Modular semiconductor die package and method of manufacturing thereof

Abstract

A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.

What is claimed is:  
     
         1 . A semiconductor die package comprising: 
 a polymer comprising a lower surface and an upper surface, the upper surface for mounting at least one semiconductor die;    a polymer cap operatively secured over at least a portion of the upper surface of the base forming a cavity, the cap having a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the upper surface of the base and the light transmissive member; and    a plurality of conductive leads extending through the base from the lower surface of the base to the cavity.    
     
     
         2 . A matrix of semiconductor die packages comprising: 
 a base matrix comprising a plurality of polymer bases, each base comprising a surface for mounting at least one semiconductor die;    a cap matrix comprising a plurality of polymer caps operatively secured over the base matrix, each base and cap combination forming a cavity, each cap having a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between the surface for mounting at least one semiconductor die of a corresponding base and the light transmissive member; and    a plurality of conductive leads extending through each base from an outside surface of each base to the corresponding cavity formed by each cap and base combination.    
     
     
         3 . A method of making a semiconductor die package comprising: 
 forming a polymer base comprising a lower surface and an upper surface, the upper surface for mounting at least one semiconductor die;    forming a polymer cap operatively secured over at least a portion of the upper surface of the base forming a cavity, the cap having a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the upper surface of the base and the light transmissive member; and    forming a plurality of conductive leads extending through the base from the lower surface of the base to the cavity.    
     
     
         4 . A method of making semiconductor die packages comprising: 
 forming a base matrix comprising a plurality of polymer bases, each base comprising a surface for mounting at least one semiconductor die;    forming a cap matrix comprising a plurality of polymer caps operatively secured over the base matrix, each base and cap combination forming a cavity, each cap having a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between the surface for mounting at least one semiconductor die of a corresponding base and the light transmissive member; and    positioning a plurality of conductive leads extending through each base from an outside surface of each base to the corresponding cavity formed by each cap and base combination.