Inventor · disambiguated record
Fred C. Redeker
Also filed as: REDEKER FRED · REDEKER FRED C · REDEKER FRED CONRAD
169 granted patents·29 pending applications·7,104 citations·filing 1992–2023
99Inventor score
Top patents by PatentIndex Score
198 records- 0199US10456886B2Porous chemical mechanical polishing padsAPPLIED MATERIALS INC·Filed 2016·Granted Oct 29, 2019·26 cites·20 claims
- 0299US6220201B1High density plasma CVD reactor with combined inductive and capacitive couplingAPPLIED MATERIALS INC·Filed 1998·Granted Apr 24, 2001·202 cites·19 claims
- 0399US5944902APlasma source for HDP-CVD chamberAPPLIED MATERIALS INC·Filed 1998·Granted Aug 31, 1999·335 cites·18 claims
- 0499US5865896AHigh density plasma CVD reactor with combined inductive and capacitive couplingAPPLIED MATERIALS INC·Filed 1996·Granted Feb 2, 1999·331 cites·47 claims
- 0598US10537974B2CMP pad construction with composite material properties using additive manufacturing processesAPPLIED MATERIALS INC·Filed 2018·Granted Jan 21, 2020·17 cites·8 claims
- 0698US10493691B2Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articlesAPPLIED MATERIALS INC·Filed 2017·Granted Dec 3, 2019·16 cites·16 claims
- 0798US9873180B2CMP pad construction with composite material properties using additive manufacturing processesAPPLIED MATERIALS INC·Filed 2015·Granted Jan 23, 2018·41 cites·20 claims
- 0898US9776361B2Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articlesAPPLIED MATERIALS INC·Filed 2015·Granted Oct 3, 2017·21 cites·19 claims
- 0998US6988327B2Methods and systems for processing a substrate using a dynamic liquid meniscusLAM RES CORP·Filed 2003·Granted Jan 24, 2006·164 cites·42 claims
- 1098US6602724B2Chemical mechanical polishing of a metal layer with polishing rate monitoringAPPLIED MATERIALS INC·Filed 2001·Granted Aug 5, 2003·95 cites·14 claims
- 1198US6182602B1Inductively coupled HDP-CVD reactorAPPLIED MATERIALS INC·Filed 1997·Granted Feb 6, 2001·386 cites·20 claims
- 1298US6083344AMulti-zone RF inductively coupled source configurationAPPLIED MATERIALS INC·Filed 1997·Granted Jul 4, 2000·346 cites·18 claims
- 1397US10875145B2Polishing pads produced by an additive manufacturing processAPPLIED MATERIALS INC·Filed 2015·Granted Dec 29, 2020·17 cites·19 claims
- 1497US10821573B2Polishing pads produced by an additive manufacturing processAPPLIED MATERIALS INC·Filed 2015·Granted Nov 3, 2020·17 cites·25 claims
- 1597US10384330B2Polishing pads produced by an additive manufacturing processAPPLIED MATERIALS INC·Filed 2015·Granted Aug 20, 2019·22 cites·22 claims
- 1697US10322491B2Printed chemical mechanical polishing padAPPLIED MATERIALS INC·Filed 2015·Granted Jun 18, 2019·17 cites·17 claims
- 1797US6537144B1Method and apparatus for enhanced CMP using metals having reductive propertiesAPPLIED MATERIALS INC·Filed 2000·Granted Mar 25, 2003·145 cites·32 claims
- 1897US6379223B1Method and apparatus for electrochemical-mechanical planarizationAPPLIED MATERIALS INC·Filed 1999·Granted Apr 30, 2002·230 cites·5 claims
- 1997US6179709B1In-situ monitoring of linear substrate polishing operationsAPPLIED MATERIALS INC·Filed 1999·Granted Jan 30, 2001·181 cites·15 claims
- 2097US6170428B1Symmetric tunable inductively coupled HDP-CVD reactorAPPLIED MATERIALS INC·Filed 1996·Granted Jan 9, 2001·430 cites·26 claims
- 2197US5788799AApparatus and method for cleaning of semiconductor process chamber surfacesAPPLIED MATERIALS INC·Filed 1996·Granted Aug 4, 1998·305 cites·35 claims
- 2297US5772771ADeposition chamber for improved deposition thickness uniformityAPPLIED MATERIALS INC·Filed 1995·Granted Jun 30, 1998·176 cites·14 claims
- 2396US6739951B2Method and apparatus for electrochemical-mechanical planarizationAPPLIED MATERIALS INC·Filed 2002·Granted May 25, 2004·83 cites·26 claims
- 2496US6575177B1Semiconductor substrate cleaning systemAPPLIED MATERIALS INC·Filed 2000·Granted Jun 10, 2003·83 cites·17 claims
- 2596US6416823B2Deposition chamber and method for depositing low dielectric constant filmsAPPLIED MATERIALS INC·Filed 2000·Granted Jul 9, 2002·61 cites·24 claims
- 2696US5984769APolishing pad having a grooved pattern for use in a chemical mechanical polishing apparatusAPPLIED MATERIALS INC·Filed 1998·Granted Nov 16, 1999·142 cites·15 claims
- 2795US10086500B2Method of manufacturing a UV curable CMP polishing padAPPLIED MATERIALS INC·Filed 2014·Granted Oct 2, 2018·14 cites·16 claims
- 2895US7367345B1Apparatus and method for providing a confined liquid for immersion lithographyLAM RES CORP·Filed 2004·Granted May 6, 2008·62 cites·22 claims
- 2995US6833052B2Deposition chamber and method for depositing low dielectric constant filmsAPPLIED MATERIALS INC·Filed 2002·Granted Dec 21, 2004·65 cites·38 claims
- 3095US6589610B2Deposition chamber and method for depositing low dielectric constant filmsAPPLIED MATERIALS INC·Filed 2002·Granted Jul 8, 2003·53 cites·46 claims
- 3195US6569349B1Additives to CMP slurry to polish dielectric filmsAPPLIED MATERIALS INC·Filed 2000·Granted May 27, 2003·92 cites·5 claims
- 3295US6465051B1Method of operating high density plasma CVD reactor with combined inductive and capacitive couplingAPPLIED MATERIALS INC·Filed 1996·Granted Oct 15, 2002·221 cites·28 claims
- 3395US6070551ADeposition chamber and method for depositing low dielectric constant filmsAPPLIED MATERIALS INC·Filed 1997·Granted Jun 6, 2000·135 cites·20 claims
- 3495US5761023ASubstrate support with pressure zones having reduced contact area and temperature feedbackAPPLIED MATERIALS INC·Filed 1996·Granted Jun 2, 1998·218 cites·43 claims
- 3594US10562147B2Polishing system with annular platen or polishing pad for substrate monitoringAPPLIED MATERIALS INC·Filed 2017·Granted Feb 18, 2020·4 cites·11 claims
- 3694US7191787B1Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluidLAM RES CORP·Filed 2003·Granted Mar 20, 2007·81 cites·17 claims
- 3794US6561873B2Method and apparatus for enhanced CMP using metals having reductive propertiesAPPLIED MATERIALS INC·Filed 2002·Granted May 13, 2003·66 cites·54 claims
- 3894US6309276B1Endpoint monitoring with polishing rate changeAPPLIED MATERIALS INC·Filed 2000·Granted Oct 30, 2001·85 cites·19 claims
- 3993US11446788B2Precursor formulations for polishing pads produced by an additive manufacturing processAPPLIED MATERIALS INC·Filed 2019·Granted Sep 20, 2022·3 cites·18 claims
- 4093US7143527B2System and method for modulating flow through multiple ports in a proximity headLAM RES CORP·Filed 2005·Granted Dec 5, 2006·19 cites·20 claims
- 4192US9669512B2CMP pads having material composition that facilitates controlled conditioningAPPLIED MATERIALS INC·Filed 2014·Granted Jun 6, 2017·16 cites·26 claims
- 4292US7749689B2Methods for providing a confined liquid for immersion lithographyLAM RES CORP·Filed 2008·Granted Jul 6, 2010·13 cites·14 claims
- 4392US6796880B2Linear polishing sheet with windowAPPLIED MATERIALS INC·Filed 2003·Granted Sep 28, 2004·42 cites·22 claims
- 4492US6435942B1Chemical mechanical polishing processes and componentsAPPLIED MATERIALS INC·Filed 2000·Granted Aug 20, 2002·74 cites·19 claims
- 4591US7069937B2Vertical proximity processorLAM RES CORP·Filed 2003·Granted Jul 4, 2006·49 cites·8 claims
- 4691US6676497B1Vibration damping in a chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 2000·Granted Jan 13, 2004·33 cites·9 claims
- 4790US6585563B1In-situ monitoring of linear substrate polishing operationsAPPLIED MATERIALS INC·Filed 2000·Granted Jul 1, 2003·35 cites·16 claims
- 4890US6273806B1Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatusAPPLIED MATERIALS INC·Filed 1999·Granted Aug 14, 2001·111 cites·16 claims
- 4989US7696141B2Cleaning compound and method and system for using the cleaning compoundLAM RES CORP·Filed 2006·Granted Apr 13, 2010·10 cites·28 claims
- 5089US7153400B2Apparatus and method for depositing and planarizing thin films of semiconductor wafersLAM RES CORP·Filed 2003·Granted Dec 26, 2006·33 cites·12 claims
Showing the top 50 of 198 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →