Method and device for applying a solder to a substrate

Abstract

The invention is a method for applying a solder to a substrate by positioning it in its solid physical condition, melting it and then impacting it against a substrate by means of compressed gas. The device for applying a solder ( 7 ) to a substrate ( 10, 11 ) comprises a holder ( 1 ) having a capillary bore ( 2 ) whose diameter, at the substrate end ( 3 ), has a contraction ( 4 ) whose diameter (D2) is smaller than the diameter (D3) of the solder globule ( 7 ).

What is claimed is:  
     
         1 . A process for applying solder on a substrate comprising providing solder in a sold aggregate state, positioning solder relative to the substrate, providing an energy source, and melting the solder by activating the supply of energy, characterized in that the positioning is realized by spacing solder a predetermined distance from the substrate, and impacting the solder against the substrate by action of a compressed gas after melting of the solder.  
     
     
         2 . A process according to  claim 1 , characterized in that the melting is performed through laser energy.  
     
     
         3 . A device for applying solder onto a substrate comprising a holder having a capillary therein in which a solder ball can be positioned relative to the substrate, the end of the capillary ( 2 ) nearer the substrate having a tapered section ( 4 ), whose smallest diameter (D2) is smaller than the diameter (D3) of the solder ball ( 7 ).  
     
     
         4 . A device according to  claim 3 , characterized in that the tapered section ( 4 ) is conical from a larger diameter (D1) of the capillary ( 2 ) to a smaller discharge diameter (D2).  
     
     
         5 . A device according to  claim 3 , characterized in that a compressed gas source ( 9 ) is connected to the capillary ( 2 ).  
     
     
         6 . A device according to  claim 5 , characterized in that means is provided for the compressed gas to be activated in pulses.  
     
     
         7 . A device according to  claim 5 , characterized in that the compressed gas is an inert or protective gas.