Microelectronic adaptors, assemblies and methods

Abstract

A first microelectronic element such as a semiconductor chip is mounted to a circuit board using an adaptor which has a region extending beneath the first microelectronic element and an additional region which may be folded over the first microelectronic element or which may project laterally from the first microelectronic element. The adaptor includes a functional element in the additional region, such as a further microelectronic element or an array of terminals for mounting another element. The assembly provides the benefits of a stacked chip assembly or other mustachio module, but can be made without the need for a special prepackaged stacked chip assembly. The adaptor can be configured so that it does not materially increase the height of the first microelectronic element above the circuit board.

1 . An adaptor for use with a first microelectronic package having a bottom surface, a top surface and an array of connection elements projecting downwardly beyond the bottom surface of said package, the adaptor comprising: 
 a substrate having a first socket region with an inner surface and an outer surface, an array of socket openings extending through the substrate in said socket region, said socket openings being disposed in an array corresponding to the arrangement of connection elements on the microelectronic element, the adaptor further comprising a set of socket contacts aligned with at least some of said socket openings, said socket contacts and socket openings being arranged so that the package can be engaged with the adaptor with the bottom surface of the package confronting the inner surface of the substrate in said socket region and with the connection elements of the package engaged with the socket contacts and projecting through said socket openings beyond the outer surface of the substrate, the adaptor further including one or more functional elements electrically connected to at least some of said socket contacts.