Semiconductor device, and a method of producing semiconductor device

Abstract

A method for manufacturing a semiconductor device including providing first and second semiconductor chips each having a main surface having a semiconductor element and a plurality of external terminals, and a lower surface respectively opposing the main surface. A first lead frame is provided which has a frame body which supports outer portions and inner portions extending from the outer portions, and a second lead frame is provided which has a frame body which supports outer portions and inner portions extending from the outer portions. After electrically connecting the external terminals to the inner portions of the lead frames and resin-sealing the first and second semiconductor chips so that the first and second lead frames are superimposed, the frame body of the second lead frame is removed and a first processing fluid is applied to the outer portions of the first lead frame and the second lead frame.

What is claimed:  
     
         1 . A method of manufacturing a semiconductor device comprising the steps of: 
 providing first and second semiconductor chips each having a main surface comprising a semiconductor element and a plurality of external terminals, and a lower surface respectively opposing the main surface,    providing a first lead frame comprising a frame body which supports outer portions and inner portions extending from the outer portions, and a second lead frame comprising a frame body which supports outer portions and inner portions extending from the outer portions,    electrically connecting the plurality of external terminals of the first semiconductor chip to the inner portions of the first lead frame;    electrically connecting the plurality of external terminals of the second semiconductor chip to the inner portions of the second lead frame,    resin-sealing the first semiconductor chip and the second semiconductor chip so that the first lead frame and the second lead frame are superimposed,    removing the frame body of the second lead frame,    after the step of removing the frame body of the second lead frame, applying a first processing fluid to the outer portions of the first lead frame and the second lead frame, and    after the step of the first applying processing fluid, removing the frame body of the first lead frame.    
     
     
         2 . A method of manufacturing a semiconductor device according to  claim 1 , further comprising a step of applying a second processing fluid to the outer portions of the first lead frame and the second lead frame after the step of applying the first processing fluid.  
     
     
         3 . A method of manufacturing a semiconductor device according to  claim 2 , in the step of applying the first processing fluid, plating the outer portions of the first lead frame and the second lead frame.  
     
     
         4 . A method of manufacturing a semiconductor device according to  claim 3 , wherein the second processing fluid is alkaline processing fluid.  
     
     
         5 . A method of manufacturing a semiconductor device according to  claim 2 , in the step of applying the second processing fluid, plating the outer portions of the first lead frame and the second lead frame.  
     
     
         6 . A method of manufacturing a semiconductor device according to  claim 5 , in the step of applying the first processing fluid, etching surfaces of the outer portions of the first lead frame and the second lead frame.