Inventor · disambiguated record
Saburou Kanai
Also filed as: KANAI SABUROU
23 granted patents·9 pending applications·516 citations·filing 1996–2009
96Inventor score
Top patents by PatentIndex Score
32 records- 0197US6388382B1Plasma processing apparatus and methodHITACHI LTD·Filed 2000·Granted May 14, 2002·78 cites·40 claims
- 0295US6646233B2Wafer stage for wafer processing apparatus and wafer processing methodHITACHI HIGH TECH CORP·Filed 2002·Granted Nov 11, 2003·89 cites·2 claims
- 0393US7138606B2Wafer processing methodHITACHI HIGH TECH CORP·Filed 2003·Granted Nov 21, 2006·53 cites·12 claims
- 0492US6756737B2Plasma processing apparatus and methodHITACHI LTD·Filed 2002·Granted Jun 29, 2004·37 cites·4 claims
- 0590US6895179B2Wafer stage for wafer processing apparatusHITACHI HIGH TECH CORP·Filed 2003·Granted May 17, 2005·37 cites·5 claims
- 0689US6825617B2Semiconductor processing apparatusHITACHI HIGH TECH CORP·Filed 2003·Granted Nov 30, 2004·37 cites·11 claims
- 0789US6677167B2Wafer processing apparatus and a wafer stage and a wafer processing methodHITACHI HIGH TECH CORP·Filed 2002·Granted Jan 13, 2004·39 cites·24 claims
- 0886US7833429B2Plasma processing methodHITACHI HIGH TECH CORP·Filed 2007·Granted Nov 16, 2010·7 cites·4 claims
- 0983US6716301B2Semiconductor manufacturing apparatus and method of processing semiconductor wafer using plasma, and wafer voltage probeHITACHI LTD·Filed 2001·Granted Apr 6, 2004·25 cites·23 claims
- 1080US7608162B2Plasma processing apparatus and methodHITACHI LTD·Filed 2007·Granted Oct 27, 2009·4 cites·7 claims
- 1179US8062473B2Plasma processing apparatus and methodNISHIO RYOJI·Filed 2008·Granted Nov 22, 2011·4 cites·3 claims
- 1279US6172321B1Method and apparatus for plasma processing apparatusHITACHI LTD·Filed 1999·Granted Jan 9, 2001·26 cites·4 claims
- 1377US6034346AMethod and apparatus for plasma processing apparatusHITACHI LTD·Filed 1996·Granted Mar 7, 2000·27 cites·11 claims
- 1476US6759338B2Plasma processing apparatus and methodHITACHI LTD·Filed 2001·Granted Jul 6, 2004·9 cites·5 claims
- 1569US6491832B2Method for processing specimensHITACHI LTD·Filed 2000·Granted Dec 10, 2002·12 cites·4 claims
- 1668US6649021B2Apparatus and method for plasma processing high-speed semiconductor circuits with increased yieldHITACHI LTD·Filed 2001·Granted Nov 18, 2003·9 cites·5 claims
- 1765US6914207B2Plasma processing methodHITACHI HIGH TECH CORP·Filed 2003·Granted Jul 5, 2005·6 cites·7 claims
- 1863US7740739B2Plasma processing apparatus and methodHITACHI HIGH TECH CORP·Filed 2004·Granted Jun 22, 2010·5 cites·9 claims
- 1960US8795467B2Plasma processing apparatus and methodNISHIO RYOJI·Filed 2009·Granted Aug 5, 2014·0 cites·4 claims
- 2057US7288166B2Plasma processing apparatusHITACHI LTD·Filed 2003·Granted Oct 30, 2007·6 cites·6 claims
- 2155US2008011425A1Plasma Processing Apparatus And MethodNISHIO RYOJI·Filed 2007·Application pending·0 cites
- 2254US6867144B2Apparatus and method for plasma processing high-speed semiconductor circuits with increased yieldHITACHI LTD·Filed 2002·Granted Mar 15, 2005·3 cites·1 claims
- 2351US7183715B2Method for operating a semiconductor processing apparatusHITACHI HIGH TECH CORP·Filed 2004·Granted Feb 27, 2007·2 cites·18 claims
- 2448US6413876B1Method for plasma processing high-speed semiconductor circuits with increased yieldHITACHI LTD·Filed 2001·Granted Jul 2, 2002·1 cites·3 claims
- 2543US2004173314A1Plasma processing apparatus and methodFiled 2003·Application pending·0 cites
- 2642US2004040933A1Wafer processing apparatus and a wafer stage and a wafer processing methodFiled 2003·Application pending·0 cites
- 2742US2004149384A1Semiconductor manufacturing apparatus and method of processing semiconductor wafer using plasma, and wafer voltage probeFiled 2003·Application pending·0 cites
- 2838US2004040662A1Plasma processing method and apparatus for etching nonvolatile materialFiled 2002·Application pending·0 cites
- 2938US2003052079A1Method for processing specimens, an apparatus therefor and a method of manufacture of a magnetic headFiled 2002·Application pending·0 cites
- 3037US2003160024A1Plasma processing method and apparatusFiled 2002·Application pending·0 cites
- 3137US2004045813A1Wafer processing apparatus, wafer stage, and wafer processing methodFiled 2002·Application pending·0 cites
- 3236US2002079057A1Apparatus for processing specimensFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →