Inventor · disambiguated record
Philip Damberg
Also filed as: DAMBERG PHILIP
39 granted patents·13 pending applications·864 citations·filing 2001–2024
98Inventor score
Top patents by PatentIndex Score
52 records- 0198US9105483B2Package-on-package assembly with wire bond viasCHAU ELLIS·Filed 2012·Granted Aug 11, 2015·60 cites·29 claims
- 0298US9041227B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2013·Granted May 26, 2015·37 cites·16 claims
- 0398US8836136B2Package-on-package assembly with wire bond viasCHAU ELLIS·Filed 2012·Granted Sep 16, 2014·84 cites·29 claims
- 0498US8404520B1Package-on-package assembly with wire bond viasCHAU ELLIS·Filed 2012·Granted Mar 26, 2013·112 cites·27 claims
- 0598US6765288B2Microelectronic adaptors, assemblies and methodsTESSERA INC·Filed 2002·Granted Jul 20, 2004·156 cites·41 claims
- 0697US8940630B2Method of making wire bond vias and microelectronic package having wire bond viasINVENSAS CORP·Filed 2013·Granted Jan 27, 2015·48 cites·32 claims
- 0793US7732912B2Semiconductor chip packages and assemblies with chip carrier unitsTESSERA INC·Filed 2006·Granted Jun 8, 2010·27 cites·40 claims
- 0893US7709968B2Micro pin grid array with pin motion isolationTESSERA INC·Filed 2004·Granted May 4, 2010·65 cites·24 claims
- 0992US9137903B2Semiconductor chip assembly and method for making sameKANG TECK-GYU·Filed 2011·Granted Sep 15, 2015·13 cites·20 claims
- 1092US7149095B2Stacked microelectronic assembliesTESSERA INC·Filed 2002·Granted Dec 12, 2006·65 cites·35 claims
- 1192US6885106B1Stacked microelectronic assemblies and methods of making sameTESSERA INC·Filed 2002·Granted Apr 26, 2005·78 cites·60 claims
- 1292US2025118705A1Package-on-package assembly with wire bond viasADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 1390US9318460B2Substrate and assembly thereof with dielectric removal for increased post heightTESSERA INC·Filed 2014·Granted Apr 19, 2016·8 cites·18 claims
- 1490US7061122B2Components, methods and assemblies for multi-chip packagesTESSERA INC·Filed 2003·Granted Jun 13, 2006·44 cites·27 claims
- 1589US9761558B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2015·Granted Sep 12, 2017·4 cites·16 claims
- 1687US8884432B2Substrate and assembly thereof with dielectric removal for increased post heightSAKUMA KAZUO·Filed 2011·Granted Nov 11, 2014·9 cites·34 claims
- 1785US12211821B2Package-on-package assembly with wire bond viasADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Jan 28, 2025·0 cites·19 claims
- 1882US8786083B2Impedance controlled packages with metal sheet or 2-layer RDLHABA BELGACEM·Filed 2010·Granted Jul 22, 2014·5 cites·29 claims
- 1982US8008785B2Microelectronic assembly with joined bond elements having lowered inductanceTESSERA RESEARCH LLC·Filed 2010·Granted Aug 30, 2011·5 cites·37 claims
- 2078US11735563B2Package-on-package assembly with wire bond viasINVENSAS LLC·Filed 2021·Granted Aug 22, 2023·0 cites·8 claims
- 2178US9252122B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2013·Granted Feb 2, 2016·2 cites·15 claims
- 2278US8410618B2Microelectronic assembly with joined bond elements having lowered inductanceHABA BELGACEM·Filed 2011·Granted Apr 2, 2013·3 cites·22 claims
- 2376US8637992B2Flip chip package for DRAM with two underfill materialsSAKUMA KAZUO·Filed 2011·Granted Jan 28, 2014·4 cites·33 claims
- 2476US7521785B2Packaged systems with MRAMTESSERA INC·Filed 2004·Granted Apr 21, 2009·23 cites·9 claims
- 2575US11189595B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2020·Granted Nov 30, 2021·0 cites·20 claims
- 2675US8890304B2Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer materialSATO HIROAKI·Filed 2011·Granted Nov 18, 2014·3 cites·21 claims
- 2765US8957520B2Microelectronic assembly comprising dielectric structures with different young modulus and having reduced mechanical stresses between the device terminals and external contactsSATO HIROAKI·Filed 2011·Granted Feb 17, 2015·2 cites·40 claims
- 2864US8951845B2Methods of fabricating a flip chip package for dram with two underfill materialsINVENSAS CORP·Filed 2014·Granted Feb 10, 2015·1 cites·20 claims
- 2963US8785790B2High strength through-substrate viasUZOH CYPRIAN EMEKA·Filed 2011·Granted Jul 22, 2014·1 cites·46 claims
- 3063US8531039B2Micro pin grid array with pin motion isolationDAMBERG PHILIP·Filed 2010·Granted Sep 10, 2013·2 cites·31 claims
- 3162US10756049B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2017·Granted Aug 25, 2020·0 cites·16 claims
- 3262US8508036B2Ultra-thin near-hermetic package based on rainierHONER KENNETH ALLEN·Filed 2007·Granted Aug 13, 2013·2 cites·15 claims
- 3360US8525338B2Chip with sintered connections to packageSATO HIROAKI·Filed 2011·Granted Sep 3, 2013·1 cites·22 claims
- 3457US9337165B2Method for manufacturing a fan-out WLP with packageTESSERA INC·Filed 2014·Granted May 10, 2016·0 cites·17 claims
- 3556US8816514B2Microelectronic assembly with joined bond elements having lowered inductanceTESSERA INC·Filed 2013·Granted Aug 26, 2014·0 cites·13 claims
- 3656US2014124565A1Microelectronic assembly with joined bond elements having lowered inductanceTESSERA INC·Filed 2014·Application pending·0 cites
- 3754US9666450B2Substrate and assembly thereof with dielectric removal for increased post heightTESSERA INC·Filed 2016·Granted May 30, 2017·0 cites·16 claims
- 3854US8981579B2Impedance controlled packages with metal sheet or 2-layer rdlTESSERA INC·Filed 2014·Granted Mar 17, 2015·0 cites·19 claims
- 3952US9716075B2Semiconductor chip assembly and method for making sameTESSERA INC·Filed 2015·Granted Jul 25, 2017·0 cites·11 claims
- 4052US2017309593A1Semiconductor chip assembly and method for making sameTESSERA INC·Filed 2017·Application pending·0 cites
- 4151US2013316501A1Ultra-thin near-hermetic package based on rainierTESSERA INC·Filed 2013·Application pending·0 cites
- 4249US2007166876A1Components, methods and assemblies for multi-chip packagesTESSERA INC·Filed 2006·Application pending·0 cites
- 4349US2016254247A1Fan-out WLP with packageTESSERA INC·Filed 2016·Application pending·0 cites
- 4449US2009071707A1Multilayer substrate with interconnection vias and method of manufacturing the sameTESSERA INC·Filed 2008·Application pending·0 cites
- 4547US2011147928A1Microelectronic assembly with bond elements having lowered inductanceTESSERA RESEARCH LLC·Filed 2009·Application pending·0 cites
- 4644US9136197B2Impedence controlled packages with metal sheet or 2-layer RDLHABA BELGACEM·Filed 2012·Granted Sep 15, 2015·0 cites·35 claims
- 4744US2004217461A1Microelectronic adaptors, assemblies and methodsTESSERA INC·Filed 2004·Application pending·0 cites
- 4841US2005167817A1Microelectronic adaptors, assemblies and methodsTESSERA INC·Filed 2005·Application pending·0 cites
- 4939US2004245617A1Dense multichip moduleTESSERA INC·Filed 2004·Application pending·0 cites
- 5038US2012286416A1Semiconductor chip package assembly and method for making sameSATO HIROAKI·Filed 2011·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →