Electroplater and method

Abstract

A method for rinsing a substrate held by a substrate holder in an electroplater includes positioning at least a first portion of the substrate holder and an electroplating bath in the electroplater relative to one another such that the substrate and the first portion of the substrate holder are removed from the electroplating bath. A retractable shutter in the electroplater is closed to where the closed retractable shutter is located between the first portion of the substrate holder and the electroplating bath as positioned. The substrate is rinsed with a solution wherein the closed retractable shutter prevents substantially all of the solution from entering into the electroplating bath.

What is claimed is:  
     
         1 . A method for rinsing a substrate held by a substrate holder in an electroplater, comprising: 
 positioning at least a first portion of the substrate holder and an electroplating bath in the electroplater relative to one another such that the substrate and the first portion of the substrate holder are removed from the electroplating bath;    closing a retractable shutter in the electroplater, wherein the closed retractable shutter is located between the first portion of the substrate holder and the electroplating bath as positioned; and    rinsing the substrate with a first solution wherein the closed retractable shutter prevents substantially all of the solution from entering into the electroplating bath.    
     
     
         2 . The method of  claim 1 , wherein rinsing the substrate with a first solution further comprises pre-rinsing the substrate prior to electroplating.  
     
     
         3 . The method of  claim 2  further comprising post-rinsing the substrate with a second solution subsequent to electroplating.  
     
     
         4 . The method of  claim 3 , wherein the first solution and the second solution comprise the same solution.  
     
     
         5 . The method of  claim 3 , wherein the first solution and the second solution comprise different solutions.  
     
     
         6 . The method of  claim 1 , wherein rinsing the substrate with a first solution further comprises post-rinsing the substrate subsequent to electroplating.  
     
     
         7 . The method of  claim 1  further comprising drying the rinsed substrate.  
     
     
         8 . The method of  claim 1 , wherein the substrate comprises a semiconductor device.  
     
     
         9 . A method of cleaning, comprising: 
 positioning at least a first portion of a substrate holder and an electroplating bath in an electroplater relative to one another such that the first portion of the substrate holder is removed from the electroplating bath;    closing a retractable shutter in the electroplater, wherein the closed retractable shutter is located between the first portion of the substrate holder and the electroplating bath as positioned; and    rinsing the substrate holder with a first solution, wherein the closed retractable shutter prevents substantially all of the solution from entering into the electroplating bath.    
     
     
         10 . The method of  claim 9 , wherein rinsing the substrate holder further comprises pre-rinsing the substrate holder prior to electroplating.  
     
     
         11 . The method of  claim 9 , wherein a substrate is held by the substrate holder and the method further comprises pre-rinsing the substrate with a second solution prior to electroplating.  
     
     
         12 . The method of  claim 11  further comprising post-rinsing the substrate with a third solution subsequent to electroplating.  
     
     
         13 . The method of  claim 12 , wherein the first solution, the second solution, and the third solution comprise the same solution.  
     
     
         14 . The method of  claim 12 , wherein the first solution, the second solution, and the third solution comprise different solutions.  
     
     
         15 . An electroplater, comprising: 
 an electroplating bath;    a substrate holder operable to hold a substrate in the electroplating bath during electroplating of the substrate;    a first nozzle operable to dispense a first solution; and    a retractable shutter in the electroplater, wherein the retractable shutter is operable to be opened or closed, wherein when the retractable shutter is closed, it is located between at least a first portion of the substrate holder and the electroplating bath as positioned.    
     
     
         16 . The electroplater of  claim 15  further comprising a spin-rinse dryer operable to dry the substrate holder and the substrate.  
     
     
         17 . The electroplater of  claim 15 , wherein the first nozzle is operable to pre-rinse the substrate prior to electroplating with the first solution and wherein the system further comprises a second nozzle operable to post-rinse the substrate subsequent to electroplating with a second solution.  
     
     
         18 . The electroplater of  claim 15 , wherein the first nozzle is operable to dispense the first solution when the retractable shutter is closed.  
     
     
         19 . The electroplater of  claim 15 , wherein the first nozzle is operable to dispense a second solution different from the first solution.  
     
     
         20 . The electroplater of  claim 15 , wherein the system further comprises a drain coupled to the retractable shutter, wherein the retractable shutter is operable to deflect substantially all of the first solution to the drain.