Tool having a plurality of electrodes and corresponding method of altering a very small surface

Abstract

A micro-tool and corresponding method are disclosed herein for working a very small surface of a substrate. The micro-tool has a tip of diameter on the order of 1 mm or less for placement in close proximity to a location on a substrate to be worked, and at least two open electrodes located near an end of the tip, such that the gap between the open electrodes is on the order of a few microns or less. The micro-tool further includes a housing which holds the tip and wiring extending from the open electrodes to permit connection to a voltage source. When the electrodes of the micro-tool are connected by such wiring to a voltage, an electric field and electron emission arises between the open electrodes such that electron emission currents are established. In the corresponding method, a localized electric field is generated in close proximity to a substrate using a tool having at least two open electrodes with a gap between them on the order of a few microns or less, by applying a voltage to the open electrodes. The localized electric field and emitted electrons aid in at least one of etching and depositing a feature on the substrate surface.

What is claimed is:  
     
         1 . A micro-tool for use in finely working a surface of a substrate, comprising: 
 a tip having a diameter on the order of 1 mm or less for placement in close proximity to a location on a substrate to be worked;    at least two open electrodes located near an end of said tip, said open electrodes having a gap between them on the order of a few microns or less; and    a housing for holding said tip, said housing including wiring from said open electrodes to permit connection of said micro-tool to a voltage source;    wherein when said electrodes are connected by said wiring to a voltage, an electric field and electron emission arises between said open electrodes.    
     
     
         2 . An apparatus including the micro-tool of  claim 1 , said apparatus further including means for selectably moving said housing to place said tip in close proximity to said location.  
     
     
         3 . The apparatus of  claim 2  wherein said voltage source has a radio frequency such that when said micro-tool is connected to said voltage source while said tip is in the presence of a gas, said electric field generates a plasma.  
     
     
         4 . The micro-tool according to  claim 1  wherein said open electrodes are arranged coaxially in said tip.  
     
     
         5 . The micro-tool according to  claim 1  wherein a first of said open electrodes is arranged has a smaller diameter than a second of said open electrodes and is further arranged concentrically inside said second open electrode.  
     
     
         6 . The micro-tool according to  claim 1  wherein said open electrodes are arranged as parallel conductors in said tip.  
     
     
         7 . The micro-tool according to  claim 1  further comprising at least one channel for conducting a fluid.  
     
     
         8 . The micro-tool according to  claim 1  further comprising a plurality of channels for conducting one or more fluids.  
     
     
         9 . An plurality of micro-tools according to  claim 1 , said micro-tools being arranged in an array, so as to permit simultaneous working of a substantial portion of a surface of said substrate.  
     
     
         10 . The plurality of micro-tools according to  claim 9  wherein said voltage source has a radio frequency such that when said micro-tool is connected to said voltage source, said electric field generates a plasma.  
     
     
         11 . A method of finely working a surface of a substrate, comprising: 
 generating a localized electron emission current in close proximity to a substrate using a tool having at least two open electrodes having a gap between them on the order of a few microns or less, by applying a voltage to said open electrodes,    wherein said localized electric electron field emission current aids in at least one of etching and depositing a feature on a surface of said substrate.    
     
     
         12 . The method of  claim 11  further comprising delivering an etchant to said surface such that said surface is etched where said etchant and said localized electric field electronic emission coincide.  
     
     
         13 . The method of  claim 11  wherein said electric field is generated by a voltage source having a radio frequency.  
     
     
         14 . The method of  claim 11  further comprising generating a plurality of said localized electric fields of a substantial portion of said substrate using a plurality of said tools arranged in an array in close proximity to said substrate, so as to facilitate simultaneously working a substantial portion of said substrate.  
     
     
         15 . The method of  claim 14  wherein said localized electric fields are generated by at least one voltage source having a radio frequency.  
     
     
         16 . The method of  claim 11  further comprising delivering a fluid to said surface of said substrate through a first channel in said tool.  
     
     
         17 . The method of  claim 16  wherein molecules in said fluid are activated by said localized electric field into a reactive species.  
     
     
         18 . The method of  claim 16  further comprising delivering a second fluid to said surface of said substrate through a second channel in said tool separate from said first channel.  
     
     
         19 . The method of  claim 11  further comprising drawing a fluid away from said surface of said substrate through a channel in said tool.  
     
     
         20 . The method of  claim 19  wherein said fluid drawn away from said surface includes effluent from a reaction occurring in a volume in the vicinity of said surface.