Plating apparatus and plating method

Abstract

A plating apparatus can form a plated film having a more uniform thickness over an entire surface of a substrate and can securely fill interconnect recesses with the metal without forming voids in the embedded metal even when the substrate has a high sheet resistance in the surface. The plating apparatus includes a substrate holder for holding a substrate, a cathode portion including a cathode for contact with the substrate held by the substrate holder to feed electricity to the substrate, and an anode, partly or wholly having a high resistance, disposed opposite a surface of the substrate held by the substrate holder, wherein plating of the surface of the substrate is carried out while filling between the anode and the substrate held by the substrate holder with a plating solution.

1 - 13 . (canceled) 
   
   
       14 . A plating apparatus comprising:
 a substrate holder for holding a substrate;   a cathode portion including a cathode for contact with the substrate held by the substrate holder to feed electricity to the substrate;   an anode disposed opposite a surface of the substrate; and   a contact member disposed between the substrate held by the substrate holder and the anode movably in a direction closer to or away from the substrate, said contact member having through-holes extending linearly through the contact member in said movement direction.   
   
   
       15 . The plating apparatus according to  claim 14  further comprising a press mechanism for pressing a contact surface, which faces the surface of the substrate held by the substrate holder, of the contact member against the surface of the substrate. 
   
   
       16 . The plating apparatus according to  claim 14 , wherein a press member for pressing the contact surface of the contact member against the surface of the substrate is disposed between the contact member and the anode. 
   
   
       17 . The plating apparatus according to  claim 14 , wherein a flexible cushioning material for uniformly pressing the contact surface of the contact member against the surface of the substrate is disposed between the contact member and the anode. 
   
   
       18 . The plating apparatus according to  claim 14 , wherein the through-holes provided in the contact member have a circular cross-sectional shape with a diameter of not more than 12 μm, and are distributed at a density of 1.0×10 5  to 1.0×10 9 /cm 2 . 
   
   
       19 . The plating apparatus according to  claim 14 , wherein the contact surface of the contact member has an Ra value, indicative of surface roughness, of not more than 1 μm. 
   
   
       20 . The plating apparatus according to  claim 14 , wherein the contact member is composed of an insulating material. 
   
   
       21 . The plating apparatus according to  claim 20 , wherein the insulating material is polycarbonate, a ceramic, carbon, polyester, glass, silicon, a resist material or a fluorocarbon resin. 
   
   
       22 . The plating apparatus according to  claim 14  further comprising an etching mechanism for etching a plated film formed on the surface of the substrate. 
   
   
       23 . The plating apparatus according to  claim 14 , wherein the through-holes provided in the contact member are tapered such that the cross-sectional area gradually decreases with distance from the contact surface. 
   
   
       24 - 58 . (canceled)