Inventor · disambiguated record
Myoung-Soo Jeon
Also filed as: JEON MYOUNG-SOO
13 granted patents·4 pending applications·275 citations·filing 1997–2006
93Inventor score
Files withSILICON BANDWIDTH INC13CRANE STANFORD W JR1LG CABLE AND MACHINERY LTD1QUANTUM LEAP PACKAGING INC1
Top patents by PatentIndex Score
17 records- 0196US6905367B2Modular coaxial electrical interconnect system having a modular frame and electrically shielded signal paths and a method of making the sameSILICON BANDWIDTH INC·Filed 2002·Granted Jun 14, 2005·107 cites·75 claims
- 0283US7123465B2Decoupling capacitor for an integrated circuit and method of manufacturing thereofSILICON BANDWIDTH INC·Filed 2004·Granted Oct 17, 2006·30 cites·21 claims
- 0383US6700138B2Modular semiconductor die package and method of manufacturing thereofSILICON BANDWIDTH INC·Filed 2002·Granted Mar 2, 2004·27 cites·21 claims
- 0478US7070340B2High performance optoelectronic packaging assemblySILICON BANDWIDTH INC·Filed 2002·Granted Jul 4, 2006·20 cites·65 claims
- 0577US6603193B2Semiconductor packageSILICON BANDWIDTH INC·Filed 2001·Granted Aug 5, 2003·28 cites·47 claims
- 0672US6797882B1Die package for connection to a substrateSILICON BANDWIDTH INC·Filed 2001·Granted Sep 28, 2004·16 cites·29 claims
- 0765US7253365B2Die package for connection to a substrateQUANTUM LEAP PACKAGING INC·Filed 2004·Granted Aug 7, 2007·11 cites·25 claims
- 0864US6847115B2Packaged semiconductor device for radio frequency shieldingSILICON BANDWIDTH INC·Filed 2001·Granted Jan 25, 2005·13 cites·15 claims
- 0958US6803650B2Semiconductor die package having mesh power and ground planesSILICON BANDWIDTH INC·Filed 2001·Granted Oct 12, 2004·11 cites·26 claims
- 1053US7135768B2Hermetic sealSILICON BANDWIDTH INC·Filed 2001·Granted Nov 14, 2006·7 cites·32 claims
- 1147US6734546B2Micro grid array semiconductor die packageSILICON BANDWIDTH INC·Filed 2002·Granted May 11, 2004·3 cites·13 claims
- 1242US2006279904A1Decoupling capacitor for an integrated circuit and method of manufacturing thereofSILICON BANDWIDTH INC·Filed 2006·Application pending·0 cites
- 1340US2004026757A1Modular semiconductor die package and method of manufacturing thereofSILICON BANDWIDTH INC·Filed 2003·Application pending·0 cites
- 1439US2004222514A1Semiconductor die package having mesh power and ground planesSILICON BANDWIDTH INC·Filed 2004·Application pending·0 cites
- 1539US2006105636A1Modular coaxial electrical interconnect system and method of making the sameCRANE STANFORD W JR·Filed 2005·Application pending·0 cites
- 1621US6270366B1Adaptable high integrated electric interconnecting systemLG CABLE AND MACHINERY LTD·Filed 1999·Granted Aug 7, 2001·2 cites·41 claims
- 1720US6073703APin rotating tool and methodFiled 1997·Granted Jun 13, 2000·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →