Plating apparatus and plating method

Abstract

A plating apparatus is used for filling a fine interconnect pattern formed in a substrate with metal to form interconnects. The plating apparatus includes a cathode unit having a seal member for hermetically sealing a peripheral portion of a surface, to be plated, of the substrate and a cathode electrode which is brought into contact with the substrate to supply current to the substrate; an electrode head disposed so as to be movable toward and away from the surface to be plated and having an anode and a porous member with water retentivity at upper and lower parts of the electrode head; a pressing mechanism for pressing the porous member against the surface, to be plated, of the substrate under a desired pressure; and a driving mechanism for making a relative motion between the porous member and the substrate while the porous member and the surface, to be plated, of the substrate are brought into contact with each other.

1 . A plating apparatus comprising; 
 a substrate stage for holding a substrate;    a cathode unit having a seal member for hermetically sealing a peripheral portion of a surface, to be plated, of the substrate by contacting the peripheral portion of the surface, to be plated, of the substrate held by said substrate stage, and a cathode electrode which is brought into contact with the substrate to supply current to the substrate;    an electrode head disposed so as to face the surface, to be plated, of the substrate and be movable toward and away from the surface to be plated, and having an anode and a porous member with water retentivity at upper and lower parts of said electrode head;    a pressing mechanism for pressing said porous member against the surface, to be plated, of the substrate held by said substrate stage under a desired pressure; and    a driving mechanism for making a relative motion between said porous member and the substrate while said porous member and the surface, to be plated, of the substrate held by said substrate stage are brought into contact with each other.    
   
   
       2 . A plating apparatus according to  claim 1 , wherein said relative motion is a rotary motion.  
   
   
       3 . A plating apparatus according to  claim 1 , wherein said relative motion is a scroll motion.  
   
   
       4 . A plating apparatus according to  claim 1 , wherein the center of said porous member is displaced from the center of the substrate held by said substrate stage, and said porous member and the substrate W rotate about their respective centers.  
   
   
       5 . A plating apparatus according to  claim 1 , wherein said relative motion is a linear motion.  
   
   
       6 . A plating apparatus comprising: 
 a substrate stage for holding a substrate;    a cathode unit having a seal member for hermetically sealing a peripheral portion of a surface, to be plated, of the substrate by contacting the peripheral portion of the surface, to be plated, of the substrate held by said substrate stage, and a cathode electrode which is brought into contact with the substrate to supply current to the substrate;    an electrode head disposed so as to face the surface, to be plated, of the substrate and be movable toward and away from the surface to be plated, and having an anode and a porous member with water retentivity at upper and lower parts of said electrode head;    a pressing mechanism for pressing said porous member against the surface, to be plated, of the substrate held by said substrate stage under a desired pressure; and    a driving mechanism for making a relative motion between said porous member and the substrate held by said substrate stage so that contact and non-contact between said porous member and the surface, to be plated, of the substrate are repeated.    
   
   
       7 . A plating method comprising: 
 placing a porous member having water retentivity between a substrate and an anode;    filling a plating solution between the substrate and said anode;    making a relative motion between said porous member and the surface, to be plated, of the substrate while said porous member and the surface, to be plated, of the substrate are brought into contact with each other; and    plating the substrate by flowing current between the substrate and said anode.    
   
   
       8 . A plating method according to  claim 7 , wherein said plating is performed by starting of said flowing current within two seconds after said relative motion.  
   
   
       9 . A plating method according to  claim 8 , wherein said relative motion is a rotary motion.  
   
   
       10 . A plating method according to  claim 8 , wherein said relative motion is a scroll motion.  
   
   
       11 . A plating method according to  claim 7 , wherein the center of said porous member is displaced from the center of the substrate held by said substrate stage, and said porous member and the substrate W rotate about their respective centers.  
   
   
       12 . A plating method according to  claim 8 , wherein the center of said porous member is displaced from the center of the substrate held by said substrate stage, and said porous member and the substrate W rotate about their respective centers.  
   
   
       13 . A plating method according to  claim 7 , wherein said relative motion is a linear motion.  
   
   
       14 . A plating method according to  claim 8 , wherein said relative motion is a linear motion.  
   
   
       15 . A plating method comprising: 
 placing a porous member having water retentivity between a substrate and an anode;    filling a plating solution between the substrate and said anode;    making a relative motion between said porous member and the surface, to be plated, of the substrate so that contact and non-contact between said porous member and the surface, to be plated, of the substrate are repeated; and    plating the substrate by flowing current between the substrate and said anode.    
   
   
       16 . A plating method according to  claim 15 , wherein said plating is performed by starting of said flowing current within two seconds after said relative motion.