plasma etching in a process chamber.
5 . A method of manufacture of a magnetic head having an upper magnetic pole and a lower magnetic pole disposed opposite to each other, and having a resist processing of multiple layers including said upper and lower magnetic poles, comprising the steps of:
forming a lamination film which includes an upper photo resist layer, a hard mask layer comprising SiO2 or alumina, a lower photo resist layer, and a seed layer which comprises a NiFe alloy or NiFeCo alloy; etching said hard mask layer by plasma etching using said upper photo resist layer as a mask; forming a deep groove by plasma etching said lower photo resist layer using a gas which includes chlorine and using said hard mask as a mask so as to expose said seed layer in the bottom of said deep groove; removing a residual chlorine compound deposited on a surface of the seed layer which is exposed, by a plasma post processing using a gas plasma which contains H2O or methanol; then, embedding a NiFe alloy into said deep groove to make contact with said seed layer for providing said upper magnetic pole.
6 . A method of manufacture of a magnetic head having an upper magnetic pole and a lower magnetic pole disposed opposite to each other, including a method of processing a seed layer of the magnetic head, said method comprising the steps of:
forming a lamination film which includes: a seed layer composed of a NiFe alloy or NiFeCo alloy; an upper magnetic layer of an NiFe alloy in close contact with said seed layer; a gap layer of an oxide film in close contact with said seed layer; and a shield layer of an NiFe alloy in close contact with said gap layer; plasma etching said seed layer with a plasma gas which contains chlorine using the upper magnetic pole as its mask; then removing a residual chlorine compound by a plasma post treatment with a gas plasma which contains H2O or methanol.
7 . A method of manufacture of a magnetic head having an upper magnetic pole and a lower magnetic pole disposed opposite to each other, including a method of forming a gap of said magnetic head, said method comprising the steps of:
forming a lamination film which includes: a seed layer of NiFe alloy or NiFeCo alloy; an upper magnetic pole of NiFe alloy which is connected to said seed layer; a gap layer of oxide film in close contact with the seed layer; and a shield layer of NiFe alloy in close contact with the gap layer; etch-processing the seed layer; etching the gap layer by plasma processing with a gas which contains chlorine gas, and using the upper magnetic pole as its mask; and after that removing a residual chlorine compound by a plasma post treatment using a gas plasma which contains H2O or methanol.
8 . A method of manufacture of a magnetic head having an upper magnetic pole and a lower magnetic pole disposed opposite to each other, including a method of trimming the magnetic head, comprising the steps of:
forming a lamination film which includes a seed layer of NiFe alloy, and upper magnetic pole of NiFe alloy connected to said seed layer, a gap layer of oxide film in close contact with the seed layer, and a shield layer of NiFe alloy in close contact with the gap layer; etching the seed layer; etching the gap layer; trim-etching the shield layer by plasma processing with a gas which contains chlorine using the upper magnetic pole as a mask; and after that removing a residual chlorine compound by a plasma post treatment with a gas plasma which contains H2O or methanol.
9 . A method of manufacture of a magnetic head having an upper magnetic pole and a lower magnetic pole disposed opposite to each other, comprising the steps of:
forming a lamination film which includes a seed layer of NiFe alloy, an upper magnetic pole of NiFe alloy connected to said seed layer, a gap layer of oxide film which is in close contact with the seed layer, and a shield layer of NiFe alloy which is in close contact with the gap layer; subjecting said seed layer, said gap layer and said shield layer to plasma etching sequentially using said upper magnetic pole as a mask; and removing a residual chlorine compound deposited on an exposed surface by a plasma post treatment using a gas plasma which contains H2O or methanol.
10 . A method of manufacture of a magnetic head according to claim 9 , wherein said gap layer is etched with a gas plasma which contains chlorine or fluoride gas, and wherein said seed layer and said shield layer are etched with a gas plasma which contains chlorine and argon gases.
11 . A processing apparatus for etching a specimen which is laminated on a substrate comprising:
an etching process unit which is supplied with a gas and produces a plasma, for etching a lamination film which includes at least one layer of NiFe alloy or NiFeCo alloy layers formed on the substrate using a gas plasma which contains chlorine gas in an etching chamber at a temperature below 200° C. of the specimen; and a plasma post treatment unit for removing a residual chlorine compound deposited on an exposed surface of said layer of NiFe alloy exposed due to said etching by a gas plasma which contains 1120 or methanol, under a pressure of 50 Pa or more, and at a temperature below 200° C. of the specimen.
12 . A processing apparatus according to claim 9 , further comprising:
an atmospheric loader; a vacuum transport chamber having a vacuum transport robot therein; and unload and load lock chambers which connect between said atmospheric loader and said vacuum transport chamber, and through which a specimen is delivered, wherein said vacuum transport chamber is connected to an etching chamber of said etching process unit; wherein said atmospheric loader is connected to a plasma post treatment chamber of said plasma post treatment unit.
13 . A processing apparatus according to claim 11 , wherein a plurality of etching process chambers are provided.
14 . A processing apparatus according to claims 11 or 12 , wherein a plurality of plasma post treatment chambers are provided.Join the waitlist — get patent alerts
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