Inventor · disambiguated record
Youichi Kawata
Also filed as: KAWATA YOUICHI
4 granted patents·2 pending applications·286 citations·filing 1999–2006
82Inventor score
Top patents by PatentIndex Score
6 records- 0196US6479322B2Semiconductor device with two stacked chips in one resin body and method of producingHITACHI LTD·Filed 2002·Granted Nov 12, 2002·158 cites·1 claims
- 0294US6551858B2Method of producing a semiconductor device having two semiconductor chips sealed by a resinHITACHI LTD·Filed 2002·Granted Apr 22, 2003·97 cites·9 claims
- 0367US6410365B1Semiconductor device with two stacked chips in one resin body and method of producingHITACHI LTD·Filed 1999·Granted Jun 25, 2002·27 cites·4 claims
- 0464US8119050B2Method of manufacturing a semiconductor deviceKURATOMI BUNSHI·Filed 2005·Granted Feb 21, 2012·4 cites·8 claims
- 0545US2006216867A1Method of manufacturing a semiconductor deviceKAWATA YOUICHI·Filed 2006·Application pending·0 cites
- 0638US2003153134A1Semiconductor device, and a method of producing semiconductor deviceFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →