Inventor · disambiguated record
Paul A. Koning
Also filed as: KONING PAUL · KONING PAUL A · KONING PAUL ALAN
52 granted patents·6 pending applications·1,121 citations·filing 1991–2014
99Inventor score
Top patents by PatentIndex Score
58 records- 0194US6926955B2Phase change material containing fusible particles as thermally conductive fillerINTEL CORP·Filed 2002·Granted Aug 9, 2005·45 cites·15 claims
- 0293US7168484B2Thermal interface apparatus, systems, and methodsINTEL CORP·Filed 2003·Granted Jan 30, 2007·84 cites·15 claims
- 0393US6787899B2Electronic assemblies with solidified thixotropic thermal interface materialINTEL CORP·Filed 2002·Granted Sep 7, 2004·24 cites·29 claims
- 0493US6597575B1Electronic packages having good reliability comprising low modulus thermal interface materialsINTEL CORP·Filed 2002·Granted Jul 22, 2003·90 cites·20 claims
- 0593US6489185B1Protective film for the fabrication of direct build-up layers on an encapsulated die packageINTEL CORP·Filed 2000·Granted Dec 3, 2002·81 cites·24 claims
- 0693US6469381B1Carbon-carbon and/or metal-carbon fiber composite heat spreaderINTEL CORP·Filed 2000·Granted Oct 22, 2002·73 cites·17 claims
- 0792US6981380B2Thermoelectric cooling for microelectronic packages and diceINTEL CORP·Filed 2002·Granted Jan 3, 2006·51 cites·19 claims
- 0891US7294394B2Phase change material containing fusible particles as thermally conductive fillerINTEL CORP·Filed 2005·Granted Nov 13, 2007·18 cites·6 claims
- 0991US6365973B1Filled solderINTEL CORP·Filed 1999·Granted Apr 2, 2002·82 cites·19 claims
- 1090US7169650B2Semi-solid metal injection methods for electronic assembly thermal interfaceINTEL CORP·Filed 2004·Granted Jan 30, 2007·16 cites·25 claims
- 1189US7279362B2Semiconductor wafer coat layers and methods thereforINTEL CORP·Filed 2005·Granted Oct 9, 2007·18 cites·8 claims
- 1288US7960019B2Phase change material containing fusible particles as thermally conductive fillerINTEL CORP·Filed 2007·Granted Jun 14, 2011·19 cites·12 claims
- 1388US7180174B2Nanotube modified solder thermal intermediate structure, systems, and methodsINTEL CORP·Filed 2003·Granted Feb 20, 2007·38 cites·17 claims
- 1486US8193072B2Semiconductor wafer coat layers and methods thereforLI ERIC J·Filed 2010·Granted Jun 5, 2012·9 cites·9 claims
- 1586US6837306B2Carbon-carbon and/or metal-carbon fiber composite heat spreadersINTEL CORP·Filed 2001·Granted Jan 4, 2005·33 cites·5 claims
- 1685US7473995B2Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assemblyINTEL CORP·Filed 2002·Granted Jan 6, 2009·39 cites·12 claims
- 1785US7036573B2Polymer with solder pre-coated fillers for thermal interface materialsINTEL CORP·Filed 2002·Granted May 2, 2006·27 cites·8 claims
- 1884US7311967B2Thermal interface material and electronic assembly having such a thermal interface materialINTEL CORP·Filed 2001·Granted Dec 25, 2007·28 cites·28 claims
- 1983US7252877B2Polymer matrices for polymer solder hybrid materialsINTEL CORP·Filed 2003·Granted Aug 7, 2007·18 cites·28 claims
- 2082US6924027B2Phase change thermal interface materials including exfoliated clayINTEL CORP·Filed 2003·Granted Aug 2, 2005·24 cites·28 claims
- 2181US7794623B2Microelectronic device having liquid crystalline epoxy resinsINTEL CORP·Filed 2008·Granted Sep 14, 2010·6 cites·10 claims
- 2281US6974723B2Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materialsINTEL CORP·Filed 2004·Granted Dec 13, 2005·25 cites·3 claims
- 2380US7195951B2Carbon-carbon and/or metal-carbon fiber composite heat spreadersINTEL CORP·Filed 2004·Granted Mar 27, 2007·21 cites·6 claims
- 2480US6841867B2Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materialsINTEL CORP·Filed 2002·Granted Jan 11, 2005·24 cites·19 claims
- 2579US8703286B2Polymer matrices for polymer solder hybrid materialsJAYARAMAN SAIKUMAR·Filed 2011·Granted Apr 22, 2014·5 cites·12 claims
- 2679US7897486B2Semiconductor wafer coat layers and methods thereforINTEL CORP·Filed 2007·Granted Mar 1, 2011·7 cites·7 claims
- 2778US7059048B2Wafer-level underfill process making use of sacrificial contact pad protective materialINTEL CORP·Filed 2002·Granted Jun 13, 2006·18 cites·7 claims
- 2877US7846778B2Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assemblyINTEL CORP·Filed 2002·Granted Dec 7, 2010·24 cites·7 claims
- 2977US6813153B2Polymer solder hybridINTEL CORP·Filed 2002·Granted Nov 2, 2004·23 cites·22 claims
- 3076US7534650B2Carbon-carbon and/or metal-carbon fiber composite heat spreaderINTEL CORP·Filed 2006·Granted May 19, 2009·5 cites·11 claims
- 3172US7619318B2No-flow underfill composition and methodINTEL CORP·Filed 2005·Granted Nov 17, 2009·4 cites·13 claims
- 3271US7456052B2Thermal intermediate apparatus, systems, and methodsINTEL CORP·Filed 2003·Granted Nov 25, 2008·14 cites·4 claims
- 3370US6982492B2No-flow underfill composition and methodINTEL CORP·Filed 2003·Granted Jan 3, 2006·14 cites·12 claims
- 3469US7136275B2Polymeric dielectric material for high-energy density capacitorsINTEL CORP·Filed 2002·Granted Nov 14, 2006·11 cites·35 claims
- 3567US9247686B2Polymer matrices for polymer solder hybrid materialsINTEL CORP·Filed 2014·Granted Jan 26, 2016·1 cites·17 claims
- 3666US7331500B2Solder bumps formation using solder paste with shape retaining attributeINTEL CORP·Filed 2004·Granted Feb 19, 2008·10 cites·11 claims
- 3765US7967942B2Polymer matrices for polymer solder hybrid materialsINTEL CORP·Filed 2007·Granted Jun 28, 2011·2 cites·3 claims
- 3864US8129223B2Nanotube modified solder thermal intermediate structure, systems, and methodsKONING PAUL A·Filed 2007·Granted Mar 6, 2012·2 cites·20 claims
- 3963US7408787B2Phase change thermal interface materials including polyester resinINTEL CORP·Filed 2003·Granted Aug 5, 2008·10 cites·18 claims
- 4059US5080978APoly(vinylalkylether)-containing hot-melt adhesives for polyethylene and polypropyleneAMOCO CORP·Filed 1991·Granted Jan 14, 1992·18 cites·7 claims
- 4157US7530164B2Wafer-level underfill process making use of sacrificial contact pad protective materialINTEL CORP·Filed 2006·Granted May 12, 2009·1 cites·15 claims
- 4257US6020455AVinyl cyclohexanediol containing resin compositionsBP AMOCO CORP·Filed 1998·Granted Feb 1, 2000·13 cites·6 claims
- 4356US7417111B2Liquid crystalline epoxy resinsINTEL CORP·Filed 2004·Granted Aug 26, 2008·3 cites·11 claims
- 4455US7365414B2Component packaging apparatus, systems, and methodsINTEL CORP·Filed 2003·Granted Apr 29, 2008·4 cites·3 claims
- 4554US7985627B2Thermal intermediate apparatus, systems, and methodsINTEL CORP·Filed 2008·Granted Jul 26, 2011·3 cites·5 claims
- 4654US7816171B2Component packaging apparatus, systems, and methodsINTEL CORP·Filed 2007·Granted Oct 19, 2010·0 cites·5 claims
- 4752US5525426APoly(vinylalkylether)-containing hot-melt adhesives for polyethylene and polypropyleneAMOCO CORP·Filed 1994·Granted Jun 11, 1996·12 cites·10 claims
- 4852US2007119582A1Thermal interface apparatus, systems, and methodsINTEL CORP·Filed 2007·Application pending·0 cites
- 4950US7126215B2Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resistINTEL CORP·Filed 2004·Granted Oct 24, 2006·2 cites·31 claims
- 5049US6480370B1Polymeric dielectric material for high-energy density capacitorsINTEL CORP·Filed 1999·Granted Nov 12, 2002·12 cites·15 claims
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →