Inventor · disambiguated record
Keiichi Kurashina
Also filed as: KURASHINA KEIICHI
11 granted patents·10 pending applications·32 citations·filing 2004–2019
85Inventor score
Top patents by PatentIndex Score
21 records- 0187US8029653B2Electroplating apparatus and electroplating methodEBARA CORP·Filed 2007·Granted Oct 4, 2011·13 cites·7 claims
- 0283US7736474B2Plating apparatus and plating methodEBARA CORP·Filed 2005·Granted Jun 15, 2010·8 cites·4 claims
- 0359US11024520B2Substrate processing apparatusEBARA CORP·Filed 2019·Granted Jun 1, 2021·0 cites·3 claims
- 0457US7553400B2Plating apparatus and plating methodEBARA CORP·Filed 2004·Granted Jun 30, 2009·6 cites·16 claims
- 0553US7479213B2Plating method and plating apparatusEBARA CORP·Filed 2004·Granted Jan 20, 2009·4 cites·23 claims
- 0652US10141211B2Substrate processing apparatus and substrate transfer methodEBARA CORP·Filed 2017·Granted Nov 27, 2018·0 cites·11 claims
- 0749US10468274B2Substrate processing apparatusEBARA CORP·Filed 2016·Granted Nov 5, 2019·0 cites·3 claims
- 0849US9786532B2Substrate processing apparatus and method of transferring a substrateEBARA CORP·Filed 2015·Granted Oct 10, 2017·0 cites·12 claims
- 0947US9633898B2Etching liquid, etching method, and method of manufacturing solder bumpEBARA CORP·Filed 2015·Granted Apr 25, 2017·0 cites·5 claims
- 1045US7311809B2Plating apparatus for substrateEBARA CORP·Filed 2004·Granted Dec 25, 2007·1 cites·17 claims
- 1145US2009020434A1Substrate processing method and substrate processing apparatusSUSAKI AKIRA·Filed 2008·Application pending·0 cites
- 1242US2015191830A1Etching liquid, etching method, and method of manufacturing solder bumpEBARA CORP·Filed 2015·Application pending·0 cites
- 1339US2005051437A1Plating apparatus and plating methodFiled 2004·Application pending·0 cites
- 1439US2005061659A1Plating apparatus and plating methodFiled 2004·Application pending·0 cites
- 1539US2007238265A1Plating apparatus and plating methodKURASHINA KEIICHI·Filed 2006·Application pending·0 cites
- 1638US2010219078A1Plating apparatus and plating methodKURASHINA KEIICHI·Filed 2010·Application pending·0 cites
- 1736US2010163408A1Plating apparatus and plating methodKURASHINA KEIICHI·Filed 2010·Application pending·0 cites
- 1835US2020335394A1Method of manufacturing substrate and the same substrateEBARA CORP·Filed 2017·Application pending·0 cites
- 1934US9556533B2Substrate processing apparatus and substrate processing methodKURASHINA KEIICHI·Filed 2012·Granted Jan 31, 2017·0 cites·2 claims
- 2033US2015270147A1Substrate processing apparatus and resist removing unitEBARA CORP·Filed 2015·Application pending·0 cites
- 2132US2006113192A1Plating device and planting methodKURASHINA KEIICHI·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →