CMP platen with patterned surface

Abstract

A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.

1 . A rotatable platen assembly, comprising a patterned surface for securing a pad thereto, the patterned surface comprising: 
 (a) one or more raised portions disposed on the patterned surface defining a mounting surface; and    (b) a recessed area defined by the one or more raised portions.    
     
     
         2 . The rotatable platen assembly of  claim 1 , wherein the recessed area comprises a plurality of grooves.  
     
     
         3 . The rotatable platen assembly of  claim 1 , wherein at least a portion of the recessed area extends to a perimeter of the rotatable platen.  
     
     
         4 . The rotatable platen assembly of  claim 1 , wherein the rotatable platen is part of a chemical mechanical polishing system.  
     
     
         5 . The rotatable platen assembly of  claim 1 , wherein the platen comprises aluminum.  
     
     
         6 . The rotatable platen assembly of  claim 1 , wherein the pad comprises polyurethane.  
     
     
         7 . The rotatable platen assembly of  claim 1 , wherein the pad comprises a plastic foam.  
     
     
         8 . An apparatus for polishing a substrate, comprising: 
 (a) a rotatable platen, comprising a patterned surface for securing a pad thereto, the patterned surface comprising: 
 (i) one or more raised portions defining a mounting surface; and  
 (ii) a recessed area defined by the one or more raised portions; and  
   (b) a pad disposed on the mounting surface.    
     
     
         9 . The apparatus of  claim 8 , further comprising a coating disposed on the patterned surface.  
     
     
         10 . The apparatus of  claim 8 , wherein the pad comprises polyurethane.  
     
     
         11 . The apparatus of  claim 8 , wherein the pad comprises a plastic foam.  
     
     
         12 . The apparatus of  claim 8 , wherein the recessed area comprises a plurality of grooves.  
     
     
         13 . The apparatus of  claim 8 , wherein at least a portion of the recessed area extends to a perimeter of the rotatable platen.  
     
     
         14 . The apparatus of  claim 8 , wherein the recessed area and the pad define a plurality of pathways.  
     
     
         15 . The apparatus of  claim 14 , wherein at least a portion of the plurality of pathways extend to a perimeter of the rotatable platen to allow fluid communication between a backside of the pad and an environment of the rotatable platen.  
     
     
         16 . A substrate polishing apparatus, comprising: 
 (a) one or more polishing stations each including a rotatable platen wherein at least one of the rotatable platen comprises a patterned surface for securing a pad thereto, the patterned surface comprising: 
 (i) one or more raised portions defining a mounting surface; and  
 (ii) a recessed area defined by the one or more raised portions; and  
   (b) one or more polishing heads rotatably mounted above the rotatable platens.    
     
     
         17 . The apparatus of  claim 16 , further comprising a pad disposed on the mounting surface.  
     
     
         18 . The apparatus of  claim 16 , further comprising a coating disposed on the patterned surface.  
     
     
         19 . The apparatus of  claim 16 , further comprising a motor coupled to the rotatable platen to selectively impart rotation.  
     
     
         20 . The apparatus of  claim 16 , wherein the recessed area comprises a plurality of grooves.