Semiconductor die package having mesh power and ground planes

Abstract

A cluster grid array semiconductor die package and mating socket provide electrical connection between one or more semiconductor dies housed within the die package and substrate, such as a printed circuit board, on which the mating socket is mounted. The die package and the mating socket may be easily connected and disconnected. The die package may include power and ground planes built into and distributed within the housing of the die package.

1 - 26 . (cancelled).  
     
     
         27 . A method for manufacturing a semiconductor die package, comprising: 
 molding a package base including a plurality of side walls and a floor having a plurality of holes formed therethrough, wherein interior surfaces of the side walls and floor form a cavity sized to hold a semiconductor die and wherein said molding includes molding an electrically conductive frame into the floor, said frame having a plurality of holes formed therein and the holes through the floor register with the holes of said frame; and    inserting electrically-conductive pins into the holes in the floor such that the pins pass into the holes of the frame and extend from an exterior surface of the floor.    
     
     
         28 . The method of  claim 27 , further comprising: 
 electrically connecting a semiconductor die to the pins and to the frame; and    attaching a lid to the side walls of the base, the lid and the base sealing the semiconductor die therein.    
     
     
         29 . The method of  claim 28 , wherein said step of electrically connecting comprises: 
 coupling solder balls to the pins and to the frame and coupling the semiconductor die to the solder balls.    
     
     
         30 . The method of  claim 28 , wherein the step of electrically connecting comprises: 
 coupling solder balls to the pins and to the frame;    placing a substrate over the solder balls;    placing the semiconductor die on the substrate; and    electrically connecting the semiconductor die to the substrate.