Protective film for the fabrication of direct build-up layers on an encapsulated die package

Abstract

A present invention includes a packaging technology that fabricates build-up layers on an encapsulated microelectronic die that has expanded area larger than that of the microelectronic die. An active surface of a microelectronic die is attached by an adhesive material to a protective film sheet to protect the active surface and to control the position of the microelectronic die during an encapsulation process. The protective film sheet has adhesive material substantially only in an area where the microelectronic die and/or a microelectronic package core are attached, or has the adhesive properties of the adhesive material diminished or eliminated in areas where an encapsulation material will be applied.

What is claimed is:  
     
         1 . A method of fabricating a microelectronic package, comprising: 
 providing a protective film including a protective film sheet having a first surface with at least one discrete adhesive material area patterned on said protective film sheet first surface;    abutting an active surface of at least one microelectronic die against said at least one discrete adhesive material area, said microelectronic die; and    encapsulating said at least one microelectronic die with an encapsulation material, wherein said encapsulation material provides at least one surface of said encapsulation material substantially planar to said microelectronic die active surface.    
     
     
         2 . The method of  claim 1 , further including: 
 removing said protective film; and    forming at least one build-up layer on said microelectronic die active surface.    
     
     
         3 . The method of  claim 2 , where said forming at least one build-up layer comprising: 
 forming at least one dielectric material layer on at least a portion of said microelectronic die active surface and said encapsulation material surface;    forming a via through said at least one dielectric material layer to expose a portion of said microelectronic die active surface; and    forming at least one conductive trace on said at least one dielectric material layer which extends into said via to electrically contact said microelectronic die active surface.    
     
     
         4 . A method of fabricating a microelectronic package, comprising: 
 providing a protective film including a protective film sheet having a first surface with at least one discrete first adhesive material area and a second adhesive area patterned on said protective film sheet first surface;    abutting an active surface of said at least one microelectronic die against said at least one first discrete adhesive material area;    abutting a microelectronic package core against said second adhesive area; and    disposing an encapsulation material between said at least one microelectronic die and said microelectronic package core, wherein said encapsulation material and said microelectronic package core provides a surface substantially planar to said microelectronic die active surface.    
     
     
         5 . The method of  claim 4 , further including: 
 removing said protective film; and    forming at least one build-up layer on said microelectronic die active surface.    
     
     
         6 . The method of  claim 5 , where said forming at least one build-up layer comprising: 
 forming at least one dielectric material layer on at least a portion of said microelectronic die active surface and said encapsulation material surface;    forming a via through said at least one dielectric material layer to expose a portion of said microelectronic die active surface; and    forming at least one conductive trace on said at least one dielectric material layer which extends into said via to electrically contact said microelectronic die active surface.    
     
     
         7 . A method of fabricating a microelectronic package, comprising: 
 providing a protective film including a protective film sheet having a first surface with an adhesive material distributed across said protective film sheet first surface;    abutting an active surface of at least one microelectronic die against said adhesive material, said microelectronic die;    diminishing adhesive properties of the adhesive material in portions thereof not covered by said active surface of said at least one microelectronic die; and    encapsulating said at least one microelectronic die with an encapsulation material, wherein said encapsulation material provides at least one surface of said encapsulation material substantially planar to said microelectronic die active surface.    
     
     
         8 . The method of  claim 7 , further including: 
 removing said protective film; and    forming at least one build-up layer on said microelectronic die active surface.    
     
     
         9 . The method of  claim 8 , where said forming at least one build-up layer comprising: 
 forming at least one dielectric material layer on at least a portion of said microelectronic die active surface and said encapsulation material surface;    forming a via through said at least one dielectric material layer to expose a portion of said microelectronic die active surface; and    forming at least one conductive trace on said at least one dielectric material layer which extends into said via to electrically contact said microelectronic die active surface.    
     
     
         10 . The method of  claim 7 , wherein diminishing adhesive properties of the adhesive material comprises disposing a release layer on said adhesive material in portions thereof not covered nor to be covered by said active surface of said at least one microelectronic die.  
     
     
         11 . The method of  claim 10 , wherein disposing a release layer comprises disposing carnauba wax on said adhesive material in portions thereof not covered nor to be covered by said active surface of said at least one microelectronic die.  
     
     
         12 . The method of  claim 10 , wherein disposing a release layer comprises disposing a patterned protective sheet on said adhesive material in portions thereof not covered nor to be covered by said active surface of said at least one microelectronic die.  
     
     
         13 . The method of  claim 7 , wherein diminishing adhesive properties of the adhesive material comprises exposing said adhesive material in portions thereof not covered nor to be covered by said active surface of said at least one microelectronic die to ultraviolet radiation.  
     
     
         14 . The method of  claim 7 , wherein diminishing adhesive properties of the adhesive material comprises disposing a wetting agent on said adhesive material in portions thereof not covered nor to be covered by said active surface of said at least one microelectronic die.  
     
     
         15 . The method of  claim 7 , wherein diminishing adhesive properties of the adhesive material comprises disposing a surfactant on said adhesive material in portions thereof not covered nor to be covered by said active surface of said at least one microelectronic die.  
     
     
         16 . A method of fabricating a microelectronic package, comprising: 
 providing a protective film including a protective film sheet having a first surface with at least one discrete first adhesive material area and a second adhesive area patterned on said protective film sheet first surface;    abutting an active surface of said at least one microelectronic die against said at least one first discrete adhesive material area;    abutting a microelectronic package core against said second adhesive area;    diminishing adhesive properties of the adhesive material in portions thereof not covered by said active surface of said at least one microelectronic die; and    disposing an encapsulation material between said at least one microelectronic die and said microelectronic package core, wherein said encapsulation material and said microelectronic package core provides a surface substantially planar to said microelectronic die active surface.    
     
     
         17 . The method of  claim 16 , further including: 
 removing said protective film; and    forming at least one build-up layer on said microelectronic die active surface.    
     
     
         18 . The method of  claim 17 , where said forming at least one build-up layer comprising: 
 forming at least one dielectric material layer on at least a portion of said microelectronic die active surface and said encapsulation material surface;    forming a via through said at least one dielectric material layer to expose a portion of said microelectronic die active surface; and    forming at least one conductive trace on said at least one dielectric material layer which extends into said via to electrically contact said microelectronic die active surface.    
     
     
         19 . The method of  claim 16 , wherein diminishing adhesive properties of the adhesive material comprises disposing a release layer on said adhesive material in portions thereof not covered nor to be covered by said active surface of said at least one microelectronic die.  
     
     
         20 . The method of  claim 19 , wherein disposing a release layer comprises disposing carnauba wax on said adhesive material in portions thereof not covered nor to be covered by said active surface of said at least one microelectronic die.  
     
     
         21 . The method of  claim 19 , wherein disposing a release layer comprises disposing a patterned protective sheet on said adhesive material in portions thereof not covered nor to be covered by said active surface of said at least one microelectronic die.  
     
     
         22 . The method of  claim 19 , wherein diminishing adhesive properties of the adhesive material comprises exposing said adhesive material in portions thereof not covered nor to be covered by said active surface of said at least one microelectronic die to ultraviolet radiation.  
     
     
         23 . The method of  claim 16 , wherein diminishing adhesive properties of the adhesive material comprises disposing a wetting agent on said adhesive material in portions thereof not covered nor to be covered by said active surface of said at least one microelectronic die.  
     
     
         24 . The method of  claim 16 , wherein diminishing adhesive properties of the adhesive material comprises disposing a surfactant on said adhesive material in portions thereof not covered nor to be covered by said active surface of said at least one microelectronic die.  
     
     
         25 . A protective film, comprising: 
 a protective film sheet having a first surface; and    at least one discrete adhesive material area patterned on said first surface of said protective film sheet, wherein said at least one discrete patterned adhesive material is adapted to receive an active surface of a microelectronic die.    
     
     
         26 . The protective film of  claim 25 , wherein said protective film sheet comprising a polyimide film.  
     
     
         27 . A protective film, comprising: 
 a protective film sheet having a first surface; and    at least one discrete adhesive material first area patterned on said first surface of said protective film sheet, wherein said at least one discrete patterned adhesive material is adapted to receive an active surface of a microelectronic die; and    a second adhesive material area patterned on said first surface of said protective film sheet, wherein said at second adhesive material is adapted to receive a microelectronic package core.    
     
     
         28 . The protective film of  claim 27 , wherein said protective film sheet comprising a polyimide film.  
     
     
         29 . An intermediate structure, comprising: 
 a protective film sheet having a first surface;    an adhesive material area patterned on said first surface of said protective film sheet;    at least one microelectronic die disposed on said adhesive material; and    said adhesive material having diminished adhesive properties in at least one area not covered by said at least one microelectronic die.    
     
     
         30 . The protective film of  claim 29 , wherein said protective film sheet comprising a polyimide film.  
     
     
         31 . An intermediate structure, comprising: 
 a protective film sheet having a first surface;    an adhesive material area patterned on said first surface of said protective film sheet;    at least one microelectronic die disposed on said adhesive material    a microelectronic package core disposed on said adhesive material; and    said adhesive material having diminished adhesive properties in at least one area not covered by said at least one microelectronic die and said microelectronic package core.    
     
     
         32 . The protective film of  claim 31 , wherein said protective film sheet comprising a polyimide film.  
     
     
         33 . The protective film according to  claim 25 , wherein the at least one discrete adhesive material has a thickness between about 20 μtm and about 75 μm.  
     
     
         34 . The protective film according to  claim 27 , wherein the at least one discrete adhesive material has a thickness between about 20 μm and about 75 μm.  
     
     
         35 . The intermediate structure according to  claim 29 , further including: 
 an encapsulation material, wherein the encapsulation material provides at least one surface that is substantially planar to the microelectronic die; and    a microelectronic package core disposed on the adhesive material.    
     
     
         36 . The intermediate structure according to  claim 29 , the microelectronic die further including a back surface that is opposite the first surface, the intermediate structure further including: 
 an encapsulation material, wherein the encapsulation material provides a surface that is substantially planar to the microelectronic die first surface, and wherein the encapsulation material encapsulates the back surface.    
     
     
         37 . The intermediate structure according to  claim 29 , further including: 
 a microelectronic package core disposed on the adhesive material.    
     
     
         38 . The intermediate structure according to  claim 31 , wherein the protective film is a metallic film.  
     
     
         39 . A protective film comprising: 
 a protective film sheet;    an adhesive material disposed against the protective film; and    a release layer patterned only in an area where an encapsulation material will be applied.    
     
     
         40 . The protective film according to  claim 39 , wherein the release layer has a thickness that is less than or equal to about 20 μm.  
     
     
         41 . The protective film according to  claim 39 , wherein the release layer is selected from a liquid and caranuba wax.  
     
     
         42 . The protective film according to  claim 39 , wherein the protective film is a metallic film.