Thermal interface apparatus, systems, and methods

Abstract

An apparatus and system, as well as fabrication methods therefor, may include a thermal interface material comprised of an array of carbon nanotubes and a buffer layer disposed between the thermal interface material and one of a die or a heat spreader. In some embodiments the carbon nanotubes may be formed above a buffer layer formed above a surface of the head spreader.

1 . A method, comprising: 
 coupling a heat source to a first surface of an array of substantially aligned carbon nanotubes;    interposing a layer between at least one of either the heat source or a heat sink and at least one of either the first or a second surface of the array of carbon nanotubes; and    coupling a surface of the heat sink to the second surface of the array of carbon nanotubes.    
     
     
         2 . The method of  claim 1 , wherein coupling a surface of the heat sink to the second surface of the thermal interface material comprises forming a layer on the heat sink and growing the array of substantially aligned carbon nanotubes on the layer.  
     
     
         3 . The method of  claim 1 , wherein coupling the heat source to a first surface of an array of substantially aligned carbon nanotubes comprises applying an adhesion promoting layer between the heat source and the array of carbon nanotubes.  
     
     
         4 . The method of  claim 1 , also comprising bonding the other surface of the heat source to a substrate.  
     
     
         5 . A method, comprising: 
 growing an array of substantially aligned carbon nanotubes from a surface of a heat sink; and    contacting the surface of a die with free ends of some of the carbon nanotubes of the array of carbon nanotubes.    
     
     
         6 . The method of  claim 5  also comprising forming an adhesion layer on the surface of the die.  
     
     
         7 . The method of  claim 5  also comprising forming an adhesion layer on some of the carbon nanotubes of the array of carbon nanotubes.  
     
     
         8 . A method, comprising: 
 coupling a heat sink to a first surface of an array of carbon nanotubes;    applying an adhesion promoting coating to at least one of either the surface of a heat source or some of the carbon nanotubes of the array of carbon nanotubes; and    coupling the heat source to a second surface of the array of carbon nanotubes.    
     
     
         9 . The method of  claim 8 , wherein applying an adhesion promoting coating comprises applying a metal.  
     
     
         10 . The method of  claim 8 , wherein applying an adhesion promoting coating to some of the carbon nanotubes of the array of carbon nanotubes comprises sputtering a metal coating on the carbon nanotubes  
     
     
         11 . The method of  claim 8 , wherein applying an adhesion layer to the heat sink comprises applying a chemical adhesion promoting layer.